Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35301) > Сторінка 152 з 589
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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MRF7S15100HSR3 | NXP USA Inc. |
 Description: RF MOSFET LDMOS 28V NI780Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 1.51GHz Power - Output: 23W Gain: 19.5dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 600 mA |
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| MRF7S35015HSR3 | NXP USA Inc. |
Description: FET RF 65V 3.5GHZ NI-400S-240 Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 3.1GHz ~ 3.5GHz Power - Output: 15W Gain: 16dB Technology: LDMOS Supplier Device Package: NI-400S-2S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 32 V Current - Test: 50 mA |
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| MRF7S35015HSR5 | NXP USA Inc. |
Description: FET RF 65V 3.5GHZ NI-400S-240 Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 3.1GHz ~ 3.5GHz Power - Output: 15W Gain: 16dB Technology: LDMOS Supplier Device Package: NI-400S-2S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 32 V Current - Test: 50 mA |
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MRF8S18120HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 1.81GHz Power - Output: 72W Gain: 18.2dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 800 mA |
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MRF8S18120HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 1.81GHz Power - Output: 72W Gain: 18.2dB Technology: LDMOS Supplier Device Package: NI-780S Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 800 mA |
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MRF8S9100HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 920MHz Power - Output: 72W Gain: 19.3dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Obsolete Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 500 mA |
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MRF8S9100HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 920MHz Power - Output: 72W Gain: 19.3dB Technology: LDMOS Supplier Device Package: NI-780S Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 500 mA |
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MRF8S9200NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2 Mounting Type: Surface Mount Frequency: 940MHz Power - Output: 58W Gain: 19.9dB Technology: LDMOS Supplier Device Package: OM-780-2 Part Status: Obsolete Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 1.4 A |
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MRFE6S8046GNR1 | NXP USA Inc. |
Description: FET RF 66V 894MHZ TO-270-4 |
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MRFE6S8046NR1 | NXP USA Inc. |
Description: FET RF 66V 894MHZ TO-270-4 |
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MRFE6S9046GNR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-4 Packaging: Tape & Reel (TR) Package / Case: TO-270BB Mounting Type: Surface Mount Frequency: 960MHz Power - Output: 35.5W Gain: 19dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Gull Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 300 mA |
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MSC8113TMP3600V | NXP USA Inc. |
Description: DSP TRI-CORE 431FCBGA Packaging: Tray Package / Case: 431-BFBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I²C, TDM, UART Type: SC140 Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.10V Clock Rate: 300MHz Supplier Device Package: 431-FCPBGA (20x20) Part Status: Obsolete |
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| MSC8144AMC-SA | NXP USA Inc. |
Description: MSC8144 EVAL BRD |
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MSC8144ESVT1000B | NXP USA Inc. |
Description: ENCRYPTION PACSUN R2.1 783FCBGA |
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MSC8144ESVT800B | NXP USA Inc. |
Description: ENCRYPTION PACSUN R2.1 783FCBGA |
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MSC8144ETVT1000B | NXP USA Inc. |
Description: ENCRYPTION PACSUN R2.1 783FCBGA |
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MSC8144ETVT800B | NXP USA Inc. |
Description: ENCRYPTION PACSUN R2.1 783FCBGA |
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MSC8144EVT1000B | NXP USA Inc. |
Description: ENCRYPTION PACSUN R2.1 783FCBGA |
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MSC8144EVT800B | NXP USA Inc. |
Description: ENCRYPTION PACSUN R2.1 783FCBGA |
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MSC8144SVT1000B | NXP USA Inc. |
Description: ENCRYPTION PACSUN R2.1 783FCBGA |
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MSC8144SVT800B | NXP USA Inc. |
Description: ENCRYPTION PACSUN R2.1 783FCBGA |
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MSC8144TVT1000B | NXP USA Inc. |
Description: ENCRYPTION PACSUN R2.1 783FCBGA |
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MSC8144TVT800B | NXP USA Inc. |
Description: ENCRYPTION PACSUN R2.1 783FCBGA |
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MSC8144VT1000B | NXP USA Inc. |
Description: ENCRYPTION PACSUN R2.1 783FCBGA |
