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LPC2361FBD100,551 LPC2361FBD100,551 NXP USA Inc. LPC2361_62.pdf Description: IC MCU 16/32B 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
1+1004.31 грн
10+773.23 грн
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LPC2362FBD100,551 LPC2362FBD100,551 NXP USA Inc. LPC2361_62.pdf Description: IC MCU 16/32B 128KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC2420FBD208,551 LPC2420FBD208,551 NXP USA Inc. LPC2420_60.pdf Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
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LPC3220FET296,551 LPC3220FET296,551 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
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LPC3230FET296,551 LPC3230FET296,551 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Obsolete
Number of I/O: 51
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LPC3240FET296,551 LPC3240FET296,551 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
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LPC3250FET296,551 LPC3250FET296,551 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Obsolete
Number of I/O: 51
DigiKey Programmable: Not Verified
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BGY588C,112 BGY588C,112 NXP USA Inc. BGY588C.pdf Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Output Type: Push-Pull
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Part Status: Obsolete
Number of Circuits: 1
Current - Supply: 325 mA
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PCF2123TS/1,118 PCF2123TS/1,118 NXP USA Inc. PCF2123.pdf Description: IC RTC CLK/CALENDAR SPI 14TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 14-TSSOP
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
2500+51.40 грн
5000+48.37 грн
7500+47.80 грн
Мінімальне замовлення: 2500
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PCF2123TS/1,118 PCF2123TS/1,118 NXP USA Inc. PCF2123.pdf Description: IC RTC CLK/CALENDAR SPI 14TSSOP
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 14-TSSOP
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 10248 шт:
термін постачання 21-31 дні (днів)
4+104.25 грн
10+73.26 грн
25+66.40 грн
100+55.26 грн
250+51.90 грн
500+49.88 грн
1000+47.42 грн
Мінімальне замовлення: 4
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74ABT541DB,118 74ABT541DB,118 NXP USA Inc. DS_568_74ABT541.pdf Description: IC BUFF NON-INVERT 5.5V 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
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74HC147D,653 74HC147D,653 NXP USA Inc. 74HC%28T%29147.pdf Description: IC PRIORITY ENCOD 1 X 10:4 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 10:4
Type: Priority Encoder
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
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74HCT640D,653 74HCT640D,653 NXP USA Inc. 74HC(T)640.pdf Description: IC TRANSCEIVER INVERT 5.5V 20SO
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74LVCH162244ADGG:5 74LVCH162244ADGG:5 NXP USA Inc. 74LVC(H)162244A_Rev6_2017.pdf Description: IC BUF NON-INVERT 3.6V 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
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74LVT574PW,118 74LVT574PW,118 NXP USA Inc. 74LVT%28H%29574.pdf Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Number of Bits per Element: 8
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N74F138D,623 N74F138D,623 NXP USA Inc. DS_568_74F138.pdf Description: IC DECODER/DEMUX 1 X 3:8 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
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N74F257AD,623 N74F257AD,623 NXP USA Inc. DS_568_74F257A.pdf Description: IC MULTIPLEXER 4 X 2:1 16-SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
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MC44CC375AVEFEVK NXP USA Inc. MC44CC375AV.pdf Description: CCEVK NEJA EVAL KIT
Packaging: Bulk
For Use With/Related Products: MC44CC375AV
Type: Modulator
Supplied Contents: Board(s)
Part Status: Obsolete
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2N7002T,215 2N7002T,215 NXP USA Inc. 2N7002T_1.pdf Description: MOSFET N-CH 60V 300MA TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 300mA (Ta)
Rds On (Max) @ Id, Vgs: 5Ohm @ 500mA, 10V
Power Dissipation (Max): 830mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 1mA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Input Capacitance (Ciss) (Max) @ Vds: 40 pF @ 10 V
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74AUP1G32GW/DG,125 74AUP1G32GW/DG,125 NXP USA Inc. 74AUP1G32.pdf Description: IC GATE OR 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Part Status: Obsolete
