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OM7606/BGA2712 OM7606/BGA2712 NXP USA Inc. BGA2712_Rev_Nov2010.pdf Description: EVAL BOARD FOR BGA2712
Packaging: Bulk
For Use With/Related Products: BGA2712
Frequency: 1GHz ~ 3.2GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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OM7607/BGA2715 OM7607/BGA2715 NXP USA Inc. BGA2715_Rev3.pdf Description: EVAL BOARD FOR BGA2715
Packaging: Bulk
For Use With/Related Products: BGA2715
Frequency: 0Hz ~ 4GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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OM7608/BGA2716 OM7608/BGA2716 NXP USA Inc. BGA2716_Rev3.pdf Description: EVAL BOARD FOR BGA2716
Packaging: Bulk
For Use With/Related Products: BGA2716
Frequency: 50MHz ~ 3.6GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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OM7609/BGA2748 OM7609/BGA2748 NXP USA Inc. BGA2748.pdf Description: EVAL BOARD FOR BGA2748
Packaging: Bulk
For Use With/Related Products: BGA2748
Frequency: 100MHz ~ 2.2GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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OM7610/BGA2771 OM7610/BGA2771 NXP USA Inc. BGA2771_Rev_Nov2010.pdf Description: EVAL BOARD FOR BGA2771
Packaging: Bulk
For Use With/Related Products: BGA2771
Frequency: 20MHz ~ 2.5GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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OM7611/BGA2776 OM7611/BGA2776 NXP USA Inc. BGA2776_N.pdf Description: EVAL BOARD FOR BGA2776
Packaging: Bulk
For Use With/Related Products: BGA2776
Frequency: 0Hz ~ 3GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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OM7612/BGA6489B OM7612/BGA6489B NXP USA Inc. BGA6489.pdf Description: EVAL BOARD FOR BGA6489B
Packaging: Bulk
For Use With/Related Products: BGA6489B
Frequency: 500MHz ~ 3.5GHz
Type: Amplifier
Supplied Contents: Board(s)
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OM7613/BGA6589B OM7613/BGA6589B NXP USA Inc. BGA6589.pdf Description: EVAL BOARD FOR BGA6589B
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OM7614/BGM1011 OM7614/BGM1011 NXP USA Inc. BGM1011_Rev_May2003.pdf Description: EVAL BOARD FOR BGM1011
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OM7616/BGM1013 OM7616/BGM1013 NXP USA Inc. BGM1013.pdf Description: EVAL BOARD FOR BGM1013
Packaging: Bulk
For Use With/Related Products: BGM1013
Frequency: 0Hz ~ 2.2GHz
Type: Amplifier
Supplied Contents: Board(s)
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MC9S08QD2CPC MC9S08QD2CPC NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8DIP
на замовлення 1184 шт:
термін постачання 21-31 дні (днів)
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MC9S08QD2VSC MC9S08QD2VSC NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
2+245.93 грн
Мінімальне замовлення: 2
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MC9S08QD2VPC MC9S08QD2VPC NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Part Status: Obsolete
Number of I/O: 4
DigiKey Programmable: Not Verified
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MC9S08QD2MSC MC9S08QD2MSC NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
на замовлення 47 шт:
термін постачання 21-31 дні (днів)
2+207.84 грн
10+129.57 грн
Мінімальне замовлення: 2
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MC9S08QD2MPC MC9S08QD2MPC NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8DIP
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MC9S08QD4MPC MC9S08QD4MPC NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 4KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Number of I/O: 4
DigiKey Programmable: Not Verified
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MCZ33287EGR2 MCZ33287EGR2 NXP USA Inc. MC33287.pdf Description: IC INTERFACE SPECIALIZED 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 5V, 12V
Supplier Device Package: 20-SOIC
Grade: Automotive
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MCZ33390EFR2 MCZ33390EFR2 NXP USA Inc. MC33390.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
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MCZ33291LEGR2 MCZ33291LEGR2 NXP USA Inc. MC33291L.pdf Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 1.1Ohm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MCZ33970EGR2 MCZ33970EGR2 NXP USA Inc. MC33970.pdf Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive
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MCZ33291LEG MCZ33291LEG NXP USA Inc. MC33291L.pdf Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 1.1Ohm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MCZ33970EG MCZ33970EG NXP USA Inc. MC33970.pdf Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive
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MCZ33689DEW MCZ33689DEW NXP USA Inc. MC33689.pdf Description: IC SYSTEM BASIS CHIP LIN 32-SOIC
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MCZ33689DEWR2 MCZ33689DEWR2 NXP USA Inc. MC33689.pdf Description: IC SYSTEM BASIS CHIP LIN 32-SOIC