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MW7IC008NT1 | NXP USA Inc. |
Description: IC RF AMP GPS 100MHZ-1GHZ 24QFN Packaging: Tape & Reel (TR) Package / Case: 24-PowerQFN Mounting Type: Surface Mount Frequency: 100MHz ~ 1GHz RF Type: General Purpose Voltage - Supply: 32V Gain: 23.5dB Current - Supply: 75mA P1dB: 40.4dBm Test Frequency: 100MHz Supplier Device Package: 24-PQFN (8x8) Part Status: Not For New Designs |
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MW7IC2040NBR1 | NXP USA Inc. |
Description: IC AMP GP 100MHZ-1GHZ TO272 WB16 |
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| MW7IC2240GNR1 | NXP USA Inc. |
Description: IC AMP W-CDMA 2.11-2.17GHZ TO270 Packaging: Tape & Reel (TR) Package / Case: TO-270-16 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 2.11GHz ~ 2.17GHz RF Type: W-CDMA Voltage - Supply: 32V Gain: 30dB Current - Supply: 420mA P1dB: 46dBm Test Frequency: 2.14GHz Supplier Device Package: TO-270 WBL-16 GULL Part Status: Obsolete |
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MW7IC2425NBR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO272-16 Packaging: Tape & Reel (TR) Package / Case: TO-272-16 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 2.45GHz Power - Output: 25W Gain: 27.7dB Technology: LDMOS Supplier Device Package: TO-272 WB-16 Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 55 mA |
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| MW7IC2725GNR1 | NXP USA Inc. |
Description: IC RF AMP WIMAX 2.7GHZ TO270 Packaging: Tape & Reel (TR) Package / Case: TO-270-16 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 2.7GHz RF Type: WiMax Voltage - Supply: 32V Gain: 28.5dB Current - Supply: 275mA P1dB: 44dBm Test Frequency: 2.7GHz Supplier Device Package: TO-270 WBL-16 GULL |
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MW7IC2725NBR1 | NXP USA Inc. |
Description: IC RF AMP WIMAX 2.7GHZ TO272WB Packaging: Tape & Reel (TR) Package / Case: TO-272-16 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 2.7GHz RF Type: WiMax Voltage - Supply: 32V Gain: 28.5dB Current - Supply: 275mA P1dB: 44dBm Test Frequency: 2.7GHz Supplier Device Package: TO-272 WB-16 Part Status: Obsolete |
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MW7IC2725NR1 | NXP USA Inc. |
Description: IC RF AMP WIMAX 2.7GHZ TO270 Packaging: Tape & Reel (TR) Package / Case: TO-270-16 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 2.7GHz RF Type: WiMax Voltage - Supply: 32V Gain: 28.5dB Current - Supply: 275mA P1dB: 44dBm Test Frequency: 2.7GHz Supplier Device Package: TO-270 WBL-16 |
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MW7IC2750NR1 | NXP USA Inc. |
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ TO270 Packaging: Tape & Reel (TR) Package / Case: TO-270-14 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 2.3GHz ~ 2.7GHz RF Type: WiMax Voltage - Supply: 28V Gain: 26dB Current - Supply: 550mA P1dB: 47dBm Test Frequency: 2.7GHz Supplier Device Package: TO-270 WB-14 Part Status: Obsolete |
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| MW7IC930GNR1 | NXP USA Inc. |
Description: IC AMP W-CDMA 728-768MHZ TO270 |
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P4080PSE1MZA | NXP USA Inc. | Description: IC MPU Q OR IQ 1.5GHZ 1295FCBGA |
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PC8144EVT1000 | NXP USA Inc. |
Description: DSP 1GHZ LOW TEMP 783BGA Packaging: Tray Package / Case: 783-BFBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I²C, SPI, TDM, UART, UTOPIA Type: SC3400 Core Operating Temperature: 0°C ~ 90°C (TJ) Non-Volatile Memory: External On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Clock Rate: 1GHz Supplier Device Package: 783-FCPBGA (29x29) Part Status: Obsolete |
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PC8144EVT800 | NXP USA Inc. |
Description: DSP 800MHZ LOW TEMP 783BGA Packaging: Tray Package / Case: 783-BFBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I²C, SPI, TDM, UART, UTOPIA Type: SC3400 Core Operating Temperature: 0°C ~ 90°C (TJ) Non-Volatile Memory: External On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Clock Rate: 800MHz Supplier Device Package: 783-FCPBGA (29x29) Part Status: Obsolete |
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PC8144TVT1000 | NXP USA Inc. |
Description: DSP 1GHZ HI-TEMP 783BGA Packaging: Tray Package / Case: 783-BFBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I²C, SPI, TDM, UART, UTOPIA Type: SC3400 Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: External On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Clock Rate: 1GHz Supplier Device Package: 783-FCPBGA (29x29) Part Status: Obsolete |
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PC8144TVT800 | NXP USA Inc. |
Description: DSP 800MHZ HI-TEMP 783BGA Packaging: Tray Package / Case: 783-BFBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I²C, SPI, TDM, UART, UTOPIA Type: SC3400 Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: External On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Clock Rate: 800MHz Supplier Device Package: 783-FCPBGA (29x29) Part Status: Obsolete |
