Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (34175) > Сторінка 121 з 570
| Фото | Назва | Виробник | Інформація |
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| M5250ADC | NXP USA Inc. | Description: SCF5250 EVAL BRD |
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| M5250C3 | NXP USA Inc. | Description: SCF5250 EVAL BRD |
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| M5251C3 | NXP USA Inc. | Description: MCF5251 EVAL BRD |
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| M5251EVBWR | NXP USA Inc. | Description: MCF5251 EVAL BRD |
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| M5253EVB | NXP USA Inc. |
Description: MCF5253 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: Coldfire V2 Utilized IC / Part: MCF5253 |
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M5282EVBE | NXP USA Inc. |
Description: MCF5282 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: Coldfire V2 Utilized IC / Part: MCF5282 |
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M54455EVB | NXP USA Inc. |
 Description: MCF54455 EVAL BRD |
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| M68CBL05A | NXP USA Inc. |
Description: KIT ACCY FLEX CBL LN C8 40/44PIN Packaging: Bulk For Use With/Related Products: MMEVS or MMDS Accessory Type: Flexible PCB Cable with Adapter |
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| M68CBL05AE | NXP USA Inc. |
Description: KIT ACCY FLEX CBL LN C8 40/44PIN Packaging: Bulk For Use With/Related Products: MMEVS or MMDS Accessory Type: Flexible PCB Cable with Adapter |
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M68DEMO908GB60E | NXP USA Inc. |
Description: MC9S08GB60 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s), Cable(s), Accessories Core Processor: HCS08 Utilized IC / Part: MC9S08GB60 Part Status: Active |
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| M68DIP16SOIC | NXP USA Inc. | Description: ADAPTER CBL 16-DIP TO 16-SOIC |
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| M68DIP16TSSOP | NXP USA Inc. | Description: ADAPTER CBL 16-DIP TO 16-TSSOP |
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| M68DIP20SOIC | NXP USA Inc. | Description: ADAPTER CBL 20-DIP TO 20-SOIC |
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| M68DIP28SOIC | NXP USA Inc. |
Description: ADAPTER CBL 28-DIP TO 28-SOIC Packaging: Bulk For Use With/Related Products: Interface for Emulator and MCU Accessory Type: Adapter Cable Part Status: Obsolete |
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| M68EVB912DG128A | NXP USA Inc. |
Description: HC912DG128A EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s) Board Type: Evaluation Platform Utilized IC / Part: HC912DG128A Part Status: Obsolete |
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| M68EVB912DP256 | NXP USA Inc. | Description: HC9S12DP256 EVAL BRD |
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| M68EVB912DP256UE | NXP USA Inc. | Description: MC9S12DP256 EVAL BRD |
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| M68HC11EVBU2 | NXP USA Inc. |
Description: MC68HC11E9 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Utilized IC / Part: MC68HC11E9 |
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| M9328MXLLITEKIT | NXP USA Inc. |
Description: I.MXL EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM9 Utilized IC / Part: i.MXL Part Status: Not For New Designs |
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MC13783VK5 | NXP USA Inc. |
Description: IC PWR MNGMNT ATLAS 3G 247MAPBGA Packaging: Tray Package / Case: 247-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Applications: Handheld/Mobile Devices Supplier Device Package: 247-MAPBGA (10x10) |
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MC13783VK5R2 | NXP USA Inc. |
Description: IC PWR MNGMNT ATLAS 3G 247MAPBGA Packaging: Tape & Reel (TR) Package / Case: 247-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Applications: Handheld/Mobile Devices Supplier Device Package: 247-MAPBGA (10x10) |
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| MC33493MOD315EV | NXP USA Inc. |
Description: BOARD EVAL MC33493 TANGO Packaging: Bulk For Use With/Related Products: MC33493 Frequency: 315MHz Type: Transmitter Supplied Contents: Board(s) Part Status: Obsolete |
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| MC33493MOD868EV | NXP USA Inc. |
Description: BOARD EVAL MC33493 TANGO Packaging: Bulk For Use With/Related Products: MC33493 Frequency: 868MHz Type: Transmitter Supplied Contents: Board(s) Part Status: Obsolete |
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| MC33591MOD315EV | NXP USA Inc. |
Description: BOARD EVAL MC33493 TANGO3 RF Packaging: Bulk For Use With/Related Products: MC33591 Frequency: 315MHz Type: Receiver Supplied Contents: Board(s) Part Status: Obsolete |
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| MC33593MOD868EV | NXP USA Inc. |
Description: BOARD EVAL MC33593 ROMEO2 RF Packaging: Bulk Frequency: 868MHz Type: Receiver, UHF Supplied Contents: Board(s) Part Status: Obsolete |
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%20Renders/768_32-VQFN%20Exposed%20Pad.jpg "MC33596FCAE") |
MC33596FCAE | NXP USA Inc. |