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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74HCT423BQ,115 74HCT423BQ,115 NXP USA Inc. 74HC_HCT423_Rev_6.pdf Description: IC MULTIVIBRATOR 22NS 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 22 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply: 4.5 V ~ 5.5 V
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74LV259BQ,115 74LV259BQ,115 NXP USA Inc. 74LV259.pdf Description: IC 8BIT ADDRESS LATCH 16-DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 36ns
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Obsolete
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74LV32BQ,115 74LV32BQ,115 NXP USA Inc. 74LV32.pdf Description: IC GATE OR 4CH 2-INP 14DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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74LV86BQ,115 74LV86BQ,115 NXP USA Inc. 74LV86_Rev3_2017.pdf Description: IC GATE XOR 4CH 2-INP 14DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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74LVC126APW/DG,118 74LVC126APW/DG,118 NXP USA Inc. Description: IC BUF NON-INVERT 3.6V 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
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74LVC1G07GW/DG,125 74LVC1G07GW/DG,125 NXP USA Inc. 74LVC1G07.pdf Description: IC BUF NON-INVERT 5.5V 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 5-TSSOP
Part Status: Obsolete
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74LVC1G08GW/DG,125 74LVC1G08GW/DG,125 NXP USA Inc. Description: IC GATE AND 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
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74LVC1G125GW/DG,12 74LVC1G125GW/DG,12 NXP USA Inc. PHGLS28878-1.pdf?t.download=true&u=5oefqw Description: IC BUFF NON-INVERT 5.5V 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 5-TSSOP
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74LVC1G32GW/DG,125 74LVC1G32GW/DG,125 NXP USA Inc. Description: IC GATE OR 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 1.7ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
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74LVCH32244AEC/G;5 74LVCH32244AEC/G;5 NXP USA Inc. 74LVCH32244A.pdf Description: IC BUF NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 8
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
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74LVCH32244AEC/G:5 74LVCH32244AEC/G:5 NXP USA Inc. 74LVCH32244A.pdf Description: IC BUF NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 8
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
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74LVCH32244AEC/G,5 74LVCH32244AEC/G,5 NXP USA Inc. 74LVCH32244A.pdf Description: IC BUF NON-INVERT 3.6V 96LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 8
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
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74LVCH32245AEC/G;5 74LVCH32245AEC/G;5 NXP USA Inc. 74LVCH32245A.pdf Description: IC TXRX NON-INVERT 3.6V 96LFBGA
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74LVCH32245AEC/G:5 74LVCH32245AEC/G:5 NXP USA Inc. 74LVCH32245A.pdf Description: IC TXRX NON-INVERT 3.6V 96LFBGA
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74LVCH32374AEC/G,5 74LVCH32374AEC/G,5 NXP USA Inc. 74LVCH32374A.pdf Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
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74LVT32374EC/G,518 74LVT32374EC/G,518 NXP USA Inc. 74LVT32374.pdf Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
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74LVT574BQ,115 74LVT574BQ,115 NXP USA Inc. 74LVT(H)574.pdf Description: IC FF D-TYPE SNGL 8BIT 20DHVQFN
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74LVTH322245EC,557 74LVTH322245EC,557 NXP USA Inc. 74LVTH322245.pdf Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
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74LVTH322245EC,518 74LVTH322245EC,518 NXP USA Inc. 74LVTH322245.pdf Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
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74LVU04BQ,115 74LVU04BQ,115 NXP USA Inc. 74LVU04.pdf Description: IC INVERTER 6CH 6-INP 14DHVQFN
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ADC1207S080HW/C1,1 ADC1207S080HW/C1,1 NXP USA Inc. ADC1207S080.pdf Description: IC ADC 12BIT 48HTQFP
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BAP1321LX,315 BAP1321LX,315 NXP USA Inc. BAP1321LX.pdf Description: RF DIODE PIN 60V 130MW 2DFN
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.28pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
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BAP142LX,315 BAP142LX,315 NXP USA Inc. BAP142LX.pdf Description: RF DIODE PIN 50V 130MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
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BAP50LX,315 BAP50LX,315 NXP USA Inc. BAP50LX.pdf Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
