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MCF52255CAF80 MCF52255CAF80 NXP USA Inc. MCF52259.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 56
DigiKey Programmable: Not Verified
на замовлення 1082 шт:
термін постачання 21-31 дні (днів)
1+1806.90 грн
10+1396.72 грн
25+1310.88 грн
80+1153.68 грн
230+1102.83 грн
450+1077.53 грн
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MCF52256CAG66 MCF52256CAG66 NXP USA Inc. MCF52259.pdf Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
на замовлення 231 шт:
термін постачання 21-31 дні (днів)
1+1168.61 грн
10+871.98 грн
25+867.85 грн
В кошику  од. на суму  грн.
MCF52258AG80 MCF52258AG80 NXP USA Inc. MCF52259.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 96
DigiKey Programmable: Not Verified
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MCF52258CAG66 MCF52258CAG66 NXP USA Inc. MCF52259.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
на замовлення 389 шт:
термін постачання 21-31 дні (днів)
1+1727.51 грн
10+1334.41 грн
25+1252.26 грн
100+1090.46 грн
300+1043.21 грн
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MCF52258CVN66 MCF52258CVN66 NXP USA Inc. MCF52259.pdf Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 96
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MCF52259CAG80 MCF52259CAG80 NXP USA Inc. MCF52259.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
на замовлення 546 шт:
термін постачання 21-31 дні (днів)
1+1786.26 грн
10+1383.34 грн
25+1299.29 грн
100+1132.64 грн
300+1084.29 грн
В кошику  од. на суму  грн.
MCF52259CVN80 MCF52259CVN80 NXP USA Inc. MCF52259.pdf Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
1+2029.19 грн
10+1567.51 грн
80+1338.56 грн
В кошику  од. на суму  грн.
MC9S08EL16CTL MC9S08EL16CTL NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 16KB FLASH 28TSSOP
на замовлення 349 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
MC9S08EL32CTJ MC9S08EL32CTJ NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 32KB FLASH 20TSSOP
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MC9S08EL32CTL MC9S08EL32CTL NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 32KB FLASH 28TSSOP
на замовлення 147 шт:
термін постачання 21-31 дні (днів)
1+593.83 грн
10+499.67 грн
В кошику  од. на суму  грн.
MC9S08SL16CTL MC9S08SL16CTL NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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MC9S08SL8CTJ MC9S08SL8CTJ NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tray
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
на замовлення 339 шт:
термін постачання 21-31 дні (днів)
1+541.43 грн
10+410.07 грн
150+339.49 грн
В кошику  од. на суму  грн.
MC9S08SL8CTL MC9S08SL8CTL NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tray
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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MC9S08QB8CGK MC9S08QB8CGK NXP USA Inc. 9S08QB84FS.pdf Description: IC MCU 8BIT 8KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 24-HVQFN (5x5)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 2450 шт:
термін постачання 21-31 дні (днів)
2+251.66 грн
10+189.67 грн
80+155.44 грн
490+142.80 грн
980+120.44 грн
2450+114.41 грн
Мінімальне замовлення: 2
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MC9S08QB8CTG MC9S08QB8CTG NXP USA Inc. MC9S08QB8.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
на замовлення 829 шт:
термін постачання 21-31 дні (днів)
1+338.20 грн
10+254.57 грн
100+208.58 грн
500+191.63 грн
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MC9S08QB8CWL MC9S08QB8CWL NXP USA Inc. 9S08QB84FS.pdf Description: IC MCU 8BIT 8KB FLASH 28SOIC
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OM6290,598 OM6290,598 NXP USA Inc. OM6290_UM.pdf Description: EVAL BRD PCF2119 PCF8531 PCF8576
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PCF2119, PCF8531, PCF8576
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 16/32-Bit
Part Status: Obsolete
Contents: Board(s), Cable(s)
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OM6293,598 OM6293,598 NXP USA Inc. OM6293_Man.pdf Description: EVAL BOARD FOR PCA9600
Packaging: Bulk
Function: I2C Bus Buffer
Type: Interface
Utilized IC / Part: PCA9600
Supplied Contents: Board(s)
Embedded: No
Part Status: Obsolete
Contents: Board(s)
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PX1011B-EL1/N,551 PX1011B-EL1/N,551 NXP USA Inc. PX1011B.pdf Description: IC INTFACE SPECIALIZED 81LFBGA
Packaging: Tray
Package / Case: 81-LFBGA
Mounting Type: Surface Mount
Interface: JTAG
Voltage - Supply: 1.2V
Applications: PCI Express MAX to PCI Express PHY
Supplier Device Package: 81-LFBGA (9x9)
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SC16C850SVIBS,151 SC16C850SVIBS,151 NXP USA Inc. SC16C850SV.pdf Description: IC UART SINGLE W/FIFO 32-HVQFN
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SC18IS600IBS,151 SC18IS600IBS,151 NXP USA Inc. SC18IS600.pdf Description: IC SPI TO I2C BUS 24-HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I²C