Description: RF RX FSK/OOK 304/315/426 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Sensitivity: -104dBm Mounting Type: Surface Mount Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -20°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V Applications: General Data Transfer Current - Receiving: 10.3mA Data Rate (Max): 22.4kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 32-QFN-EP (5x5) Part Status: Obsolete |
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MC33690DWE | NXP USA Inc. |
Description: IC RFID READER 125KHZ 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Frequency: 125kHz Type: RFID Reader Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5.5V ~ 40V Standards: ISO 9141 Supplier Device Package: 20-SOIC Part Status: Obsolete |
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MC33690DWER2 | NXP USA Inc. |
Description: IC RFID READER 125KHZ 20SOIC Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Frequency: 125kHz Type: RFID Reader Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5.5V ~ 40V Standards: ISO 9141 Supplier Device Package: 20-SOIC Part Status: Obsolete |
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MC33696FCAE | NXP USA Inc. |
Description: IC RF TXRX ISM<1GHZ 32VFQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Sensitivity: -106.5dBm Mounting Type: Surface Mount Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz Type: TxRx Only Operating Temperature: -20°C ~ 85°C Voltage - Supply: 2.1V ~ 3.6V Power - Output: 7.25dBm Current - Receiving: 10.3mA ~ 24mA Data Rate (Max): 22.6kbps Current - Transmitting: 6.1mA ~ 13.5mA Supplier Device Package: 32-QFN-EP (5x5) Modulation: FSK, OOK RF Family/Standard: General ISM < 1GHz Serial Interfaces: SPI DigiKey Programmable: Not Verified |
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%20Renders/32-VQFN%20Exposed%20Pad.jpg "MC33696FCAER2") |
MC33696FCAER2 | NXP USA Inc. |
Description: IC RF TXRX ISM<1GHZ 32VFQFN |
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MC33696FJAE | NXP USA Inc. |
Description: IC RF TXRX ISM<1GHZ 32VFQFN |
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MC33696FJAER2 | NXP USA Inc. |
Description: IC RF TXRX ISM<1GHZ 32VFQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Sensitivity: -106.5dBm Mounting Type: Surface Mount Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz Type: TxRx Only Operating Temperature: -20°C ~ 85°C Voltage - Supply: 2.1V ~ 3.6V Power - Output: 7.25dBm Current - Receiving: 10.3mA ~ 24mA Data Rate (Max): 22.6kbps Current - Transmitting: 6.1mA ~ 13.5mA Supplier Device Package: 32-QFN-EP (5x5) Modulation: FSK, OOK RF Family/Standard: General ISM < 1GHz Serial Interfaces: SPI DigiKey Programmable: Not Verified |
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MC33941EGR2 | NXP USA Inc. |
Description: SENSOR IC TOUCH/PROXMTY 24SOIC |
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MC34671AEPR2 | NXP USA Inc. |
Description: IC BATT CHG LI-ION 1CELL 8UDFN Packaging: Tape & Reel (TR) Package / Case: 8-UFDFN Exposed Pad Number of Cells: 1 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Battery Chemistry: Lithium Ion/Polymer Supplier Device Package: 8-UDFN (3x2) Charge Current - Max: 600mA Fault Protection: Over Temperature, Over Voltage Voltage - Supply (Max): 10V Battery Pack Voltage: 4.2V Current - Charging: Constant - Programmable |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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MC34673AEPR2 | NXP USA Inc. |
Description: IC BATT CHG LI-ION 1CELL 8UDFN Packaging: Tape & Reel (TR) Package / Case: 8-UFDFN Exposed Pad Number of Cells: 1 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Battery Chemistry: Lithium Ion/Polymer Supplier Device Package: 8-UDFN (3x2) Charge Current - Max: 1.2A Fault Protection: Over Voltage Voltage - Supply (Max): 6.6V Battery Pack Voltage: 4.2V Current - Charging: Constant - Programmable |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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MC34674AEPR2 | NXP USA Inc. |
Description: IC BATT CHG LI-ION 1CELL 8UDFN |
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| MC44BC375UADEVK | NXP USA Inc. |
Description: KIT KIT FOR BC375UA AUD/VID MOD Packaging: Bulk For Use With/Related Products: MC44BC375UA Type: Modulator Supplied Contents: Board(s) |
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MC56F8023VLC | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (16K x 16) RAM Size: 2K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 6x12b; D/A 2x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 26 DigiKey Programmable: Not Verified |
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MC56F8025VLD | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (16K x 16) RAM Size: 2K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 8x12b; D/A 2x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 35 DigiKey Programmable: Not Verified |
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MC56F8036VLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP |
на замовлення 1640 шт: термін постачання 21-31 дні (днів) |
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MC56F8037EVM | NXP USA Inc. |
Description: MC56F8037 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s), Cable(s), Accessories Core Processor: 56800E Utilized IC / Part: MC56F8037 |