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BAP51LX,315 BAP51LX,315 NXP USA Inc. BAP51LX.pdf Description: RF DIODE PIN 60V 140MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Current - Max: 100 mA
Power Dissipation (Max): 140 mW
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BAP55LX,315 BAP55LX,315 NXP USA Inc. BAP55LX.pdf Description: RF DIODE PIN 50V 135MW DFN1006D2
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.28pF @ 20V, 1MHz
Resistance @ If, F: 800mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: DFN1006D-2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 135 mW
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
10000+10.08 грн
Мінімальне замовлення: 10000
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BAP63LX,315 BAP63LX,315 NXP USA Inc. BAP63LX_Rev2.pdf Description: RF DIODE PIN 50V 135MW SOD2
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BAP65LX,315 BAP65LX,315 NXP USA Inc. BAP65LX.pdf Description: RF DIODE PIN 30V 135MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.37pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 135 mW
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BB202LX,315 BB202LX,315 NXP USA Inc. BB202LX_Rev2.pdf Description: DIODE LV VAR CAP 6V SOD882T
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 85°C (TJ)
Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
Capacitance Ratio Condition: C0.2/C2.3
Supplier Device Package: SOD2
Part Status: Obsolete
Voltage - Peak Reverse (Max): 6 V
Capacitance Ratio: 2.5
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BF1207,115 BF1207,115 NXP USA Inc. BF1207.pdf Description: RF MOSFET 5V 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1.3dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 18 mA
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BF1208D,115 BF1208D,115 NXP USA Inc. BF1208D_Rev1.pdf Description: RF MOSFET 5V SOT666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 32dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 0.9dB
Supplier Device Package: SOT-666
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 19 mA
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BF1210,115 BF1210,115 NXP USA Inc. BF1210_Rev1.pdf Description: RF MOSFET 5V 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 31dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 0.9dB
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 19 mA
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BF1214,115 BF1214,115 NXP USA Inc. BF1214_Rev1.pdf Description: RF MOSFET 5V 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 31dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 0.9dB
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 18 mA
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BFR92AW,135 BFR92AW,135 NXP USA Inc. BFR92AW_Rev3.pdf Description: RF TRANS NPN 15V 5GHZ SC-70
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 25mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 65 @ 15mA, 10V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 2dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SC-70
Part Status: Obsolete
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BGA2714,115 BGA2714,115 NXP USA Inc. BGA2714_Rev1.pdf Description: IC RF AMP 0HZ-2.7GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.7GHz
Voltage - Supply: 4V
Gain: 22dB
Current - Supply: 10mA
Noise Figure: 3dB
P1dB: -9dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
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BUK2114-50SYTS,118 BUK2114-50SYTS,118 NXP USA Inc. Description: IC PWR TOPFET HI SIDE SW SOT426
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Number of Outputs: 1
Output Configuration: High Side
Rds On (Typ): 14mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 35V
Current - Output (Max): 3A
Supplier Device Package: D2PAK
Part Status: Obsolete
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BUK2914-50SYTS,127 BUK2914-50SYTS,127 NXP USA Inc. Description: IC PWR TOPFET HI SIDE SOT263B-01
Packaging: Tape & Reel (TR)
Package / Case: TO-220-5 Formed Leads
Mounting Type: Through Hole
Number of Outputs: 1
Output Configuration: High Side
Rds On (Typ): 14mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 35V
Current - Output (Max): 3A
Supplier Device Package: SOT263B-01
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CBTL06121AHF,518 CBTL06121AHF,518 NXP USA Inc. CBTL06121.pdf Description: IC MULTIPLEXER TRPL 1X2 56HVQFN
Packaging: Tape & Reel (TR)
Features: Bi-Directional
Package / Case: 56-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe
-3db Bandwidth: 2.5GHz
Supplier Device Package: 56-HWQFN (5x11)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Obsolete
Number of Channels: 6