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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SC18IS601IBS,151 SC18IS601IBS,151 NXP USA Inc. SC18IS600.pdf Description: IC SPI TO I2C BUS 24-HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PCA9600DP,118 PCA9600DP,118 NXP USA Inc. PCA9600.pdf Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.2mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
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OM5571/N5122S01,69 NXP USA Inc. Description: KIT DEMO PN512C1 2 BOARDS
Packaging: Box
For Use With/Related Products: PN512
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
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OM5588/N5331U01,69 OM5588/N5331U01,69 NXP USA Inc. Description: KIT DEMO PN533/C207
Packaging: Box
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Contents: Board(s), Cable(s)
Utilized IC / Part: PN533
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PIP213-12M,518 PIP213-12M,518 NXP USA Inc. PIP213-12M.pdf Description: IC HALF BRIDGE DRVR 25A 56HVQFN
Packaging: Tape & Reel (TR)
Features: Bootstrap Circuit, 5V Regulated Output
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: PWM
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 3.3V ~ 16V
Rds On (Typ): 3.8mOhm LS, 6.5mOhm HS
Applications: Synchronous Buck Converters
Current - Output / Channel: 25A
Current - Peak Output: 40A
Technology: DrMOS
Voltage - Load: 24V (Max)
Supplier Device Package: 56-HVQFN (8x8)
Fault Protection: Over Temperature, UVLO
Load Type: Inductive
Part Status: Obsolete
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BFG540/XR,215 BFG540/XR,215 NXP USA Inc. BFG540_X_XR_Rev5.pdf Description: RF TRANS NPN 15V 9GHZ SOT-143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 400mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 2.4dB @ 900MHz
Supplier Device Package: SOT-143R
Part Status: Obsolete
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74HCT299PW,112 74HCT299PW,112 NXP USA Inc. 74HC%28T%29299.pdf Description: IC UNIV SHIFT REGISTER 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 2
Function: Universal
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-TSSOP
Number of Bits per Element: 8
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74HCT299PW,118 74HCT299PW,118 NXP USA Inc. 74HC%28T%29299.pdf Description: IC UNIV SHIFT REGISTER 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 2
Function: Universal
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-TSSOP
Number of Bits per Element: 8
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74LVC543ABQ,118 74LVC543ABQ,118 NXP USA Inc. 74LVC543A.pdf Description: IC TXRX NON-INVERT 3.6V 24DHVQFN
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BF1105R,215 BF1105R,215 NXP USA Inc. BF1105_R_WR.pdf Description: RF MOSFET 5V SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Gain: 20dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1.7dB
Supplier Device Package: SOT-143R
Part Status: Obsolete
Voltage - Rated: 7 V
Voltage - Test: 5 V
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BUT11AI,127 BUT11AI,127 NXP USA Inc. BUT11AI_2.pdf Description: TRANS NPN 450V 5A TO-220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.5V @ 330mA, 2.5A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 14 @ 500mA, 5V
Supplier Device Package: TO-220AB
Part Status: Obsolete
Current - Collector (Ic) (Max): 5 A
Voltage - Collector Emitter Breakdown (Max): 450 V
Power - Max: 100 W
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BUT11APX-1200,127 BUT11APX-1200,127 NXP USA Inc. BUT11APX-1200_1.pdf Description: TRANS NPN 550V 6A TO-220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 400mA, 2A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 500mA, 5V
Supplier Device Package: TO-220F
Part Status: Obsolete
Current - Collector (Ic) (Max): 6 A
Voltage - Collector Emitter Breakdown (Max): 550 V
Power - Max: 32 W
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CBTV4012EE/G,518 NXP USA Inc. Description: IC MULTIPLEXER 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Type: Multiplexer
Operating Temperature: 0°C ~ 85°C
Voltage Supply Source: Single Supply
Supplier Device Package: 64-TFBGA (7x7)
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CBTV4012EE,551 NXP USA Inc. Description: IC MUX/BUS SW 10BIT 64-TFBGA
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CBTV4012EE,518 NXP USA Inc. Description: IC MULTIPLEXER 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Type: Multiplexer
Operating Temperature: 0°C ~ 85°C
Voltage Supply Source: Single Supply
Supplier Device Package: 64-TFBGA (7x7)
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GTL2002D/DG,118 GTL2002D/DG,118 NXP USA Inc. GTL2002.pdf Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-SO
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
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GTL2002DP/DG,118 GTL2002DP/DG,118 NXP USA Inc. GTL2002.pdf Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
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GTL2002DP/S440,118 GTL2002DP/S440,118 NXP USA Inc. GTL2002.pdf Description: IC TRNSLTR BIDIRECTIONAL 8TSSOP
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HEC4094BT,118 HEC4094BT,118 NXP USA Inc. HEF4094B.pdf Description: IC BUS REGISTER 8STAGE 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 15.5V