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PC9S08AC128CFGE | NXP USA Inc. |
Description: IC MCU 8BIT 128KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Obsolete Number of I/O: 38 DigiKey Programmable: Not Verified |
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PC9S08AC128CLKE | NXP USA Inc. |
Description: IC MCU 8BIT 128KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Part Status: Obsolete Number of I/O: 69 DigiKey Programmable: Not Verified |
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PCF51AC128ACFUE | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 64-QFP (14x14) Part Status: Obsolete Number of I/O: 54 DigiKey Programmable: Not Verified |
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PCF51AC128ACLKE | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFP |
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PCF51AC128ACPUE | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP |
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PCF51AC128CCFUE | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 64-QFP (14x14) Part Status: Obsolete Number of I/O: 54 |
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PCF51AC128CCLKE | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 24x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Part Status: Obsolete Number of I/O: 69 DigiKey Programmable: Not Verified |
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PCF52252AF80 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, Ethernet, I²C, QSPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Obsolete Number of I/O: 56 |
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PCF52252CAF66 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP |
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PCF52254AF80 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, Ethernet, I²C, QSPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Obsolete Number of I/O: 56 |
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PCF52255CAF80 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, Ethernet, I²C, QSPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Obsolete Number of I/O: 56 |
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PCF52274CLU120 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 120MHz RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V Connectivity: CANbus, EBI/EMI, I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Obsolete Number of I/O: 47 DigiKey Programmable: Not Verified |
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| PK-HCS08GB60 | NXP USA Inc. |
Description: MC9S08GB60 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s), Cable(s) Core Processor: HCS08 Utilized IC / Part: MC9S08GB60 Part Status: Active |
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PPC5567MVR132 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 2MB (2M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Part Status: Obsolete Number of I/O: 238 DigiKey Programmable: Not Verified |
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PPC5604BCLL48 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP |
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PPC5605BCLQ48 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 121 DigiKey Programmable: Not Verified |
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PPC5605BCLQ64 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 121 DigiKey Programmable: Not Verified |
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|
|
PPC5606BCLQ48 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 1MB (1M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 121 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. |
|
|
PPC5606BCLQ64 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 121 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. |
| PQ-MDS-PMCPCIE | NXP USA Inc. | Description: PMC CARD PCI; |
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В кошику од. на суму грн. | |
| PQ2FADS-ZU | NXP USA Inc. | Description: MPC8250/MPC8260/MPC8264 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |
| RD3473MMA7360L | NXP USA Inc. | Description: BOARD ZSTAR2 XYZ-AXIS ACCEL |
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В кошику од. на суму грн. |
| MRF7S15100HSR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.51GHz
Power - Output: 23W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 600 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.51GHz
Power - Output: 23W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 600 mA
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| MRF7S35015HSR3 |
|
Виробник: NXP USA Inc.
Description: FET RF 65V 3.5GHZ NI-400S-240
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.1GHz ~ 3.5GHz
Power - Output: 15W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 50 mA
Description: FET RF 65V 3.5GHZ NI-400S-240
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.1GHz ~ 3.5GHz
Power - Output: 15W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 50 mA
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| MRF7S35015HSR5 |
|
Виробник: NXP USA Inc.