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CBTL06121BHF,518 CBTL06121BHF,518 NXP USA Inc. CBTL06121.pdf Description: IC MULTIPLEXER TRPL 1X2 56HVQFN
Packaging: Tape & Reel (TR)
Features: Bi-Directional
Package / Case: 56-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe
-3db Bandwidth: 2.5GHz
Supplier Device Package: 56-HWQFN (5x11)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Obsolete
Number of Channels: 6
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CBTL06122AHF,518 CBTL06122AHF,518 NXP USA Inc. CBTL06122.pdf Description: IC MULTIPLEXER HEX 1X2 56HWQFN
Packaging: Tape & Reel (TR)
Features: Bi-Directional
Package / Case: 56-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe
-3db Bandwidth: 2.5GHz
Supplier Device Package: 56-HWQFN (5x11)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Obsolete
Number of Channels: 6
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LPC2361FBD100,551 LPC2361_62.pdf
LPC2361FBD100,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1004.31 грн
10+773.23 грн
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LPC2362FBD100,551 LPC2361_62.pdf
LPC2362FBD100,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC2420FBD208,551 LPC2420_60.pdf
LPC2420FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
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LPC3220FET296,551 LPC3220_30_40_50.pdf
LPC3220FET296,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
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LPC3230FET296,551 LPC3220_30_40_50.pdf
LPC3230FET296,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Obsolete
Number of I/O: 51
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LPC3240FET296,551 LPC3220_30_40_50.pdf
LPC3240FET296,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
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LPC3250FET296,551 LPC3220_30_40_50.pdf
LPC3250FET296,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Obsolete
Number of I/O: 51
DigiKey Programmable: Not Verified
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BGY588C,112 BGY588C.pdf
BGY588C,112
Виробник: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Output Type: Push-Pull
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Part Status: Obsolete
Number of Circuits: 1
Current - Supply: 325 mA
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PCF2123TS/1,118 PCF2123.pdf
PCF2123TS/1,118
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR SPI 14TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 14-TSSOP
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+51.40 грн
5000+48.37 грн
7500+47.80 грн
Мінімальне замовлення: 2500
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PCF2123TS/1,118 PCF2123.pdf
PCF2123TS/1,118
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR SPI 14TSSOP
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 14-TSSOP
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 10248 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+104.25 грн
10+73.26 грн
25+66.40 грн
100+55.26 грн
250+51.90 грн
500+49.88 грн
1000+47.42 грн
Мінімальне замовлення: 4
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74ABT541DB,118 DS_568_74ABT541.pdf
74ABT541DB,118
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
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74HC147D,653 74HC%28T%29147.pdf
74HC147D,653
Виробник: NXP USA Inc.
Description: IC PRIORITY ENCOD 1 X 10:4 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 10:4
Type: Priority Encoder
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
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74HCT640D,653 74HC(T)640.pdf
74HCT640D,653
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER INVERT 5.5V 20SO
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74LVCH162244ADGG:5 74LVC(H)162244A_Rev6_2017.pdf
74LVCH162244ADGG:5
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
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74LVT574PW,118 74LVT%28H%29574.pdf
74LVT574PW,118
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Number of Bits per Element: 8
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N74F138D,623 DS_568_74F138.pdf
N74F138D,623
Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
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N74F257AD,623 DS_568_74F257A.pdf
N74F257AD,623
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16-SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
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MC44CC375AVEFEVK MC44CC375AV.pdf
Виробник: NXP USA Inc.
Description: CCEVK NEJA EVAL KIT
Packaging: Bulk
For Use With/Related Products: MC44CC375AV
Type: Modulator
Supplied Contents: Board(s)
Part Status: Obsolete
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2N7002T,215 2N7002T_1.pdf
2N7002T,215
Виробник: NXP USA Inc.