Supplier Device Package: 16-SO
Part Status: Active
Number of Bits per Element: 8
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KTY81/110,116 KTY81/110,116 NXP USA Inc. KTY81_SER.pdf Description: SENSOR PTC 1KOHM PBCYT2
Packaging: Tape & Reel (TR)
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Part Status: Obsolete
Resistance @ 25°C: 1 kOhms
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KTY81/210,116 KTY81/210,116 NXP USA Inc. KTY81_SER.pdf Description: SENSOR PTC 2KOHM PBCYT2
Packaging: Tape & Reel (TR)
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Part Status: Obsolete
Resistance @ 25°C: 2 kOhms
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KTY81/220,116 NXP USA Inc. KTY81_SER.pdf Description: SENSOR PTC 2KOHM PBCYT2
Packaging: Tape & Reel (TR)
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Part Status: Obsolete
Resistance @ 25°C: 2 kOhms
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KTY83/110,153 KTY83/110,153 NXP USA Inc. KTY83_SER.pdf Description: SENSOR PTC 1KOHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 1 kOhms
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KTY83/120,153 KTY83/120,153 NXP USA Inc. KTY83_SER.pdf Description: SENSOR PTC 1KOHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 1 kOhms
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KTY83/121,153 KTY83/121,153 NXP USA Inc. KTY83_SER.pdf Description: SENSOR PTC 990OHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 990 Ohms
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KTY83/122,153 KTY83/122,153 NXP USA Inc. KTY83_SER.pdf Description: SENSOR PTC 1.01KOHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 1.01 kOhms
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KTY83/150,153 KTY83/150,153 NXP USA Inc. KTY83_SER.pdf Description: SENSOR PTC 1KOHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 1 kOhms
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KTY84/130,153 KTY84/130,153 NXP USA Inc. KTY84_SER.pdf Description: SENSOR PTC 603OHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 300°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 603 Ohms
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LM75BD,112 LM75BD,112 NXP USA Inc. LM75B.pdf Description: SENSOR DIGITAL -55C-125C 8SO
Packaging: Tube
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
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NE58633BS,157 NE58633BS,157 NXP USA Inc. NE58633.pdf Description: IC AMP CLASS D STER 40MW 32HVQFN
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NE58633BS,115 NE58633BS,115 NXP USA Inc. NE58633.pdf Description: IC AMP CLASS D STER 40MW 32HVQFN
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, Microphone, Mute, Short-Circuit Protection
Package / Case: 32-VFQFN Exposed Pad
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 0.9V ~ 1.7V
Max Output Power x Channels @ Load: 40mW x 2 @ 16Ohm
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
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NX3L1G384GM,115 NX3L1G384GM,115 NXP USA Inc. NX3L1G384.pdf Description: IC SW SPST-NCX1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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NX3L1G384GM,132 NX3L1G384GM,132 NXP USA Inc. NX3L1G384.pdf Description: IC SW SPST-NCX1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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NX3L1G53GM,125 NX3L1G53GM,125 NXP USA Inc. NX3L1G53.pdf Description: IC SWITCH SPDTX1 750MOHM 8XQFNU
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
4000+28.44 грн
Мінімальне замовлення: 4000
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NX3L1T3157GW,125 NX3L1T3157GW,125 NXP USA Inc. NX3L1T3157.pdf Description: IC SWITCH SPDTX1 500MOHM 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 500mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L2G66GM,125 NX3L2G66GM,125 NXP USA Inc. NX3L2G66.pdf Description: IC SW SPST-NOX2 750MOHM 8XQFNU
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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NX3V1G66GM,132 NX3V1G66GM,132 NXP USA Inc. NX3V1G66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3V1G66GW,125 NX3V1G66GW,125 NXP USA Inc. NX3V1G66.pdf Description: IC SW SPST-NOX1 450MOHM 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 5-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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NX3V1T66GM,132 NX3V1T66GM,132 NXP USA Inc. NX3V1T66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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MCF52255CAF80 MCF52259.pdf
MCF52255CAF80
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 56
DigiKey Programmable: Not Verified
на замовлення 1082 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1806.90 грн
10+1396.72 грн
25+1310.88 грн
80+1153.68 грн
230+1102.83 грн
450+1077.53 грн
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MCF52256CAG66 MCF52259.pdf
MCF52256CAG66
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
на замовлення 231 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1168.61 грн
10+871.98 грн
25+867.85 грн
В кошику  од. на суму  грн.