Description: FET RF 65V 3.5GHZ NI-400S-240
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.1GHz ~ 3.5GHz
Power - Output: 15W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 50 mA
Description: FET RF 65V 3.5GHZ NI-400S-240
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.1GHz ~ 3.5GHz
Power - Output: 15W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 50 mA
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| MRF8S18120HR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Power - Output: 72W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Power - Output: 72W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
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| MRF8S18120HSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Power - Output: 72W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Power - Output: 72W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
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| MRF8S9100HR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 920MHz
Power - Output: 72W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 920MHz
Power - Output: 72W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 500 mA
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В кошику
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| MRF8S9100HSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 920MHz
Power - Output: 72W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 920MHz
Power - Output: 72W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 500 mA
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| MRF8S9200NR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 940MHz
Power - Output: 58W
Gain: 19.9dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 940MHz
Power - Output: 58W
Gain: 19.9dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
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| MRFE6S8046GNR1 |
|
Виробник: NXP USA Inc.
Description: FET RF 66V 894MHZ TO-270-4
Description: FET RF 66V 894MHZ TO-270-4
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| MRFE6S8046NR1 |
|
Виробник: NXP USA Inc.
Description: FET RF 66V 894MHZ TO-270-4
Description: FET RF 66V 894MHZ TO-270-4
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| MRFE6S9046GNR1 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 35.5W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 300 mA
Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 35.5W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 300 mA
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| MSC8113TMP3600V |
|
Виробник: NXP USA Inc.
Description: DSP TRI-CORE 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, TDM, UART
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 300MHz
Supplier Device Package: 431-FCPBGA (20x20)
Part Status: Obsolete
Description: DSP TRI-CORE 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, TDM, UART
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 300MHz
Supplier Device Package: 431-FCPBGA (20x20)
Part Status: Obsolete
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| MSC8144AMC-SA |
|
Виробник: NXP USA Inc.
Description: MSC8144 EVAL BRD
Description: MSC8144 EVAL BRD
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| MSC8144ESVT1000B |
|
Виробник: NXP USA Inc.
Description: ENCRYPTION PACSUN R2.1 783FCBGA
Description: ENCRYPTION PACSUN R2.1 783FCBGA
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| MSC8144ESVT800B |
|
Виробник: NXP USA Inc.
Description: ENCRYPTION PACSUN R2.1 783FCBGA
Description: ENCRYPTION PACSUN R2.1 783FCBGA
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| MSC8144ETVT1000B |
|
Виробник: NXP USA Inc.
Description: ENCRYPTION PACSUN R2.1 783FCBGA
Description: ENCRYPTION PACSUN R2.1 783FCBGA
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| MSC8144ETVT800B |
|
Виробник: NXP USA Inc.
Description: ENCRYPTION PACSUN R2.1 783FCBGA
Description: ENCRYPTION PACSUN R2.1 783FCBGA
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| MSC8144EVT1000B |
|
Виробник: NXP USA Inc.
Description: ENCRYPTION PACSUN R2.1 783FCBGA
Description: ENCRYPTION PACSUN R2.1 783FCBGA
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| MSC8144EVT800B |
|
Виробник: NXP USA Inc.
Description: ENCRYPTION PACSUN R2.1 783FCBGA
Description: ENCRYPTION PACSUN R2.1 783FCBGA
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| MSC8144SVT1000B |
|
Виробник: NXP USA Inc.
Description: ENCRYPTION PACSUN R2.1 783FCBGA
Description: ENCRYPTION PACSUN R2.1 783FCBGA
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| MSC8144SVT800B |
|
Виробник: NXP USA Inc.
Description: ENCRYPTION PACSUN R2.1 783FCBGA
Description: ENCRYPTION PACSUN R2.1 783FCBGA
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| MSC8144TVT1000B |
|
Виробник: NXP USA Inc.
Description: ENCRYPTION PACSUN R2.1 783FCBGA
Description: ENCRYPTION PACSUN R2.1 783FCBGA
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| MSC8144TVT800B |
|
Виробник: NXP USA Inc.
