Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36393) > Сторінка 209 з 607
| Фото | Назва | Виробник | Інформація |
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MC35XS3400DHFKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:4 24PQFN Part Status: Obsolete Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Supplier Device Package: 24-PQFN (12x12) Ratio - Input:Output: 1:4 Current - Output (Max): 6A Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Voltage - Load: 6V ~ 20V Rds On (Typ): 35mOhm (Max) Output Configuration: High Side Operating Temperature: -40°C ~ 150°C (TJ) Switch Type: General Purpose Interface: SPI Number of Outputs: 4 Mounting Type: Surface Mount Output Type: N-Channel Package / Case: 24-PowerQFN Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Packaging: Tape & Reel (TR) |
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MC35XS3500HFKR2 | NXP USA Inc. |
 Description: IC PWR SWITCH N-CHAN 1:6 24PQFNFeatures: Watchdog Timer Packaging: Tape & Reel (TR) Package / Case: 24-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side Rds On (Typ): 35mOhm (Max) Voltage - Load: 7V ~ 20V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Ratio - Input:Output: 1:6 Supplier Device Package: 24-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Part Status: Obsolete |
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MC56F8035VLDR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 44LQFP Packaging: Tape & Reel (TR) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (32K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 8x12b; D/A 2x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 35 DigiKey Programmable: Not Verified |
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MC9RS08KA4CWJR | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20SOIC Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 20-SOIC Peripherals: LVD, POR, PWM, WDT Connectivity: I2C Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 12x10b Core Processor: RS08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 126 x 8 Program Memory Size: 4KB (4K x 8) Speed: 20MHz Mounting Type: Surface Mount |
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MC9S08GT16ACFCER | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32QFN DigiKey Programmable: Not Verified Number of I/O: 24 Part Status: Active Supplier Device Package: 32-HVQFN (5x5) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 8-Bit Data Converters: A/D 4x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Program Memory Size: 16KB (16K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
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MCIMX283CVM4BR2 | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Part Status: Active Security Features: Boot Security, Cryptography, Hardware ID Display & Interface Controllers: Keypad, LCD, Touchscreen Graphics Acceleration: No RAM Controllers: LVDDR, LVDDR2, DDR2 Co-Processors/DSP: Data; DCP Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 289-MAPBGA (14x14) Voltage - I/O: 1.8V, 3.3V Core Processor: ARM926EJ-S Operating Temperature: -40°C ~ 85°C (TA) Speed: 454MHz Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tape & Reel (TR) Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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MCZ33903C3EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Supplier Device Package: 32-SOIC-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tape & Reel (TR) |
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MCZ33903CP5EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
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MCZ33903CS5EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
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MCZ33904C5EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
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MCZ33905CD3EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC Supplier Device Package: 54-SOIC-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN, LIN Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tape & Reel (TR) |
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MCZ33905CD5EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC Supplier Device Package: 54-SOIC-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN, LIN Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tape & Reel (TR) |
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MCZ33905CS3EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Supplier Device Package: 32-SOIC-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN, LIN Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tape & Reel (TR) |
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MD7IC2251GNR1 | NXP USA Inc. | Description: IC AMP W-CDMA 2.11-2.17GHZ TO270 |
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MK10DN512ZVMC10R | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 121MAPBGA |
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MK10DX256VLK7R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 80FQFP DigiKey Programmable: Not Verified Number of I/O: 56 Part Status: Active Supplier Device Package: 80-FQFP (12x12) Peripherals: DMA, I²S, LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 31x16b; D/A 1x12b Core Processor: ARM® Cortex®-M4 EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 64K x 8 Program Memory Size: 256KB (256K x 8) Speed: 72MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Tape & Reel (TR) |
