Продукція > CGB
| Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CGB4B3X6S0J225M055AB | TDK Corporation | Description: CAP CER 2.2UF 6.3V X6S 0805 Tolerance: ±20% Features: Low Profile Packaging: Tape & Reel (TR) Voltage - Rated: 6.3V Package / Case: 0805 (2012 Metric) Temperature Coefficient: X6S Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 105°C Applications: General Purpose Thickness (Max): 0.022" (0.55mm) Capacitance: 2.2 µF | товару немає в наявності | Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||||||||||||||
| CGB4B3X6S1A225K055AB | TDK | Description: CAP CER 2.2UF 10V X6S 0805 Packaging: Cut Tape (CT) Tolerance: ±10% Features: Low Profile Voltage - Rated: 10V Package / Case: 0805 (2012 Metric) Temperature Coefficient: X6S Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 105°C Applications: General Purpose Thickness (Max): 0.022" (0.55mm) Part Status: Last Time Buy Capacitance: 2.2 µF | на замовлення 7900 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGB4B3X6S1A225K055AB | TDK | Description: CAP CER 2.2UF 10V X6S 0805 Packaging: Tape & Reel (TR) Tolerance: ±10% Features: Low Profile Voltage - Rated: 10V Package / Case: 0805 (2012 Metric) Temperature Coefficient: X6S Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 105°C Applications: General Purpose Thickness (Max): 0.022" (0.55mm) Part Status: Last Time Buy Capacitance: 2.2 µF | на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGB4B3X6S1A225K055AB | TDK | Multilayer Ceramic Capacitors MLCC - SMD/SMT CGB 0805 10V 2.2uF X6S 10% T: 0.55mm | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CGB4B3X6S1A225M055AB | TDK | Multilayer Ceramic Capacitors MLCC - SMD/SMT RECOMMENDED ALT 810-CGB4B3X6S1A225KB | на замовлення 3960 шт: термін постачання 21-30 дні (днів) | В кошику од. на суму грн. | ||||||||||||||
| CGB4B3X6S1A225M055AB | TDK Corporation | Description: CAP CER 2.2UF 10V X6S 0805 Capacitance: 2.2 µF Thickness (Max): 0.022" (0.55mm) Applications: General Purpose Operating Temperature: -55°C ~ 105°C Mounting Type: Surface Mount, MLCC Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Temperature Coefficient: X6S Package / Case: 0805 (2012 Metric) Voltage - Rated: 10V Features: Low Profile Tolerance: ±20% Packaging: Tape & Reel (TR) | товару немає в наявності | Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||||||||||||||
| CGB4B3X7R0J225K055AB | TDK Corporation | Description: CAP CER 2.2UF 6.3V X7R 0805 Capacitance: 2.2 µF Part Status: Last Time Buy Thickness (Max): 0.022" (0.55mm) Applications: General Purpose Operating Temperature: -55°C ~ 125°C Mounting Type: Surface Mount, MLCC Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Temperature Coefficient: X7R Package / Case: 0805 (2012 Metric) Voltage - Rated: 6.3V Features: Low Profile Tolerance: ±10% Packaging: Tape & Reel (TR) | товару немає в наявності | Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||||||||||||||
| CGB4B3X7R0J225K055AB | TDK Corporation | Description: CAP CER 2.2UF 6.3V X7R 0805 Capacitance: 2.2 µF Part Status: Last Time Buy Thickness (Max): 0.022" (0.55mm) Applications: General Purpose Operating Temperature: -55°C ~ 125°C Mounting Type: Surface Mount, MLCC Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Temperature Coefficient: X7R Package / Case: 0805 (2012 Metric) Voltage - Rated: 6.3V Features: Low Profile Tolerance: ±10% Packaging: Cut Tape (CT) | на замовлення 7056 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGB4B3X7R0J225K055AB | TDK | Multilayer Ceramic Capacitors MLCC - SMD/SMT 2.2uF 6.3volts X7R 10% | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CGB4B3X7R0J225M055AB | TDK Corporation | Description: CAP CER 2.2UF 6.3V X7R 0805 Capacitance: 2.2 µF Part Status: Last Time Buy Thickness (Max): 0.022" (0.55mm) Applications: General Purpose Operating Temperature: -55°C ~ 125°C Mounting Type: Surface Mount, MLCC Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Temperature Coefficient: X7R Package / Case: 0805 (2012 Metric) Voltage - Rated: 6.3V Features: Low Profile Tolerance: ±20% Packaging: Tape & Reel (TR) | товару немає в наявності | Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||||||||||||||