Description: ENCRYPTION PACSUN R2.1 783FCBGA
Description: ENCRYPTION PACSUN R2.1 783FCBGA
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| MSC8144VT1000B |
|
Виробник: NXP USA Inc.
Description: ENCRYPTION PACSUN R2.1 783FCBGA
Description: ENCRYPTION PACSUN R2.1 783FCBGA
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| MW7IC008NT1 |
|
Виробник: NXP USA Inc.
Description: IC RF AMP GPS 100MHZ-1GHZ 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 100MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 32V
Gain: 23.5dB
Current - Supply: 75mA
P1dB: 40.4dBm
Test Frequency: 100MHz
Supplier Device Package: 24-PQFN (8x8)
Part Status: Not For New Designs
Description: IC RF AMP GPS 100MHZ-1GHZ 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 100MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 32V
Gain: 23.5dB
Current - Supply: 75mA
P1dB: 40.4dBm
Test Frequency: 100MHz
Supplier Device Package: 24-PQFN (8x8)
Part Status: Not For New Designs
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| MW7IC2040NBR1 |
|
Виробник: NXP USA Inc.
Description: IC AMP GP 100MHZ-1GHZ TO272 WB16
Description: IC AMP GP 100MHZ-1GHZ TO272 WB16
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| MW7IC2240GNR1 |
|
Виробник: NXP USA Inc.
Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.11GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 32V
Gain: 30dB
Current - Supply: 420mA
P1dB: 46dBm
Test Frequency: 2.14GHz
Supplier Device Package: TO-270 WBL-16 GULL
Part Status: Obsolete
Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.11GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 32V
Gain: 30dB
Current - Supply: 420mA
P1dB: 46dBm
Test Frequency: 2.14GHz
Supplier Device Package: TO-270 WBL-16 GULL
Part Status: Obsolete
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| MW7IC2425NBR1 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO272-16
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.45GHz
Power - Output: 25W
Gain: 27.7dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 55 mA
Description: RF MOSFET LDMOS 28V TO272-16
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.45GHz
Power - Output: 25W
Gain: 27.7dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 55 mA
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| MW7IC2725GNR1 |
|
Виробник: NXP USA Inc.
Description: IC RF AMP WIMAX 2.7GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 32V
Gain: 28.5dB
Current - Supply: 275mA
P1dB: 44dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-270 WBL-16 GULL
Description: IC RF AMP WIMAX 2.7GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 32V
Gain: 28.5dB
Current - Supply: 275mA
P1dB: 44dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-270 WBL-16 GULL
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| MW7IC2725NBR1 |
|
Виробник: NXP USA Inc.
Description: IC RF AMP WIMAX 2.7GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 32V
Gain: 28.5dB
Current - Supply: 275mA
P1dB: 44dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Description: IC RF AMP WIMAX 2.7GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 32V
Gain: 28.5dB
Current - Supply: 275mA
P1dB: 44dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
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| MW7IC2725NR1 |
|
Виробник: NXP USA Inc.
Description: IC RF AMP WIMAX 2.7GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 32V
Gain: 28.5dB
Current - Supply: 275mA
P1dB: 44dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-270 WBL-16
Description: IC RF AMP WIMAX 2.7GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 32V
Gain: 28.5dB
Current - Supply: 275mA
P1dB: 44dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-270 WBL-16
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| MW7IC2750NR1 |
|
Виробник: NXP USA Inc.
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax
Voltage - Supply: 28V
Gain: 26dB
Current - Supply: 550mA
P1dB: 47dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-270 WB-14
Part Status: Obsolete
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax
Voltage - Supply: 28V
Gain: 26dB
Current - Supply: 550mA
P1dB: 47dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-270 WB-14
Part Status: Obsolete
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| MW7IC930GNR1 |
|
Виробник: NXP USA Inc.
Description: IC AMP W-CDMA 728-768MHZ TO270
Description: IC AMP W-CDMA 728-768MHZ TO270
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| P4080PSE1MZA |
Виробник: NXP USA Inc.
Description: IC MPU Q OR IQ 1.5GHZ 1295FCBGA
Description: IC MPU Q OR IQ 1.5GHZ 1295FCBGA
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| PC8144EVT1000 |
Виробник: NXP USA Inc.