Description: MOSFET N-CH 60V 300MA TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 300mA (Ta)
Rds On (Max) @ Id, Vgs: 5Ohm @ 500mA, 10V
Power Dissipation (Max): 830mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 1mA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Input Capacitance (Ciss) (Max) @ Vds: 40 pF @ 10 V
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74AUP1G32GW/DG,125 74AUP1G32.pdf
74AUP1G32GW/DG,125
Виробник: NXP USA Inc.
Description: IC GATE OR 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Part Status: Obsolete
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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74HCT423BQ,115 74HC_HCT423_Rev_6.pdf
74HCT423BQ,115
Виробник: NXP USA Inc.
Description: IC MULTIVIBRATOR 22NS 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 22 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply: 4.5 V ~ 5.5 V
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74LV259BQ,115 74LV259.pdf
74LV259BQ,115
Виробник: NXP USA Inc.
Description: IC 8BIT ADDRESS LATCH 16-DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 36ns
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Obsolete
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74LV32BQ,115 74LV32.pdf
74LV32BQ,115
Виробник: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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74LV86BQ,115 74LV86_Rev3_2017.pdf
74LV86BQ,115
Виробник: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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74LVC126APW/DG,118
74LVC126APW/DG,118
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
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74LVC1G07GW/DG,125 74LVC1G07.pdf
74LVC1G07GW/DG,125
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 5-TSSOP
Part Status: Obsolete
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74LVC1G08GW/DG,125
74LVC1G08GW/DG,125
Виробник: NXP USA Inc.
Description: IC GATE AND 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
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74LVC1G125GW/DG,12 PHGLS28878-1.pdf?t.download=true&u=5oefqw
74LVC1G125GW/DG,12
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 5-TSSOP
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74LVC1G32GW/DG,125
74LVC1G32GW/DG,125
Виробник: NXP USA Inc.
Description: IC GATE OR 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 1.7ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
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74LVCH32244AEC/G;5 74LVCH32244A.pdf
74LVCH32244AEC/G;5
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 8
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
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74LVCH32244AEC/G:5 74LVCH32244A.pdf
74LVCH32244AEC/G:5
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 8
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
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74LVCH32244AEC/G,5 74LVCH32244A.pdf
74LVCH32244AEC/G,5
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 96LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 8
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
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74LVCH32245AEC/G;5 74LVCH32245A.pdf
74LVCH32245AEC/G;5
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
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74LVCH32245AEC/G:5 74LVCH32245A.pdf
74LVCH32245AEC/G:5
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
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74LVCH32374AEC/G,5 74LVCH32374A.pdf
74LVCH32374AEC/G,5
Виробник: NXP USA Inc.
Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
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74LVT32374EC/G,518 74LVT32374.pdf
74LVT32374EC/G,518
Виробник: NXP USA Inc.
Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
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74LVT574BQ,115 74LVT(H)574.pdf
74LVT574BQ,115
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20DHVQFN
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74LVTH322245EC,557 74LVTH322245.pdf
74LVTH322245EC,557
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
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74LVTH322245EC,518 74LVTH322245.pdf
74LVTH322245EC,518
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
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74LVU04BQ,115 74LVU04.pdf
74LVU04BQ,115
Виробник: NXP USA Inc.
Description: IC INVERTER 6CH 6-INP 14DHVQFN
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ADC1207S080HW/C1,1 ADC1207S080.pdf
ADC1207S080HW/C1,1
Виробник: NXP USA Inc.
Description: IC ADC 12BIT 48HTQFP
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BAP1321LX,315 BAP1321LX.pdf
BAP1321LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 130MW 2DFN
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.28pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
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BAP142LX,315 BAP142LX.pdf
BAP142LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 130MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
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BAP50LX,315 BAP50LX.pdf
BAP50LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
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BAP51LX,315 BAP51LX.pdf
BAP51LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 140MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Current - Max: 100 mA
Power Dissipation (Max): 140 mW
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BAP55LX,315 BAP55LX.pdf
BAP55LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 135MW DFN1006D2
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.28pF @ 20V, 1MHz
Resistance @ If, F: 800mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: DFN1006D-2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 135 mW
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10000+10.08 грн
Мінімальне замовлення: 10000
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BAP63LX,315 BAP63LX_Rev2.pdf
BAP63LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 135MW SOD2
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BAP65LX,315 BAP65LX.pdf
BAP65LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 30V 135MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.37pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 135 mW
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BB202LX,315 BB202LX_Rev2.pdf
BB202LX,315
Виробник: NXP USA Inc.