MCF52258AG80 MCF52259.pdf
MCF52258AG80
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 96
DigiKey Programmable: Not Verified
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MCF52258CAG66 MCF52259.pdf
MCF52258CAG66
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
на замовлення 389 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1727.51 грн
10+1334.41 грн
25+1252.26 грн
100+1090.46 грн
300+1043.21 грн
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MCF52258CVN66 MCF52259.pdf
MCF52258CVN66
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 96
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MCF52259CAG80 MCF52259.pdf
MCF52259CAG80
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
на замовлення 546 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1786.26 грн
10+1383.34 грн
25+1299.29 грн
100+1132.64 грн
300+1084.29 грн
В кошику  од. на суму  грн.
MCF52259CVN80 MCF52259.pdf
MCF52259CVN80
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2029.19 грн
10+1567.51 грн
80+1338.56 грн
В кошику  од. на суму  грн.
MC9S08EL16CTL MC9S08EL32.pdf
MC9S08EL16CTL
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
на замовлення 349 шт:
термін постачання 21-31 дні (днів)
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MC9S08EL32CTJ MC9S08EL32.pdf
MC9S08EL32CTJ
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 20TSSOP
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MC9S08EL32CTL MC9S08EL32.pdf
MC9S08EL32CTL
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
на замовлення 147 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+593.83 грн
10+499.67 грн
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MC9S08SL16CTL MC9S08EL32.pdf
MC9S08SL16CTL
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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MC9S08SL8CTJ MC9S08EL32.pdf
MC9S08SL8CTJ
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tray
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
на замовлення 339 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+541.43 грн
10+410.07 грн
150+339.49 грн
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MC9S08SL8CTL MC9S08EL32.pdf
MC9S08SL8CTL
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tray
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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MC9S08QB8CGK 9S08QB84FS.pdf
MC9S08QB8CGK
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 24-HVQFN (5x5)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 2450 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+251.66 грн
10+189.67 грн
80+155.44 грн
490+142.80 грн
980+120.44 грн
2450+114.41 грн
Мінімальне замовлення: 2
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MC9S08QB8CTG MC9S08QB8.pdf
MC9S08QB8CTG
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
на замовлення 829 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+338.20 грн
10+254.57 грн
100+208.58 грн
500+191.63 грн
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MC9S08QB8CWL 9S08QB84FS.pdf
MC9S08QB8CWL
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28SOIC
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OM6290,598 OM6290_UM.pdf
OM6290,598
Виробник: NXP USA Inc.
Description: EVAL BRD PCF2119 PCF8531 PCF8576
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PCF2119, PCF8531, PCF8576
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 16/32-Bit
Part Status: Obsolete
Contents: Board(s), Cable(s)
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OM6293,598 OM6293_Man.pdf
OM6293,598
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PCA9600
Packaging: Bulk
Function: I2C Bus Buffer
Type: Interface
Utilized IC / Part: PCA9600
Supplied Contents: Board(s)
Embedded: No
Part Status: Obsolete
Contents: Board(s)
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PX1011B-EL1/N,551 PX1011B.pdf
PX1011B-EL1/N,551
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 81LFBGA
Packaging: Tray
Package / Case: 81-LFBGA
Mounting Type: Surface Mount
Interface: JTAG
Voltage - Supply: 1.2V
Applications: PCI Express MAX to PCI Express PHY
Supplier Device Package: 81-LFBGA (9x9)
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SC16C850SVIBS,151 SC16C850SV.pdf
SC16C850SVIBS,151
Виробник: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 32-HVQFN
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SC18IS600IBS,151 SC18IS600.pdf
SC18IS600IBS,151
Виробник: NXP USA Inc.