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MC56F8037VLH | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (32K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 16x12b; D/A 2x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, I2C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
на замовлення 443 шт: термін постачання 21-31 дні (днів) |
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MC56F8323EVME | NXP USA Inc. |
Description: MC56F8322/MC56F8323 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: DSP Contents: Board(s) Core Processor: 56800E Board Type: Evaluation Platform Utilized IC / Part: MC56F8322, MC56F8323 Part Status: Active |
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MC7448TVU1267ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.267GHZ 360BGA |
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MC8641DHX1000GB | NXP USA Inc. |
Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA |
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MC8641DHX1000GC | NXP USA Inc. |
Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA |
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MC8641DHX1000NB | NXP USA Inc. |
Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA |
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MC8641DHX1000NC | NXP USA Inc. |
Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA |
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MC8641DVU1333JB | NXP USA Inc. |
Description: IC MPU MPC86XX 1.333GHZ 1023BGA |
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MC8641DVU1333JC | NXP USA Inc. |
Description: IC MPU MPC86XX 1.333GHZ 1023BGA |
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MC8641HX1000GB | NXP USA Inc. |
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA |
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MC8641HX1000GC | NXP USA Inc. |
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA |
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MC8641HX1000NB | NXP USA Inc. |
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA |
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MC8641HX1000NC | NXP USA Inc. |
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA |
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MC8641VU1333JB | NXP USA Inc. |
Description: IC MPU MPC86XX 1.333GHZ 994BGA |
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MC8641VU1333JC | NXP USA Inc. |
Description: IC MPU MPC86XX 1.333GHZ 994BGA |
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MC908GZ60VFUE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFP |
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MC908JL16CDWER | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 28SOIC |
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MC908QY4AMDTER | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Part Status: Obsolete Number of I/O: 13 DigiKey Programmable: Not Verified |
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MC908QY4AMDWER | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Part Status: Not For New Designs Number of I/O: 13 DigiKey Programmable: Verified |
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| M5253EVB |
Виробник: NXP USA Inc.
Description: MCF5253 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5253
Description: MCF5253 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5253
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| M5282EVBE |
Виробник: NXP USA Inc.
Description: MCF5282 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5282
Description: MCF5282 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5282
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| M68CBL05A |
Виробник: NXP USA Inc.
Description: KIT ACCY FLEX CBL LN C8 40/44PIN
Packaging: Bulk
For Use With/Related Products: MMEVS or MMDS
Accessory Type: Flexible PCB Cable with Adapter
Description: KIT ACCY FLEX CBL LN C8 40/44PIN
Packaging: Bulk
For Use With/Related Products: MMEVS or MMDS
Accessory Type: Flexible PCB Cable with Adapter
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| M68CBL05AE |
Виробник: NXP USA Inc.
Description: KIT ACCY FLEX CBL LN C8 40/44PIN
Packaging: Bulk
For Use With/Related Products: MMEVS or MMDS
Accessory Type: Flexible PCB Cable with Adapter
Description: KIT ACCY FLEX CBL LN C8 40/44PIN
Packaging: Bulk
For Use With/Related Products: MMEVS or MMDS
Accessory Type: Flexible PCB Cable with Adapter
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| M68DEMO908GB60E |
Виробник: NXP USA Inc.
Description: MC9S08GB60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: HCS08
Utilized IC / Part: MC9S08GB60
Part Status: Active
Description: MC9S08GB60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: HCS08
Utilized IC / Part: MC9S08GB60
Part Status: Active
товар відсутній
| M68DIP28SOIC |
Виробник: NXP USA Inc.
Description: ADAPTER CBL 28-DIP TO 28-SOIC
Packaging: Bulk
For Use With/Related Products: Interface for Emulator and MCU
Accessory Type: Adapter Cable
Part Status: Obsolete
Description: ADAPTER CBL 28-DIP TO 28-SOIC
Packaging: Bulk
For Use With/Related Products: Interface for Emulator and MCU
Accessory Type: Adapter Cable
Part Status: Obsolete
товар відсутній
| M68EVB912DG128A |
Виробник: NXP USA Inc.