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MCZ33291EGR2 MCZ33291EGR2 NXP USA Inc. MC33291.pdf Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MCZ33742SEG MCZ33742SEG NXP USA Inc. MC33742.pdf Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 18V
Current - Supply: 42mA
Supplier Device Package: 28-SOIC
Grade: Automotive
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MCZ33742SEGR2 MCZ33742SEGR2 NXP USA Inc. MC33742.pdf Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 18V
Current - Supply: 42mA
Supplier Device Package: 28-SOIC
Grade: Automotive
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MCZ33989EG MCZ33989EG NXP USA Inc. MC33989.pdf Description: IC INTERFACE SPECIALIZED 28SOIC
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MCZ33989EGR2 MCZ33989EGR2 NXP USA Inc. MC33989.pdf Description: IC INTERFACE SPECIALIZED 28SOIC
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MCZ33298EGR2 MCZ33298EGR2 NXP USA Inc. MC33298.pdf Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 350mOhm
Voltage - Load: 5.5V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3A
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MCZ33879AEK MCZ33879AEK NXP USA Inc. MC33879.pdf Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
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MCZ33879AEKR2 MCZ33879AEKR2 NXP USA Inc. MC33879.pdf Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
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MCZ33797EK MCZ33797EK NXP USA Inc. MC33797.pdf Description: IC SQUIB DRIVER 4-CH 32-SOIC
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MC33794EK MC33794EK NXP USA Inc. MC33794.pdf Description: IC SENSOR ELECTRIC FIELD 54SOIC
Packaging: Tube
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC-EP
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
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MC33794EKR2 MC33794EKR2 NXP USA Inc. MC33794.pdf Description: IC SENSOR ELECTRIC FIELD 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC-EP
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
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MM908E624ACEWR2 MM908E624ACEWR2 NXP USA Inc. MM908E624.pdf Description: IC SWITCH TRPL HI MCU/LIN 54SOIC
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MC34923EGR2 MC34923EGR2 NXP USA Inc. MC34923.pdf Description: IC MOTOR DRIVER 4.5V-5.5V 24SOIC
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MC34923EG MC34923EG NXP USA Inc. MC34923.pdf Description: IC MOTOR DRIVER 4.5V-5.5V 24SOIC
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MC33999EK MC33999EK NXP USA Inc. MC33999.pdf Description: IC PWR SWITCH N-CH 1:16 54SOIC
Packaging: Tube
Features: PWM Input
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 16
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5V ~ 27V
Voltage - Supply (Vcc/Vdd): 1.5V ~ 3V
Current - Output (Max): 900mA
Ratio - Input:Output: 1:16
Supplier Device Package: 54-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MC33999EKR2 MC33999EKR2 NXP USA Inc. MC33999.pdf Description: IC PWR SWITCH N-CH 1:16 54SOIC
Packaging: Tape & Reel (TR)
Features: PWM Input
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 16
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5V ~ 27V
Voltage - Supply (Vcc/Vdd): 1.5V ~ 3V
Current - Output (Max): 900mA
Ratio - Input:Output: 1:16
Supplier Device Package: 54-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MC9S12GC32MPBE MC9S12GC32MPBE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 32KB FLASH 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 52-TQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
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MMA6280QT MMA6280QT NXP USA Inc. MMA6280QT.pdf Description: ACCEL 1.5-6G ANALOG 16QFN
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MC9S12C64MPBE MC9S12C64MPBE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 64KB FLASH 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 52-TQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
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MC9S12E64MPVE MC9S12E64MPVE NXP USA Inc. MC9S12E128V1.pdf Description: IC MCU 16BIT 64KB FLASH 112LQFP
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MPVZ2202GC6T1 MPVZ2202GC6T1 NXP USA Inc. MPVZ2202%20Series.pdf Description: IC SENSOR PRESSURE 200KPA 8-SOP
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MCF52223CAF66 MCF52223CAF66 NXP USA Inc. MCF52223DS.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Last Time Buy
Number of I/O: 56
DigiKey Programmable: Not Verified
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MCF52223CAF80 MCF52223CAF80 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Last Time Buy
Number of I/O: 56
DigiKey Programmable: Not Verified
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MMA1270EGR2 MMA1270EGR2 NXP USA Inc. MMA1270KEG.pdf Description: ACCELEROMETER 2.5G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±2.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 750
Grade: Automotive
