Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (34270) > Сторінка 168 з 572
| Фото | Назва | Виробник | Інформація |
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| MMA5224W | NXP USA Inc. |
 Description: ACCELEROMETER 240G 16QFN |
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| MMA5224WR2 | NXP USA Inc. |
Description: ACCELEROMETER 240G 16QFN |
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| MMA5248WR2 | NXP USA Inc. | Description: ACCELEROMETER 480G 16QFN |
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MMA6361LR2 | NXP USA Inc. |
Description: ACCEL 1.5-6G ANALOG 14LGA |
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MMA6361LT | NXP USA Inc. |
Description: ACCEL 1.5-6G ANALOG 14LGA |
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MMA7331LCR1 | NXP USA Inc. |
Description: ACCELEROMETER 4-9G ANALOG 14LGA |
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MMA7331LCR2 | NXP USA Inc. |
Description: ACCELEROMETER 4-9G ANALOG 14LGA |
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MMA7361LCR1 | NXP USA Inc. |
Description: ACCEL 1.5-6G ANALOG 14LGA Packaging: Tape & Reel (TR) Features: Selectable Scale, Sleep Mode Package / Case: 14-TFLGA Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y, Z Acceleration Range: ±1.5g, 6g Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.2V ~ 3.6V Bandwidth: 400Hz (X,Y), 300Hz (Z) Supplier Device Package: 14-LGA (3x5) Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g) |
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MMA7361LCR2 | NXP USA Inc. |
Description: ACCEL 1.5-6G ANALOG 14LGA Packaging: Tape & Reel (TR) Features: Selectable Scale, Sleep Mode Package / Case: 14-TFLGA Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y, Z Acceleration Range: ±1.5g, 6g Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.2V ~ 3.6V Bandwidth: 400Hz (X,Y), 300Hz (Z) Supplier Device Package: 14-LGA (3x5) Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g) |
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MMA7368FLR1 | NXP USA Inc. | Description: ACCELEROMETER 1.5G 14LGA |
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MMA7368FLR2 | NXP USA Inc. |
Description: ACCELEROMETER 1.5G 14LGA Packaging: Tape & Reel (TR) Package / Case: 14-TFLGA Mounting Type: Surface Mount Supplier Device Package: 14-LGA (3x5) Part Status: Obsolete |
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MMA7368FLT | NXP USA Inc. | Description: ACCELEROMETER 1.5G 14LGA |
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MMA8450QR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C 16QFN Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Output Type: I²C Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 1.89V Bandwidth: 100Hz ~ 200Hz Supplier Device Package: 16-QFN (3x3) Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g) Part Status: Obsolete |
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MMA8451QR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C 16QFN Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Output Type: I²C Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.95V ~ 3.6V Bandwidth: 0.78Hz ~ 400Hz Supplier Device Package: 16-QFN (3x3) Sensitivity (LSB/g): 4096 (±2g) ~ 1024 (±8g) Part Status: Obsolete |
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MMA8453QR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C 16QFN Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Output Type: I2C Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.95V ~ 3.6V Bandwidth: 0.78Hz ~ 400Hz Supplier Device Package: 16-QFN (3x3) Sensitivity (LSB/g): 256 (±2g) ~ 64 (±8g) |
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| MPC5510DEMO | NXP USA Inc. |
Description: MPC5510 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5510 Part Status: Active |
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MPC5554MZP80 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 416PBGA |
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MPC5566MZP144 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 3MB (3M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Part Status: Active Number of I/O: 256 DigiKey Programmable: Not Verified |
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MPC8308CZQAFD | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 473MAPBGA Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 473-MAPBGA (19x19) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2 Graphics Acceleration: No Part Status: Obsolete |
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MPC8536EAVTAKGA | NXP USA Inc. |
Description: IC MPU MPC85XX 600MHZ 783FCBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: 0°C ~ 90°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography SATA: SATA 3Gbps (2) Part Status: Obsolete |
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MPC8540CVT667JC | NXP USA Inc. |
Description: IC MPU MPC85XX 667MHZ 783FCBGA |
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MPC8540VT833LC | NXP USA Inc. |
Description: IC MPU MPC85XX 833MHZ 783FCPBGA Packaging: Tray Package / Case: 783-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 833MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100Mbps (1), 10/100/1000Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Graphics Acceleration: No Part Status: Obsolete |