Description: HC912DG128A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Board Type: Evaluation Platform
Utilized IC / Part: HC912DG128A
Part Status: Obsolete
Description: HC912DG128A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Board Type: Evaluation Platform
Utilized IC / Part: HC912DG128A
Part Status: Obsolete
товар відсутній
| M68HC11EVBU2 |
Виробник: NXP USA Inc.
Description: MC68HC11E9 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Utilized IC / Part: MC68HC11E9
Description: MC68HC11E9 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Utilized IC / Part: MC68HC11E9
товар відсутній
| M9328MXLLITEKIT |
Виробник: NXP USA Inc.
Description: I.MXL EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM9
Utilized IC / Part: i.MXL
Part Status: Not For New Designs
Description: I.MXL EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM9
Utilized IC / Part: i.MXL
Part Status: Not For New Designs
товар відсутній
| MC13783VK5 |
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Виробник: NXP USA Inc.
Description: IC PWR MNGMNT ATLAS 3G 247MAPBGA
Packaging: Tray
Package / Case: 247-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Handheld/Mobile Devices
Supplier Device Package: 247-MAPBGA (10x10)
Description: IC PWR MNGMNT ATLAS 3G 247MAPBGA
Packaging: Tray
Package / Case: 247-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Handheld/Mobile Devices
Supplier Device Package: 247-MAPBGA (10x10)
товар відсутній
| MC13783VK5R2 |
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Виробник: NXP USA Inc.
Description: IC PWR MNGMNT ATLAS 3G 247MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 247-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Handheld/Mobile Devices
Supplier Device Package: 247-MAPBGA (10x10)
Description: IC PWR MNGMNT ATLAS 3G 247MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 247-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Handheld/Mobile Devices
Supplier Device Package: 247-MAPBGA (10x10)
товар відсутній
| MC33493MOD315EV |
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Виробник: NXP USA Inc.
Description: BOARD EVAL MC33493 TANGO
Packaging: Bulk
For Use With/Related Products: MC33493
Frequency: 315MHz
Type: Transmitter
Supplied Contents: Board(s)
Part Status: Obsolete
Description: BOARD EVAL MC33493 TANGO
Packaging: Bulk
For Use With/Related Products: MC33493
Frequency: 315MHz
Type: Transmitter
Supplied Contents: Board(s)
Part Status: Obsolete
товар відсутній
| MC33493MOD868EV |
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Виробник: NXP USA Inc.
Description: BOARD EVAL MC33493 TANGO
Packaging: Bulk
For Use With/Related Products: MC33493
Frequency: 868MHz
Type: Transmitter
Supplied Contents: Board(s)
Part Status: Obsolete
Description: BOARD EVAL MC33493 TANGO
Packaging: Bulk
For Use With/Related Products: MC33493
Frequency: 868MHz
Type: Transmitter
Supplied Contents: Board(s)
Part Status: Obsolete
товар відсутній
| MC33591MOD315EV |
|
Виробник: NXP USA Inc.
Description: BOARD EVAL MC33493 TANGO3 RF
Packaging: Bulk
For Use With/Related Products: MC33591
Frequency: 315MHz
Type: Receiver
Supplied Contents: Board(s)
Part Status: Obsolete
Description: BOARD EVAL MC33493 TANGO3 RF
Packaging: Bulk
For Use With/Related Products: MC33591
Frequency: 315MHz
Type: Receiver
Supplied Contents: Board(s)
Part Status: Obsolete
товар відсутній
| MC33593MOD868EV |
|
Виробник: NXP USA Inc.
Description: BOARD EVAL MC33593 ROMEO2 RF
Packaging: Bulk
Frequency: 868MHz
Type: Receiver, UHF
Supplied Contents: Board(s)
Part Status: Obsolete
Description: BOARD EVAL MC33593 ROMEO2 RF
Packaging: Bulk
Frequency: 868MHz
Type: Receiver, UHF
Supplied Contents: Board(s)
Part Status: Obsolete
товар відсутній
| MC33596FCAE |
|
Виробник: NXP USA Inc.
Description: RF RX FSK/OOK 304/315/426 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
Description: RF RX FSK/OOK 304/315/426 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
товар відсутній
| MC33690DWE |
Виробник: NXP USA Inc.