| CGB4B3X7R0J225M055AB | TDK | Multilayer Ceramic Capacitors MLCC - SMD/SMT 2.2uF 6.3volts X7R 20% | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CGB4B3X7R0J225M055AB | TDK Corporation | Description: CAP CER 2.2UF 6.3V X7R 0805 Capacitance: 2.2 µF Part Status: Last Time Buy Thickness (Max): 0.022" (0.55mm) Applications: General Purpose Operating Temperature: -55°C ~ 125°C Mounting Type: Surface Mount, MLCC Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Temperature Coefficient: X7R Package / Case: 0805 (2012 Metric) Voltage - Rated: 6.3V Features: Low Profile Tolerance: ±20% Packaging: Cut Tape (CT) | на замовлення 2398 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGB5911 | Cooper Bussmann | Cable Accessories Gland Nut and Bushing Steel | на замовлення 4 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGB598 | Cooper Bussmann | Cable Accessories Gland Nut and Bushing Steel | на замовлення 1 шт: термін постачання 21-31 дні (днів) | В кошику од. на суму грн. | ||||||||||||||
| CGB5P-CEN | MACOM | Power Management IC Development Tools Gate Biasing Assembly, GaN, 5-Pins, Center Pin Gate Control | товару немає в наявності | Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||
| CGB6917 | Eaton | Cable Accessories Gland Nut and Bushing Steel | на замовлення 2 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGB7001-SC | MIMIX | на замовлення 12680 шт: термін постачання 14-28 дні (днів) | В кошику од. на суму грн. | |||||||||||||||
| CGB7003-SC | MIMIX | на замовлення 12680 шт: термін постачання 14-28 дні (днів) | В кошику од. на суму грн. | |||||||||||||||
| CGB7917 | Cooper Bussmann | Cable Accessories Gland Nut and Bushing Steel | на замовлення 9 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGB8920 | Cooper Bussmann | Cable Accessories Gland Nut and Bushing Steel | на замовлення 2 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGB9P-CEN | MACOM | GaN FETs Gate Biasing Assembly, GaN, 9-Pins, Center Pin Gate Control | товару немає в наявності | Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||
| CGB9P-SIDE | MACOM | GaN FETs Gate Biasing Assembly, GaN, 9-Pins, Side Pins Gate Control | товару немає в наявності | Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||
| CGBC201-3002B001C1NH | Greenconn | Description: 0.8MM PITCH BOARD TO BOARD FLOAT Number of Rows: 2 Part Status: Active Mated Stacking Heights: 12.75mm Contact Finish Thickness: FLASH Height Above Board: 0.307" (7.80mm) Pitch: 0.031" (0.80mm) Number of Positions: 60 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Plug, Floating Features: Board Guide, Pick and Place, Solder Retention Packaging: Cut Tape (CT) | на замовлення 329 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGBC201-3002B001C1NH | Greenconn | Description: 0.8MM PITCH BOARD TO BOARD FLOAT Number of Rows: 2 Part Status: Active Height Above Board: 0.307" (7.80mm) Pitch: 0.031" (0.80mm) Number of Positions: 60 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Plug, Floating Features: Board Guide, Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Mated Stacking Heights: 12.75mm Contact Finish Thickness: FLASH | товару немає в наявності | Мінімальне замовлення: 400 шт В кошику од. на суму грн. | ||||||||||||||