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MK20DN512ZVLQ10R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP DigiKey Programmable: Not Verified Number of I/O: 100 Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 42x16b; D/A 2x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 128K x 8 Program Memory Size: 512KB (512K x 8) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tape & Reel (TR) |
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MK60DN512ZVLQ10R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP DigiKey Programmable: Not Verified Number of I/O: 100 Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 42x16b; D/A 2x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 128K x 8 Program Memory Size: 512KB (512K x 8) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tape & Reel (TR) |
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MM908E624ACPEWR2 | NXP USA Inc. |
Description: IC SW TRPL HISIDE MCU/LIN 54SOIC Core Processor: HC08 DigiKey Programmable: Not Verified Number of I/O: 16 Supplier Device Package: 54-SOIC Grade: Automotive Applications: Mirror Control Program Memory Type: FLASH (16kB) Controller Series: 908E Voltage - Supply: 5.5V ~ 18V Operating Temperature: -40°C ~ 85°C RAM Size: 512 x 8 Interface: SCI, SPI Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
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MM908E624AYPEWR2 | NXP USA Inc. |
Description: IC SW TRPL HISIDE MCU/LIN 54SOIC DigiKey Programmable: Not Verified Number of I/O: 16 Grade: Automotive Supplier Device Package: 54-SOIC Core Processor: HC08 Applications: Mirror Control Program Memory Type: FLASH (16kB) Controller Series: 908E Voltage - Supply: 5.5V ~ 18V Operating Temperature: -40°C ~ 125°C RAM Size: 512 x 8 Interface: SCI, SPI Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
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MM912IP812AMAFR2 | NXP USA Inc. |
Description: IC DRVR INJECTOR/IGN 100LQFP |
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MM912JP812AMAFR2 | NXP USA Inc. |
Description: IC DRVR INJECTOR/IGN 100LQFP Supplier Device Package: 100-LQFP-EP (14x14) Core Processor: S12P Applications: Engine Control Program Memory Type: FLASH (128kB) Controller Series: HCS12 Voltage - Supply: 4.7V ~ 36V Operating Temperature: -40°C ~ 125°C RAM Size: 6K x 8 Interface: CAN, SCI, SPI Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 8 |
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MMA1200KEGR2 | NXP USA Inc. |
Description: ACCELEROMETER 281G ANALOG 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: Z Acceleration Range: ±281g Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 400Hz Supplier Device Package: 16-SOIC Sensitivity (mV/g): 8 |
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| MMA1210KEGR2 | NXP USA Inc. |
Description: ACCEL 112.5G ANALOG 16SOIC Grade: Automotive Sensitivity (mV/g): 20 Supplier Device Package: 16-SOIC Bandwidth: 400Hz Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 125°C Acceleration Range: ±112.5g Axis: Z Type: Analog Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 16-SOIC (0.295", 7.50mm Width) Qualification: AEC-Q100 Packaging: Tape & Reel (TR) |
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| MMA1211KEGR2 | NXP USA Inc. |
Description: ACCELEROMETER 169G ANALOG 16SOIC Sensitivity (mV/g): 13.33 Supplier Device Package: 16-SOIC Bandwidth: 400Hz Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 125°C Acceleration Range: ±169g Axis: Z Type: Analog Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
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| MMA1220KEGR2 | NXP USA Inc. |
Description: ACCELEROMETER 8G ANALOG 16SOIC |
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| MMA1250KEGR2 | NXP USA Inc. |
Description: ACCELEROMETER 5G ANALOG 16SOIC Qualification: AEC-Q100 Grade: Automotive Sensitivity (mV/g): 400 Supplier Device Package: 16-SOIC Bandwidth: 50Hz Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 105°C Acceleration Range: ±5g Axis: Z Type: Analog Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
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| MMA1251KEGR2 | NXP USA Inc. |
Description: ACCELEROMETER 5G ANALOG 16SOIC |
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| MMA1254KEGR2 | NXP USA Inc. |
Description: ACCELEROMETER 5G ANALOG 16SOIC Packaging: Tape & Reel (TR) Part Status: Obsolete Sensitivity (mV/g): 400 Supplier Device Package: 16-SOIC Bandwidth: 50Hz Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 105°C (TA) Acceleration Range: ±5g Axis: Z Type: Analog Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 16-SOIC (0.295", 7.50mm Width) |
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| MMA1270KEGR2 | NXP USA Inc. |
Description: ACCELEROMETER 2.5G ANALOG 16SOIC Qualification: AEC-Q100 Grade: Automotive Sensitivity (mV/g): 750 Supplier Device Package: 16-SOIC Bandwidth: 50Hz Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 105°C Acceleration Range: ±2.5g Axis: Z Type: Analog Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
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MMA2202KEGR2 | NXP USA Inc. |