Qualification: AEC-Q100
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MMA1211EG MMA1211EG NXP USA Inc. MMA1211D.pdf Description: ACCELEROMETER 169G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±169g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 13.33
Part Status: Obsolete
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MMA1260DEGR2 MMA1260DEGR2 NXP USA Inc. MMA1260D.pdf Description: ACCELEROMETER 1.5G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±1.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 1200
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MMA1200EG MMA1200EG NXP USA Inc. MMA1200D.pdf Description: ACCELEROMETER 281G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±281g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 8
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MMA1270EG MMA1270EG NXP USA Inc. MMA1270KEG.pdf Description: ACCELEROMETER 2.5G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±2.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 750
Grade: Automotive
Qualification: AEC-Q100
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MMA1212EG MMA1212EG NXP USA Inc. MMA1212D.pdf Description: ACCELEROMETER 225G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±225g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 10
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MC9S12E128MPVE MC9S12E128MPVE NXP USA Inc. MC9S12E128V1.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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MCF52234CAL60 MCF52234CAL60 NXP USA Inc. MCF52235.pdf Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 73
DigiKey Programmable: Not Verified
на замовлення 147 шт:
термін постачання 21-31 дні (днів)
1+2028.73 грн
10+1576.75 грн
25+1482.72 грн
100+1294.50 грн
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MCF52235CAL60 MCF52235CAL60 NXP USA Inc. MCF52235.pdf Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 73
DigiKey Programmable: Not Verified
на замовлення 360 шт:
термін постачання 21-31 дні (днів)
1+2205.93 грн
10+1718.36 грн
25+1617.09 грн
100+1413.08 грн
300+1354.81 грн
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MPC8349EVVALFB MPC8349EVVALFB NXP USA Inc. MPC8349EAEC.pdf Description: IC MPU MPC83XX 667MHZ 672TBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
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MPC8343ECVRAGDB MPC8343ECVRAGDB NXP USA Inc. MPC8343EAEC.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
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MPC8349ECZUAJDB MPC8349ECZUAJDB NXP USA Inc. MPC8349EAEC.pdf Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
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MPC8349ECVVAGDB MPC8349ECVVAGDB NXP USA Inc. MPC8349EAEC.pdf Description: IC MPU MPC83XX 400MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
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OM7606/BGA2712 BGA2712_Rev_Nov2010.pdf
OM7606/BGA2712
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2712
Packaging: Bulk
For Use With/Related Products: BGA2712
Frequency: 1GHz ~ 3.2GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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OM7607/BGA2715 BGA2715_Rev3.pdf
OM7607/BGA2715
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2715
Packaging: Bulk
For Use With/Related Products: BGA2715
Frequency: 0Hz ~ 4GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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OM7608/BGA2716 BGA2716_Rev3.pdf
OM7608/BGA2716
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2716
Packaging: Bulk
For Use With/Related Products: BGA2716
Frequency: 50MHz ~ 3.6GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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OM7609/BGA2748 BGA2748.pdf
OM7609/BGA2748
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2748
Packaging: Bulk
For Use With/Related Products: BGA2748
Frequency: 100MHz ~ 2.2GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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OM7610/BGA2771 BGA2771_Rev_Nov2010.pdf
OM7610/BGA2771
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2771
Packaging: Bulk
For Use With/Related Products: BGA2771
Frequency: 20MHz ~ 2.5GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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OM7611/BGA2776 BGA2776_N.pdf
OM7611/BGA2776
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA2776
Packaging: Bulk
For Use With/Related Products: BGA2776
Frequency: 0Hz ~ 3GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
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OM7612/BGA6489B BGA6489.pdf
OM7612/BGA6489B
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA6489B
Packaging: Bulk
For Use With/Related Products: BGA6489B
Frequency: 500MHz ~ 3.5GHz
Type: Amplifier
Supplied Contents: Board(s)
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OM7613/BGA6589B BGA6589.pdf
OM7613/BGA6589B
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGA6589B