Description: IC SPI TO I2C BUS 24-HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I²C
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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SC18IS601IBS,151 SC18IS600.pdf
SC18IS601IBS,151
Виробник: NXP USA Inc.
Description: IC SPI TO I2C BUS 24-HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PCA9600DP,118 PCA9600.pdf
PCA9600DP,118
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.2mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
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OM5571/N5122S01,69
Виробник: NXP USA Inc.
Description: KIT DEMO PN512C1 2 BOARDS
Packaging: Box
For Use With/Related Products: PN512
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
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OM5588/N5331U01,69
OM5588/N5331U01,69
Виробник: NXP USA Inc.
Description: KIT DEMO PN533/C207
Packaging: Box
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Contents: Board(s), Cable(s)
Utilized IC / Part: PN533
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PIP213-12M,518 PIP213-12M.pdf
PIP213-12M,518
Виробник: NXP USA Inc.
Description: IC HALF BRIDGE DRVR 25A 56HVQFN
Packaging: Tape & Reel (TR)
Features: Bootstrap Circuit, 5V Regulated Output
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: PWM
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 3.3V ~ 16V
Rds On (Typ): 3.8mOhm LS, 6.5mOhm HS
Applications: Synchronous Buck Converters
Current - Output / Channel: 25A
Current - Peak Output: 40A
Technology: DrMOS
Voltage - Load: 24V (Max)
Supplier Device Package: 56-HVQFN (8x8)
Fault Protection: Over Temperature, UVLO
Load Type: Inductive
Part Status: Obsolete
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BFG540/XR,215 BFG540_X_XR_Rev5.pdf
BFG540/XR,215
Виробник: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SOT-143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 400mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 2.4dB @ 900MHz
Supplier Device Package: SOT-143R
Part Status: Obsolete
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74HCT299PW,112 74HC%28T%29299.pdf
74HCT299PW,112
Виробник: NXP USA Inc.
Description: IC UNIV SHIFT REGISTER 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 2
Function: Universal
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-TSSOP
Number of Bits per Element: 8
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74HCT299PW,118 74HC%28T%29299.pdf
74HCT299PW,118
Виробник: NXP USA Inc.
Description: IC UNIV SHIFT REGISTER 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 2
Function: Universal
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-TSSOP
Number of Bits per Element: 8
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74LVC543ABQ,118 74LVC543A.pdf
74LVC543ABQ,118
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 24DHVQFN
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BF1105R,215 BF1105_R_WR.pdf
BF1105R,215
Виробник: NXP USA Inc.
Description: RF MOSFET 5V SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Gain: 20dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1.7dB
Supplier Device Package: SOT-143R
Part Status: Obsolete
Voltage - Rated: 7 V
Voltage - Test: 5 V
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BUT11AI,127 BUT11AI_2.pdf
BUT11AI,127
Виробник: NXP USA Inc.
Description: TRANS NPN 450V 5A TO-220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.5V @ 330mA, 2.5A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 14 @ 500mA, 5V
Supplier Device Package: TO-220AB
Part Status: Obsolete
Current - Collector (Ic) (Max): 5 A
Voltage - Collector Emitter Breakdown (Max): 450 V
Power - Max: 100 W
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BUT11APX-1200,127 BUT11APX-1200_1.pdf
BUT11APX-1200,127
Виробник: NXP USA Inc.
Description: TRANS NPN 550V 6A TO-220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 400mA, 2A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 500mA, 5V
Supplier Device Package: TO-220F
Part Status: Obsolete
Current - Collector (Ic) (Max): 6 A
Voltage - Collector Emitter Breakdown (Max): 550 V
Power - Max: 32 W
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CBTV4012EE/G,518
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Type: Multiplexer
Operating Temperature: 0°C ~ 85°C
Voltage Supply Source: Single Supply
Supplier Device Package: 64-TFBGA (7x7)
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CBTV4012EE,551
Виробник: NXP USA Inc.