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MPL115A1 | NXP USA Inc. |
Description: IC BAROMETER SPI DGTL MINI 8LGA |
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MPL115A1T2 | NXP USA Inc. |
Description: IC BAROMETER SPI DGTL MINI 8LGA |
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MPL115A2 | NXP USA Inc. |
Description: SENSOR 16.68PSIA 10BIT 8LGA Features: Shutdown Mode, Standby Mode Packaging: Tray Package / Case: 8-TLGA Output Type: I2C Mounting Type: Surface Mount Output: 10 b Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa) Pressure Type: Absolute Accuracy: ±0.145PSI (±1kPa) Operating Temperature: -40°C ~ 105°C Termination Style: SMD (SMT) Tab Voltage - Supply: 2.375V ~ 5.5V Applications: Board Mount Supplier Device Package: 8-LGA (5x3) Port Style: No Port Maximum Pressure: 145.04PSI (1000kPa) |
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MPL115A2T2 | NXP USA Inc. |
Description: IC BAROMETER I2C DGTL MINI 8LGA |
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MRF6V3090NBR5 | NXP USA Inc. |
Description: FET RF 110V 860MHZ TO272-4 Packaging: Tape & Reel (TR) Package / Case: TO-272BB Mounting Type: Chassis Mount Frequency: 860MHz Power - Output: 18W Gain: 22dB Technology: LDMOS Supplier Device Package: TO-272 WB-4 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 350 mA |
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MRF6V3090NR5 | NXP USA Inc. |
Description: FET RF 110V 860MHZ TO270-4 |
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MRF8S19140HR3 | NXP USA Inc. |
Description: FET RF 65V 1.96GHZ NI780H |
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MRF8S19140HSR3 | NXP USA Inc. |
Description: FET RF 65V 1.96GHZ NI780HS Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 1.96GHz Power - Output: 34W Gain: 19.1dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.1 A |
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MRF8S19140HSR5 | NXP USA Inc. |
Description: FET RF 65V 1.96GHZ NI780HS Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 1.96GHz Power - Output: 34W Gain: 19.1dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.1 A |
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MRF8S21140HR3 | NXP USA Inc. |
Description: FET RF 65V 2.14GHZ NI780 |
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MRF8S21140HSR3 | NXP USA Inc. |
Description: FET RF 65V 2.14GHZ NI780S |
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MRF8S26120HSR5 | NXP USA Inc. |
Description: FET RF 65V 2.69GHZ NI780S Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 2.69GHz Power - Output: 28W Gain: 15.6dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 900 mA |
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MRF8S7170NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2 Mounting Type: Surface Mount Frequency: 748MHz Power - Output: 50W Gain: 19.5dB Technology: LDMOS Supplier Device Package: OM-780-2 Part Status: Obsolete Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 1.2 A |
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MSC8144SVT1000A | NXP USA Inc. |
Description: IC DSP QUAD 1GHZ 783FCBGA |
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MSC8144SVT800A | NXP USA Inc. |
Description: IC DSP QUAD 800MHZ 783FCBGA |
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MSC8144TVT1000A | NXP USA Inc. |
Description: IC DSP QUAD 1GHZ 783FCBGA |
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MSC8144TVT800A | NXP USA Inc. |
Description: IC DSP QUAD 800MHZ 783FCBGA |
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MSC8144VT1000A | NXP USA Inc. |
Description: IC DSP QUAD 1GHZ 783FCBGA |
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MSC8144VT800A | NXP USA Inc. |
Description: IC DSP QUAD 800MHZ 783FCBGA |
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MSC8156EVM | NXP USA Inc. |
Description: MSC8156 EVAL BRD |
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RDMMA845X | NXP USA Inc. |
Description: KIT FOR LFSTBUSB/E845X Packaging: Box Interface: I2C, USB Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA8451, MMA8452, MMA8453 Supplied Contents: Board(s), Cable(s) Sensing Range: ±2g, 4g, 8g |
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S912XDP512F0MAG | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 119 |
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S912XDQ256F1MAL | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP |
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S9S08DN16F1MLF | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Obsolete Number of I/O: 25 |
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S9S08DN60F1MLF | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Obsolete Number of I/O: 39 |
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S9S08LG16J0CLH | NXP USA Inc. |
Description: IC MCU 8BIT 18KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 18KB (18K x 8) RAM Size: 1.9K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 53 DigiKey Programmable: Not Verified |
на замовлення 1599 шт: термін постачання 21-31 дні (днів) |
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S9S08LG32J0VLK | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.9K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Part Status: Active Number of I/O: 69 |
на замовлення 450 шт: термін постачання 21-31 дні (днів) |