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OM7614/BGM1011 BGM1011_Rev_May2003.pdf
OM7614/BGM1011
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGM1011
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OM7616/BGM1013 BGM1013.pdf
OM7616/BGM1013
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR BGM1013
Packaging: Bulk
For Use With/Related Products: BGM1013
Frequency: 0Hz ~ 2.2GHz
Type: Amplifier
Supplied Contents: Board(s)
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MC9S08QD2CPC MC9S08QD4.pdf
MC9S08QD2CPC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8DIP
на замовлення 1184 шт:
термін постачання 21-31 дні (днів)
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MC9S08QD2VSC MC9S08QD4.pdf
MC9S08QD2VSC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+245.93 грн
Мінімальне замовлення: 2
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MC9S08QD2VPC MC9S08QD4.pdf
MC9S08QD2VPC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Part Status: Obsolete
Number of I/O: 4
DigiKey Programmable: Not Verified
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MC9S08QD2MSC MC9S08QD4.pdf
MC9S08QD2MSC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
на замовлення 47 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+207.84 грн
10+129.57 грн
Мінімальне замовлення: 2
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MC9S08QD2MPC MC9S08QD4.pdf
MC9S08QD2MPC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8DIP
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MC9S08QD4MPC MC9S08QD4.pdf
MC9S08QD4MPC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Number of I/O: 4
DigiKey Programmable: Not Verified
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MCZ33287EGR2 MC33287.pdf
MCZ33287EGR2
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 5V, 12V
Supplier Device Package: 20-SOIC
Grade: Automotive
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MCZ33390EFR2 MC33390.pdf
MCZ33390EFR2
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
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MCZ33291LEGR2 MC33291L.pdf
MCZ33291LEGR2
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 1.1Ohm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MCZ33970EGR2 MC33970.pdf
MCZ33970EGR2
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive
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MCZ33291LEG MC33291L.pdf
MCZ33291LEG
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 1.1Ohm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MCZ33970EG MC33970.pdf
MCZ33970EG
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive
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MCZ33689DEW MC33689.pdf
MCZ33689DEW
Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-SOIC
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MCZ33689DEWR2 MC33689.pdf
MCZ33689DEWR2
Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-SOIC
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MCZ33291EGR2 MC33291.pdf
MCZ33291EGR2
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MCZ33742SEG MC33742.pdf
MCZ33742SEG
Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 18V
Current - Supply: 42mA
Supplier Device Package: 28-SOIC
Grade: Automotive
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MCZ33742SEGR2 MC33742.pdf
MCZ33742SEGR2
Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 18V
Current - Supply: 42mA
Supplier Device Package: 28-SOIC
Grade: Automotive
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MCZ33989EG MC33989.pdf
MCZ33989EG
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
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MCZ33989EGR2 MC33989.pdf
MCZ33989EGR2
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
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MCZ33298EGR2 MC33298.pdf
MCZ33298EGR2
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 350mOhm
Voltage - Load: 5.5V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3A
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MCZ33879AEK MC33879.pdf
MCZ33879AEK
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
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MCZ33879AEKR2 MC33879.pdf
MCZ33879AEKR2
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
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MCZ33797EK MC33797.pdf
MCZ33797EK
Виробник: NXP USA Inc.
Description: IC SQUIB DRIVER 4-CH 32-SOIC
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MC33794EK MC33794.pdf
MC33794EK
Виробник: NXP USA Inc.
Description: IC SENSOR ELECTRIC FIELD 54SOIC
Packaging: Tube
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC-EP
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
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MC33794EKR2 MC33794.pdf
MC33794EKR2
Виробник: NXP USA Inc.
Description: IC SENSOR ELECTRIC FIELD 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC-EP
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
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MM908E624ACEWR2 MM908E624.pdf
MM908E624ACEWR2
Виробник: NXP USA Inc.