Description: IC MUX/BUS SW 10BIT 64-TFBGA
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CBTV4012EE,518
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Type: Multiplexer
Operating Temperature: 0°C ~ 85°C
Voltage Supply Source: Single Supply
Supplier Device Package: 64-TFBGA (7x7)
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GTL2002D/DG,118 GTL2002.pdf
GTL2002D/DG,118
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-SO
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
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GTL2002DP/DG,118 GTL2002.pdf
GTL2002DP/DG,118
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
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GTL2002DP/S440,118 GTL2002.pdf
GTL2002DP/S440,118
Виробник: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 8TSSOP
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HEC4094BT,118 HEF4094B.pdf
HEC4094BT,118
Виробник: NXP USA Inc.
Description: IC BUS REGISTER 8STAGE 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 15.5V
Supplier Device Package: 16-SO
Part Status: Active
Number of Bits per Element: 8
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KTY81/110,116 KTY81_SER.pdf
KTY81/110,116
Виробник: NXP USA Inc.
Description: SENSOR PTC 1KOHM PBCYT2
Packaging: Tape & Reel (TR)
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Part Status: Obsolete
Resistance @ 25°C: 1 kOhms
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KTY81/210,116 KTY81_SER.pdf
KTY81/210,116
Виробник: NXP USA Inc.
Description: SENSOR PTC 2KOHM PBCYT2
Packaging: Tape & Reel (TR)
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Part Status: Obsolete
Resistance @ 25°C: 2 kOhms
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KTY81/220,116 KTY81_SER.pdf
Виробник: NXP USA Inc.
Description: SENSOR PTC 2KOHM PBCYT2
Packaging: Tape & Reel (TR)
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Part Status: Obsolete
Resistance @ 25°C: 2 kOhms
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KTY83/110,153 KTY83_SER.pdf
KTY83/110,153
Виробник: NXP USA Inc.
Description: SENSOR PTC 1KOHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 1 kOhms
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KTY83/120,153 KTY83_SER.pdf
KTY83/120,153
Виробник: NXP USA Inc.
Description: SENSOR PTC 1KOHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 1 kOhms
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KTY83/121,153 KTY83_SER.pdf
KTY83/121,153
Виробник: NXP USA Inc.
Description: SENSOR PTC 990OHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 990 Ohms
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KTY83/122,153 KTY83_SER.pdf
KTY83/122,153
Виробник: NXP USA Inc.
Description: SENSOR PTC 1.01KOHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 1.01 kOhms
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KTY83/150,153 KTY83_SER.pdf
KTY83/150,153
Виробник: NXP USA Inc.
Description: SENSOR PTC 1KOHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 1 kOhms
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KTY84/130,153 KTY84_SER.pdf
KTY84/130,153
Виробник: NXP USA Inc.
Description: SENSOR PTC 603OHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 300°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 603 Ohms
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LM75BD,112 LM75B.pdf
LM75BD,112
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8SO
Packaging: Tube
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
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NE58633BS,157 NE58633.pdf
NE58633BS,157
Виробник: NXP USA Inc.
Description: IC AMP CLASS D STER 40MW 32HVQFN
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NE58633BS,115 NE58633.pdf
NE58633BS,115
Виробник: NXP USA Inc.
Description: IC AMP CLASS D STER 40MW 32HVQFN
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, Microphone, Mute, Short-Circuit Protection
Package / Case: 32-VFQFN Exposed Pad
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 0.9V ~ 1.7V
Max Output Power x Channels @ Load: 40mW x 2 @ 16Ohm
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
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NX3L1G384GM,115 NX3L1G384.pdf
NX3L1G384GM,115
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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NX3L1G384GM,132 NX3L1G384.pdf
NX3L1G384GM,132
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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NX3L1G53GM,125 NX3L1G53.pdf
NX3L1G53GM,125
Виробник: NXP USA Inc.
Description: IC SWITCH SPDTX1 750MOHM 8XQFNU
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4000+28.44 грн
Мінімальне замовлення: 4000
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NX3L1T3157GW,125 NX3L1T3157.pdf
NX3L1T3157GW,125
Виробник: NXP USA Inc.
Description: IC SWITCH SPDTX1 500MOHM 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 500mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L2G66GM,125 NX3L2G66.pdf
NX3L2G66GM,125
Виробник: NXP USA Inc.
Description: IC SW SPST-NOX2 750MOHM 8XQFNU
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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NX3V1G66GM,132 NX3V1G66.pdf
NX3V1G66GM,132
Виробник: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3V1G66GW,125 NX3V1G66.pdf
NX3V1G66GW,125
Виробник: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 5-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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NX3V1T66GM,132 NX3V1T66.pdf
NX3V1T66GM,132
Виробник: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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