Description: IC RFID READER 125KHZ 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Reader
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 40V
Standards: ISO 9141
Supplier Device Package: 20-SOIC
Part Status: Obsolete
Description: IC RFID READER 125KHZ 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Reader
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 40V
Standards: ISO 9141
Supplier Device Package: 20-SOIC
Part Status: Obsolete
товар відсутній
| MC33690DWER2 |
Виробник: NXP USA Inc.
Description: IC RFID READER 125KHZ 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Reader
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 40V
Standards: ISO 9141
Supplier Device Package: 20-SOIC
Part Status: Obsolete
Description: IC RFID READER 125KHZ 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Reader
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 40V
Standards: ISO 9141
Supplier Device Package: 20-SOIC
Part Status: Obsolete
товар відсутній
| MC33696FCAE |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX ISM<1GHZ 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -106.5dBm
Mounting Type: Surface Mount
Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz
Type: TxRx Only
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 7.25dBm
Current - Receiving: 10.3mA ~ 24mA
Data Rate (Max): 22.6kbps
Current - Transmitting: 6.1mA ~ 13.5mA
Supplier Device Package: 32-QFN-EP (5x5)
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
Description: IC RF TXRX ISM<1GHZ 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -106.5dBm
Mounting Type: Surface Mount
Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz
Type: TxRx Only
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 7.25dBm
Current - Receiving: 10.3mA ~ 24mA
Data Rate (Max): 22.6kbps
Current - Transmitting: 6.1mA ~ 13.5mA
Supplier Device Package: 32-QFN-EP (5x5)
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
товар відсутній
| MC33696FJAER2 |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX ISM<1GHZ 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -106.5dBm
Mounting Type: Surface Mount
Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz
Type: TxRx Only
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 7.25dBm
Current - Receiving: 10.3mA ~ 24mA
Data Rate (Max): 22.6kbps
Current - Transmitting: 6.1mA ~ 13.5mA
Supplier Device Package: 32-QFN-EP (5x5)
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
Description: IC RF TXRX ISM<1GHZ 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -106.5dBm
Mounting Type: Surface Mount
Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz
Type: TxRx Only
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 7.25dBm
Current - Receiving: 10.3mA ~ 24mA
Data Rate (Max): 22.6kbps
Current - Transmitting: 6.1mA ~ 13.5mA
Supplier Device Package: 32-QFN-EP (5x5)
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
товар відсутній
| MC34671AEPR2 |
|
Виробник: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 600mA
Fault Protection: Over Temperature, Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 600mA
Fault Protection: Over Temperature, Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3000+ | 70.55 грн |
| 6000+ | 65.42 грн |
| MC34673AEPR2 |
|
Виробник: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 1.2A
Fault Protection: Over Voltage
Voltage - Supply (Max): 6.6V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 1.2A
Fault Protection: Over Voltage
Voltage - Supply (Max): 6.6V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3000+ | 64.68 грн |
| MC44BC375UADEVK |
|
Виробник: NXP USA Inc.
Description: KIT KIT FOR BC375UA AUD/VID MOD
Packaging: Bulk
For Use With/Related Products: MC44BC375UA
Type: Modulator
Supplied Contents: Board(s)
Description: KIT KIT FOR BC375UA AUD/VID MOD
Packaging: Bulk
For Use With/Related Products: MC44BC375UA
Type: Modulator
Supplied Contents: Board(s)
товар відсутній
| MC56F8023VLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
товар відсутній
| MC56F8025VLD |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
товар відсутній
| MC56F8036VLF |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Description: IC MCU 16BIT 64KB FLASH 48LQFP
на замовлення 1640 шт:
термін постачання 21-31 дні (днів)| MC56F8037EVM |
|
Виробник: NXP USA Inc.
Description: MC56F8037 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: 56800E
Utilized IC / Part: MC56F8037
Description: MC56F8037 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: 56800E
Utilized IC / Part: MC56F8037
товар відсутній
| MC56F8037VLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 443 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1158.06 грн |
| 10+ | 891.32 грн |
| 80+ | 752.76 грн |
| MC56F8323EVME |
|
Виробник: NXP USA Inc.
Description: MC56F8322/MC56F8323 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s)
Core Processor: 56800E
Board Type: Evaluation Platform
Utilized IC / Part: MC56F8322, MC56F8323
Part Status: Active
Description: MC56F8322/MC56F8323 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s)
Core Processor: 56800E
Board Type: Evaluation Platform
Utilized IC / Part: MC56F8322, MC56F8323
Part Status: Active
товар відсутній
| MC908QY4AMDTER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Number of I/O: 13
DigiKey Programmable: Not Verified
товар відсутній
| MC908QY4AMDWER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
товар відсутній