Description: IC SWITCH TRPL HI MCU/LIN 54SOIC
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MC34923EGR2 MC34923.pdf
MC34923EGR2
Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 4.5V-5.5V 24SOIC
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MC34923EG MC34923.pdf
MC34923EG
Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 4.5V-5.5V 24SOIC
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MC33999EK MC33999.pdf
MC33999EK
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CH 1:16 54SOIC
Packaging: Tube
Features: PWM Input
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 16
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5V ~ 27V
Voltage - Supply (Vcc/Vdd): 1.5V ~ 3V
Current - Output (Max): 900mA
Ratio - Input:Output: 1:16
Supplier Device Package: 54-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MC33999EKR2 MC33999.pdf
MC33999EKR2
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CH 1:16 54SOIC
Packaging: Tape & Reel (TR)
Features: PWM Input
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 16
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5V ~ 27V
Voltage - Supply (Vcc/Vdd): 1.5V ~ 3V
Current - Output (Max): 900mA
Ratio - Input:Output: 1:16
Supplier Device Package: 54-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MC9S12GC32MPBE MC9S12C128V1.pdf
MC9S12GC32MPBE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 52-TQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
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MMA6280QT MMA6280QT.pdf
MMA6280QT
Виробник: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 16QFN
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MC9S12C64MPBE MC9S12C128V1.pdf
MC9S12C64MPBE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 52-TQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
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MC9S12E64MPVE MC9S12E128V1.pdf
MC9S12E64MPVE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
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MPVZ2202GC6T1 MPVZ2202%20Series.pdf
MPVZ2202GC6T1
Виробник: NXP USA Inc.
Description: IC SENSOR PRESSURE 200KPA 8-SOP
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MCF52223CAF66 MCF52223DS.pdf
MCF52223CAF66
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Last Time Buy
Number of I/O: 56
DigiKey Programmable: Not Verified
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MCF52223CAF80
MCF52223CAF80
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Last Time Buy
Number of I/O: 56
DigiKey Programmable: Not Verified
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MMA1270EGR2 MMA1270KEG.pdf
MMA1270EGR2
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2.5G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±2.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 750
Grade: Automotive
Qualification: AEC-Q100
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MMA1211EG MMA1211D.pdf
MMA1211EG
Виробник: NXP USA Inc.
Description: ACCELEROMETER 169G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±169g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 13.33
Part Status: Obsolete
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MMA1260DEGR2 MMA1260D.pdf
MMA1260DEGR2
Виробник: NXP USA Inc.
Description: ACCELEROMETER 1.5G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±1.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 1200
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MMA1200EG MMA1200D.pdf
MMA1200EG
Виробник: NXP USA Inc.
Description: ACCELEROMETER 281G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±281g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 8
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MMA1270EG MMA1270KEG.pdf
MMA1270EG
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2.5G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±2.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 750
Grade: Automotive
Qualification: AEC-Q100
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MMA1212EG MMA1212D.pdf
MMA1212EG
Виробник: NXP USA Inc.
Description: ACCELEROMETER 225G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±225g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 10
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MC9S12E128MPVE MC9S12E128V1.pdf
MC9S12E128MPVE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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MCF52234CAL60 MCF52235.pdf
MCF52234CAL60
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 73
DigiKey Programmable: Not Verified
на замовлення 147 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2028.73 грн
10+1576.75 грн
25+1482.72 грн
100+1294.50 грн
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MCF52235CAL60 MCF52235.pdf
MCF52235CAL60
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 73
DigiKey Programmable: Not Verified
на замовлення 360 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2205.93 грн
10+1718.36 грн
25+1617.09 грн
100+1413.08 грн
300+1354.81 грн
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MPC8349EVVALFB MPC8349EAEC.pdf
MPC8349EVVALFB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ 672TBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
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MPC8343ECVRAGDB MPC8343EAEC.pdf
MPC8343ECVRAGDB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
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MPC8349ECZUAJDB MPC8349EAEC.pdf
MPC8349ECZUAJDB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
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MPC8349ECVVAGDB MPC8349EAEC.pdf
MPC8349ECVVAGDB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
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