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S9S08QD4J1MSCR | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Number of I/O: 4 DigiKey Programmable: Not Verified |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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S9S08SG16E1CTJR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOP Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Part Status: Active Number of I/O: 16 |
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S9S12C64J2CFAE | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Not For New Designs Number of I/O: 31 DigiKey Programmable: Not Verified |
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S9S12XS128J1MAA | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP |
на замовлення 410 шт: термін постачання 21-31 дні (днів) |
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S9S12XS128J1MAL | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 DigiKey Programmable: Not Verified |
на замовлення 300 шт: термін постачання 21-31 дні (днів) |
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SPC5516EAMMG66 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA Packaging: Tray Package / Case: 208-BGA Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 1MB (1M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z0, e200z1 Data Converters: A/D 40x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-BGA (17x17) Number of I/O: 144 DigiKey Programmable: Not Verified |
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SPC5517EAMMG66 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA Packaging: Tray Package / Case: 208-BGA Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z0, e200z1 Data Converters: A/D 40x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-BGA (17x17) Number of I/O: 144 DigiKey Programmable: Not Verified |
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SPC5517GAMMG66 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA Packaging: Tray Package / Case: 208-BGA Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z0, e200z1 Data Converters: A/D 40x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-BGA (17x17) Number of I/O: 144 DigiKey Programmable: Not Verified |
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SPC5534MVM80 | NXP USA Inc. | Description: IC MCU 32BIT 1MB FLASH 208MAPBGA |
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TWR-S08JE128 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08JE EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08JE Platform: Tower System Part Status: Active |
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TWR-S08JE128-KIT | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08JE EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s), Cable(s) Core Processor: HCS08 Utilized IC / Part: MC9S08JE Platform: Tower System |
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| MMA7361LCR1 |
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Виробник: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 14LGA
Packaging: Tape & Reel (TR)
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
Description: ACCEL 1.5-6G ANALOG 14LGA
Packaging: Tape & Reel (TR)
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
товар відсутній
| MMA7361LCR2 |
|
Виробник: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 14LGA
Packaging: Tape & Reel (TR)
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
Description: ACCEL 1.5-6G ANALOG 14LGA
Packaging: Tape & Reel (TR)
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
товар відсутній
| MMA7368FLR2 |
Виробник: NXP USA Inc.
Description: ACCELEROMETER 1.5G 14LGA
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Mounting Type: Surface Mount
Supplier Device Package: 14-LGA (3x5)
Part Status: Obsolete
Description: ACCELEROMETER 1.5G 14LGA
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Mounting Type: Surface Mount
Supplier Device Package: 14-LGA (3x5)
Part Status: Obsolete
товар відсутній
| MMA8450QR1 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C 16QFN
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN
Output Type: I²C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 100Hz ~ 200Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g)
Part Status: Obsolete
Description: ACCELEROMETER 2-8G I2C 16QFN
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN
Output Type: I²C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 100Hz ~ 200Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g)
Part Status: Obsolete
товар відсутній
| MMA8451QR1 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C 16QFN
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN
Output Type: I²C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 4096 (±2g) ~ 1024 (±8g)
Part Status: Obsolete
Description: ACCELEROMETER 2-8G I2C 16QFN
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN
Output Type: I²C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 4096 (±2g) ~ 1024 (±8g)
Part Status: Obsolete
товар відсутній
| MMA8453QR1 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C 16QFN
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 256 (±2g) ~ 64 (±8g)
Description: ACCELEROMETER 2-8G I2C 16QFN
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 256 (±2g) ~ 64 (±8g)
товар відсутній
| MPC5510DEMO |
|
Виробник: NXP USA Inc.