Description: DIODE LV VAR CAP 6V SOD882T
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 85°C (TJ)
Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
Capacitance Ratio Condition: C0.2/C2.3
Supplier Device Package: SOD2
Part Status: Obsolete
Voltage - Peak Reverse (Max): 6 V
Capacitance Ratio: 2.5
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BF1207,115 BF1207.pdf
BF1207,115
Виробник: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1.3dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 18 mA
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BF1208D,115 BF1208D_Rev1.pdf
BF1208D,115
Виробник: NXP USA Inc.
Description: RF MOSFET 5V SOT666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 32dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 0.9dB
Supplier Device Package: SOT-666
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 19 mA
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BF1210,115 BF1210_Rev1.pdf
BF1210,115
Виробник: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 31dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 0.9dB
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 19 mA
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BF1214,115 BF1214_Rev1.pdf
BF1214,115
Виробник: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 31dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 0.9dB
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 18 mA
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BFR92AW,135 BFR92AW_Rev3.pdf
BFR92AW,135
Виробник: NXP USA Inc.
Description: RF TRANS NPN 15V 5GHZ SC-70
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 25mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 65 @ 15mA, 10V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 2dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SC-70
Part Status: Obsolete
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BGA2714,115 BGA2714_Rev1.pdf
BGA2714,115
Виробник: NXP USA Inc.
Description: IC RF AMP 0HZ-2.7GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.7GHz
Voltage - Supply: 4V
Gain: 22dB
Current - Supply: 10mA
Noise Figure: 3dB
P1dB: -9dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
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BUK2114-50SYTS,118
BUK2114-50SYTS,118
Виробник: NXP USA Inc.
Description: IC PWR TOPFET HI SIDE SW SOT426
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Number of Outputs: 1
Output Configuration: High Side
Rds On (Typ): 14mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 35V
Current - Output (Max): 3A
Supplier Device Package: D2PAK
Part Status: Obsolete
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BUK2914-50SYTS,127
BUK2914-50SYTS,127
Виробник: NXP USA Inc.
Description: IC PWR TOPFET HI SIDE SOT263B-01
Packaging: Tape & Reel (TR)
Package / Case: TO-220-5 Formed Leads
Mounting Type: Through Hole
Number of Outputs: 1
Output Configuration: High Side
Rds On (Typ): 14mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 35V
Current - Output (Max): 3A
Supplier Device Package: SOT263B-01
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CBTL06121AHF,518 CBTL06121.pdf
CBTL06121AHF,518
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER TRPL 1X2 56HVQFN
Packaging: Tape & Reel (TR)
Features: Bi-Directional
Package / Case: 56-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe
-3db Bandwidth: 2.5GHz
Supplier Device Package: 56-HWQFN (5x11)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Obsolete
Number of Channels: 6
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CBTL06121BHF,518 CBTL06121.pdf
CBTL06121BHF,518
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER TRPL 1X2 56HVQFN
Packaging: Tape & Reel (TR)
Features: Bi-Directional
Package / Case: 56-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe
-3db Bandwidth: 2.5GHz
Supplier Device Package: 56-HWQFN (5x11)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Obsolete
Number of Channels: 6
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CBTL06122AHF,518 CBTL06122.pdf
CBTL06122AHF,518
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER HEX 1X2 56HWQFN
Packaging: Tape & Reel (TR)
Features: Bi-Directional
Package / Case: 56-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe
-3db Bandwidth: 2.5GHz
Supplier Device Package: 56-HWQFN (5x11)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Obsolete
Number of Channels: 6
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