Description: DSP 1GHZ LOW TEMP 783BGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, SPI, TDM, UART, UTOPIA
Type: SC3400 Core
Operating Temperature: 0°C ~ 90°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Part Status: Obsolete
Description: DSP 1GHZ LOW TEMP 783BGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, SPI, TDM, UART, UTOPIA
Type: SC3400 Core
Operating Temperature: 0°C ~ 90°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Part Status: Obsolete
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| PC8144EVT800 |
Виробник: NXP USA Inc.
Description: DSP 800MHZ LOW TEMP 783BGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, SPI, TDM, UART, UTOPIA
Type: SC3400 Core
Operating Temperature: 0°C ~ 90°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Clock Rate: 800MHz
Supplier Device Package: 783-FCPBGA (29x29)
Part Status: Obsolete
Description: DSP 800MHZ LOW TEMP 783BGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, SPI, TDM, UART, UTOPIA
Type: SC3400 Core
Operating Temperature: 0°C ~ 90°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Clock Rate: 800MHz
Supplier Device Package: 783-FCPBGA (29x29)
Part Status: Obsolete
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| PC8144TVT1000 |
Виробник: NXP USA Inc.
Description: DSP 1GHZ HI-TEMP 783BGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, SPI, TDM, UART, UTOPIA
Type: SC3400 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Part Status: Obsolete
Description: DSP 1GHZ HI-TEMP 783BGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, SPI, TDM, UART, UTOPIA
Type: SC3400 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Part Status: Obsolete
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| PC8144TVT800 |
Виробник: NXP USA Inc.
Description: DSP 800MHZ HI-TEMP 783BGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, SPI, TDM, UART, UTOPIA
Type: SC3400 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Clock Rate: 800MHz
Supplier Device Package: 783-FCPBGA (29x29)
Part Status: Obsolete
Description: DSP 800MHZ HI-TEMP 783BGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, SPI, TDM, UART, UTOPIA
Type: SC3400 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Clock Rate: 800MHz
Supplier Device Package: 783-FCPBGA (29x29)
Part Status: Obsolete
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| PC9S08AC128CFGE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
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| PC9S08AC128CLKE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 69
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 69
DigiKey Programmable: Not Verified
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| PCF51AC128ACFUE |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 54
DigiKey Programmable: Not Verified
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| PCF51AC128ACLKE |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Description: IC MCU 32BIT 128KB FLASH 80LQFP
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| PCF51AC128ACPUE |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Description: IC MCU 32BIT 128KB FLASH 64LQFP
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| PCF51AC128CCFUE |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 54
Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 54
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| PCF51AC128CCLKE |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 69
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 69
DigiKey Programmable: Not Verified
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| PCF52252AF80 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 56
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 56
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| PCF52252CAF66 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
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| PCF52254AF80 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 56
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 56
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| PCF52255CAF80 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 56
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 56
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| PCF52274CLU120 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Obsolete
Number of I/O: 47
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Obsolete
Number of I/O: 47
DigiKey Programmable: Not Verified
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| PK-HCS08GB60 |
|
Виробник: NXP USA Inc.
Description: MC9S08GB60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08GB60
Part Status: Active
Description: MC9S08GB60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08GB60
Part Status: Active
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| PPC5567MVR132 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 238
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 238
DigiKey Programmable: Not Verified
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| PPC5604BCLL48 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Description: IC MCU 32BIT 512KB FLASH 100LQFP
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| PPC5605BCLQ48 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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| PPC5605BCLQ64 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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| PPC5606BCLQ48 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| PPC5606BCLQ64 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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| PQ-MDS-PMCPCIE |
Виробник: NXP USA Inc.
Description: PMC CARD PCI;
Description: PMC CARD PCI;
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| PQ2FADS-ZU |
Виробник: NXP USA Inc.
Description: MPC8250/MPC8260/MPC8264 EVAL BRD
Description: MPC8250/MPC8260/MPC8264 EVAL BRD
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| RD3473MMA7360L |
Виробник: NXP USA Inc.
Description: BOARD ZSTAR2 XYZ-AXIS ACCEL
Description: BOARD ZSTAR2 XYZ-AXIS ACCEL
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од. на суму грн.