| CGBC201-4009B001C1NH | Greenconn | Description: 0.8MM PITCH BOARD TO BOARD FLOAT Mated Stacking Heights: 12.75mm Contact Finish Thickness: 3.00µin (0.076µm) Height Above Board: 0.307" (7.80mm) Pitch: 0.031" (0.80mm) Number of Positions: 80 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Plug, Floating Features: Board Guide, Pick and Place, Solder Retention Packaging: Cut Tape (CT) Number of Rows: 2 Part Status: Active | на замовлення 648 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGBC201-4009B001C1NH | Greenconn | Description: 0.8MM PITCH BOARD TO BOARD FLOAT Number of Rows: 2 Part Status: Active Mated Stacking Heights: 12.75mm Contact Finish Thickness: 3.00µin (0.076µm) Height Above Board: 0.307" (7.80mm) Pitch: 0.031" (0.80mm) Number of Positions: 80 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Plug, Floating Features: Board Guide, Pick and Place, Solder Retention Packaging: Tape & Reel (TR) | на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGBC203-3002B001C1NH | Greenconn | Description: 0.8MM PITCH BOARD TO BOARD FLOAT Features: Board Guide, Pick and Place, Solder Retention Packaging: Cut Tape (CT) Connector Type: Plug, Floating Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.031" (0.80mm) Height Above Board: 0.778" (19.75mm) Contact Finish Thickness: FLASH Mated Stacking Heights: 9mm Part Status: Active Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CGBC203-3002B001C1NH | Greenconn | Description: 0.8MM PITCH BOARD TO BOARD FLOAT Features: Board Guide, Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Plug, Floating Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.031" (0.80mm) Height Above Board: 0.778" (19.75mm) Contact Finish Thickness: FLASH Mated Stacking Heights: 9mm Part Status: Active Number of Rows: 2 | на замовлення 500 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGBC203-4002B001C1NH | Greenconn | Description: 0.8MM PITCH BOARD TO BOARD FLOAT Number of Rows: 2 Part Status: Active Mated Stacking Heights: 9mm Contact Finish Thickness: FLASH Height Above Board: 0.778" (19.75mm) Pitch: 0.031" (0.80mm) Number of Positions: 80 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Plug, Floating Features: Board Guide, Pick and Place, Solder Retention Packaging: Tape & Reel (TR) | на замовлення 500 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGBC203-4002B001C1NH | Greenconn | Description: 0.8MM PITCH BOARD TO BOARD FLOAT Number of Rows: 2 Part Status: Active Mated Stacking Heights: 9mm Contact Finish Thickness: FLASH Height Above Board: 0.778" (19.75mm) Pitch: 0.031" (0.80mm) Number of Positions: 80 Connector Type: Plug, Floating Features: Board Guide, Pick and Place, Solder Retention Packaging: Cut Tape (CT) Mounting Type: Surface Mount Contact Finish: Gold | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CGBC203-5002B001C1NH | Greenconn | Description: 0.8MM PITCH BOARD TO BOARD FLOAT Number of Rows: 2 Part Status: Active Mated Stacking Heights: 9mm Contact Finish Thickness: FLASH Height Above Board: 0.778" (19.75mm) Pitch: 0.031" (0.80mm) Number of Positions: 100 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Plug, Floating Features: Board Guide, Pick and Place, Solder Retention Packaging: Tape & Reel (TR) | на замовлення 500 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGBC203-5002B001C1NH | Greenconn | Description: 0.8MM PITCH BOARD TO BOARD FLOAT Number of Rows: 2 Part Status: Active Mated Stacking Heights: 9mm Contact Finish Thickness: FLASH Height Above Board: 0.778" (19.75mm) Pitch: 0.031" (0.80mm) Number of Positions: 100 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Plug, Floating Features: Board Guide, Pick and Place, Solder Retention Packaging: Cut Tape (CT) | на замовлення 500 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGBDT1X5R0G105M022BC | TDK Corporation | Description: CAP CER 1UF 4V X5R 0204 Tolerance: ±20% Features: Low ESL (Reverse Geometry), Low Profile Packaging: Cut Tape (CT) Voltage - Rated: 4V Package / Case: 0204 (0510 Metric) Temperature Coefficient: X5R Size / Dimension: 0.020" L x 0.039" W (0.52mm x 1.00mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 85°C Applications: Bypass, Decoupling Thickness (Max): 0.009" (0.22mm) Capacitance: 1 µF | на замовлення 4054 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGBDT1X5R0G105M022BC | TDK Corporation | Description: CAP CER 1UF 4V X5R 0204 Tolerance: ±20% Features: Low ESL (Reverse Geometry), Low Profile Packaging: Tape & Reel (TR) Voltage - Rated: 4V Package / Case: 0204 (0510 Metric) Temperature Coefficient: X5R Size / Dimension: 0.020" L x 0.039" W (0.52mm x 1.00mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 85°C Applications: Bypass, Decoupling Thickness (Max): 0.009" (0.22mm) Capacitance: 1 µF | товару немає в наявності | Мінімальне замовлення: 15000 шт В кошику од. на суму грн. | ||||||||||||||
| CGBDT1X5R0G105M022BC | TDK | Multilayer Ceramic Capacitors MLCC - SMD/SMT CGB 0204 4V 1uF X5R 20% T: 0.22mm | товару немає в наявності | Мінімальне замовлення: 15000 шт В кошику од. на суму грн. | ||||||||||||||
| CGBDT1X6S0G105M022BC | TDK Corporation | Description: CAP CER 1UF 4V X6S 0204 Tolerance: ±20% Features: Low ESL (Reverse Geometry), Low Profile Packaging: Cut Tape (CT) Voltage - Rated: 4V Package / Case: 0204 (0510 Metric) Temperature Coefficient: X6S Size / Dimension: 0.020" L x 0.039" W (0.52mm x 1.00mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 105°C Applications: Bypass, Decoupling Thickness (Max): 0.009" (0.22mm) Part Status: Active Capacitance: 1 µF | на замовлення 38730 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGBDT1X6S0G105M022BC | TDK | Multilayer Ceramic Capacitors MLCC - SMD/SMT CGB 0204 4V 1uF X6S 20% T: 0.22mm | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CGBDT1X6S0G105M022BC | TDK Corporation | Description: CAP CER 1UF 4V X6S 0204 Tolerance: ±20% Features: Low ESL (Reverse Geometry), Low Profile Packaging: Tape & Reel (TR) Voltage - Rated: 4V Package / Case: 0204 (0510 Metric) Temperature Coefficient: X6S Size / Dimension: 0.020" L x 0.039" W (0.52mm x 1.00mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 105°C Applications: Bypass, Decoupling Thickness (Max): 0.009" (0.22mm) Part Status: Active Capacitance: 1 µF | на замовлення 30000 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGBDT1X7T0E105M022BC | TDK | Multilayer Ceramic Capacitors MLCC - SMD/SMT CGB 0204 2.5V 1uF X7T 20% T: 0.22mm | на замовлення 12614 шт: термін постачання 21-30 дні (днів) | В кошику од. на суму грн. | ||||||||||||||
| CGBDT1X7T0E105M022BC | TDK Corporation | Description: CAP CER 1UF 2.5V X7T 0204 Tolerance: ±20% Features: Low ESL (Reverse Geometry), Low Profile Packaging: Cut Tape (CT) Voltage - Rated: 2.5V Package / Case: 0204 (0510 Metric) Temperature Coefficient: X7T Size / Dimension: 0.020" L x 0.039" W (0.52mm x 1.00mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: Bypass, Decoupling Thickness (Max): 0.009" (0.22mm) Part Status: Active Capacitance: 1 µF | на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGBDT1X7T0E105M022BC | TDK Corporation | Description: CAP CER 1UF 2.5V X7T 0204 Tolerance: ±20% Features: Low ESL (Reverse Geometry), Low Profile Packaging: Tape & Reel (TR) Voltage - Rated: 2.5V Package / Case: 0204 (0510 Metric) Temperature Coefficient: X7T Size / Dimension: 0.020" L x 0.039" W (0.52mm x 1.00mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: Bypass, Decoupling Thickness (Max): 0.009" (0.22mm) Part Status: Active Capacitance: 1 µF | на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
| ||||||||||||||
| CGBS4017-G | ABB Installation Products | Cable Glands, Strain Reliefs & Cord Grips PVC CTD CORD CONN HUB 1IN GRAY | товару немає в наявності | В кошику од. на суму грн. |