Description: MPC5510 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5510
Part Status: Active
Description: MPC5510 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5510
Part Status: Active
товар відсутній
| MPC5566MZP144 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 256
DigiKey Programmable: Not Verified
товар відсутній
| MPC8308CZQAFD |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 473-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC83XX 333MHZ 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 473-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній
| MPC8536EAVTAKGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 600MHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Description: IC MPU MPC85XX 600MHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Part Status: Obsolete
товар відсутній
| MPC8540VT833LC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 833MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 833MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній
| MPL115A2 |
|
Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 10BIT 8LGA
Features: Shutdown Mode, Standby Mode
Packaging: Tray
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Output: 10 b
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 105°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
Maximum Pressure: 145.04PSI (1000kPa)
Description: SENSOR 16.68PSIA 10BIT 8LGA
Features: Shutdown Mode, Standby Mode
Packaging: Tray
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Output: 10 b
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 105°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
Maximum Pressure: 145.04PSI (1000kPa)
товар відсутній
| MRF6V3090NBR5 |
|
Виробник: NXP USA Inc.
Description: FET RF 110V 860MHZ TO272-4
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 350 mA
Description: FET RF 110V 860MHZ TO272-4
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 350 mA
товар відсутній
| MRF8S19140HSR3 |
Виробник: NXP USA Inc.
Description: FET RF 65V 1.96GHZ NI780HS
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.96GHz
Power - Output: 34W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
Description: FET RF 65V 1.96GHZ NI780HS
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.96GHz
Power - Output: 34W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
товар відсутній
| MRF8S19140HSR5 |
Виробник: NXP USA Inc.
Description: FET RF 65V 1.96GHZ NI780HS
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.96GHz
Power - Output: 34W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
Description: FET RF 65V 1.96GHZ NI780HS
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.96GHz
Power - Output: 34W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
товар відсутній
| MRF8S26120HSR5 |
Виробник: NXP USA Inc.
Description: FET RF 65V 2.69GHZ NI780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.69GHz
Power - Output: 28W
Gain: 15.6dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 900 mA
Description: FET RF 65V 2.69GHZ NI780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.69GHz
Power - Output: 28W
Gain: 15.6dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 900 mA
товар відсутній
| MRF8S7170NR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 748MHz
Power - Output: 50W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 748MHz
Power - Output: 50W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.2 A
товар відсутній
| RDMMA845X |
Виробник: NXP USA Inc.
Description: KIT FOR LFSTBUSB/E845X
Packaging: Box
Interface: I2C, USB
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451, MMA8452, MMA8453
Supplied Contents: Board(s), Cable(s)
Sensing Range: ±2g, 4g, 8g
Description: KIT FOR LFSTBUSB/E845X
Packaging: Box
Interface: I2C, USB
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451, MMA8452, MMA8453
Supplied Contents: Board(s), Cable(s)
Sensing Range: ±2g, 4g, 8g
товар відсутній
| S912XDP512F0MAG |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 119
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 119
товар відсутній
| S9S08DN16F1MLF |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
товар відсутній
| S9S08DN60F1MLF |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
товар відсутній
| S9S08LG16J0CLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 18KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 18KB (18K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 18KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 18KB (18K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 1599 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 524.42 грн |
| 10+ | 396.86 грн |
| 80+ | 328.56 грн |
| S9S08LG32J0VLK |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 69
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 69
на замовлення 450 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 708.12 грн |
| 10+ | 535.8 грн |
| 80+ | 443.6 грн |
| S9S08QD4J1MSCR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2500+ | 136.67 грн |
| S9S08SG16E1CTJR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
товар відсутній
| S9S12C64J2CFAE |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
товар відсутній
| S9S12XS128J1MAA |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Description: IC MCU 16BIT 128KB FLASH 80QFP
на замовлення 410 шт:
термін постачання 21-31 дні (днів)| S9S12XS128J1MAL |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
на замовлення 300 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 855.07 грн |
| 10+ | 658.03 грн |
| 80+ | 555.74 грн |
| SPC5516EAMMG66 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
товар відсутній
| SPC5517EAMMG66 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
товар відсутній
| SPC5517GAMMG66 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
товар відсутній
| TWR-S08JE128 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08JE
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08JE
Platform: Tower System
Part Status: Active
товар відсутній
| TWR-S08JE128-KIT |
|
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08JE
Platform: Tower System
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08JE
Platform: Tower System
товар відсутній