Description: ACCEL 56.3G ANALOG 16SOIC Qualification: AEC-Q100 Grade: Automotive Sensitivity (mV/g): 40 Supplier Device Package: 16-SOIC Bandwidth: 400Hz Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 125°C Acceleration Range: ±56.3g Axis: X Type: Analog Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
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| MMA2206KEGR2 | NXP USA Inc. |
Description: ACCELEROMETER 80G ANALOG 16SOIC Qualification: AEC-Q100 Grade: Automotive Sensitivity (mV/g): 20 Supplier Device Package: 16-SOIC Bandwidth: 400Hz Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 125°C Acceleration Range: ±80g Axis: X Type: Analog Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
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| MMA5106KWR2 | NXP USA Inc. |
Description: ACCELEROMETER 60G PCM/SPI 16QFN Part Status: Obsolete Sensitivity (LSB/g): 8 Supplier Device Package: 16-QFN (6x6) Voltage - Supply: 4.2V ~ 17V Operating Temperature: -40°C ~ 125°C (TA) Acceleration Range: ±60g Axis: Z Type: Digital Mounting Type: Surface Mount Output Type: PCM, SPI Package / Case: 16-QFN Exposed Pad Features: Selectable Low Pass Filter Packaging: Tape & Reel (TR) |
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| MMA5124KWR2 | NXP USA Inc. |
Description: ACCELEROMETER 240G PCM/SPI 16QFN Qualification: AEC-Q100 Grade: Automotive Sensitivity (LSB/g): 2 Supplier Device Package: 16-QFN (6x6) Voltage - Supply: 4.2V ~ 17V Operating Temperature: -40°C ~ 125°C Acceleration Range: ±240g Axis: Z Type: Digital Mounting Type: Surface Mount Output Type: PCM, SPI Package / Case: 16-QFN Exposed Pad Features: Selectable Low Pass Filter Packaging: Tape & Reel (TR) |
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MMA6813KWR2 | NXP USA Inc. |
Description: ACCELEROMETER 50G SPI 16QFN Qualification: AEC-Q100 Grade: Automotive Part Status: Obsolete Sensitivity (LSB/g): 9.766 Supplier Device Package: 16-QFN (6x6) Voltage - Supply: 3.135V ~ 5.25V Operating Temperature: -40°C ~ 105°C Acceleration Range: ±50g Axis: X, Y Type: Digital Mounting Type: Surface Mount Output Type: SPI Package / Case: 16-QFN Exposed Pad Packaging: Tape & Reel (TR) |
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MMA6821BKWR2 | NXP USA Inc. |
Description: ACCELEROMETER 120G/25G SPI 16QFN |
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MMZ09312BT1 | NXP USA Inc. |
Description: IC RF AMP CDMA 400MHZ-1GHZ 12QFN Supplier Device Package: 12-QFN (3x3) Test Frequency: 900MHz P1dB: 29.6dBm Noise Figure: 4dB Current - Supply: 74mA Gain: 31.7dB Voltage - Supply: 3V ~ 5V RF Type: CDMA, GSM Frequency: 400MHz ~ 1GHz Mounting Type: Surface Mount Package / Case: 12-VFQFN Exposed Pad Packaging: Tape & Reel (TR) Part Status: Active |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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MMZ25332BT1 | NXP USA Inc. |
Description: IC AMP LTE 1.8GHZ-2.8GHZ 12QFN Supplier Device Package: 12-QFN (3x3) Test Frequency: 2.5GHz P1dB: 33dBm Noise Figure: 5.8dB Current - Supply: 390mA Gain: 26.5dB Voltage - Supply: 3V ~ 5V RF Type: LTE, TDS-CDMA, W-CDMA Frequency: 1.8GHz ~ 2.8GHz Mounting Type: Surface Mount Package / Case: 12-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
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| MRF6VP121KHSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Current - Test: 150 mA Voltage - Test: 50 V Voltage - Rated: 110 V Part Status: Obsolete Supplier Device Package: NI-1230S Technology: LDMOS Gain: 20dB Power - Output: 1000W Configuration: Dual Frequency: 1.03GHz Package / Case: NI-1230S Packaging: Tape & Reel (TR) |
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MRF6VP3091NBR5 | NXP USA Inc. |
Description: FET RF 2CH 115V 860MHZ TO272-4 |
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MRF6VP3091NR5 | NXP USA Inc. |
Description: FET RF 2CH 115V 860MHZ TO272-4 |
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| MRF8P23160WHR3 | NXP USA Inc. |
Description: FET RF 2CH 65V 2.32GHZ NI780-4 |
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| MRF8P23160WHSR3 | NXP USA Inc. |
Description: FET RF 2CH 65V 2.32GHZ NI780-4 Current - Test: 600 mA Voltage - Test: 28 V Voltage - Rated: 65 V Part Status: Obsolete Supplier Device Package: NI-780-4 Technology: MOSFET Gain: 14.1dB Power - Output: 30W Configuration: N-Channel Frequency: 2.32GHz Package / Case: NI-780-4 Packaging: Tape & Reel (TR) |
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MRF8P9040NBR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO272-4 Current - Test: 320 mA Voltage - Test: 28 V Voltage - Rated: 70 V Supplier Device Package: TO-272 WB-4 Technology: LDMOS Gain: 19.1dB Power - Output: 4W Configuration: Dual Frequency: 960MHz Mounting Type: Chassis Mount Package / Case: TO-272BB Packaging: Tape & Reel (TR) |
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| MRF8S18210WGHSR3 | NXP USA Inc. |
Description: RF MOSFET 30V NI880XS Current - Test: 1.3 A Voltage - Test: 30 V Voltage - Rated: 65 V Supplier Device Package: NI-880XS-2 GULL Technology: MOSFET (Metal Oxide) Gain: 17.8dB Power - Output: 50W Configuration: N-Channel Frequency: 1.93GHz Mounting Type: Surface Mount Package / Case: NI-880XS-2 GW Packaging: Tape & Reel (TR) |
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| MRF8S18210WGHSR5 | NXP USA Inc. |
Description: RF MOSFET 30V NI880XS Packaging: Tape & Reel (TR) Package / Case: NI-880XS-2 GW Mounting Type: Surface Mount Frequency: 1.93GHz Configuration: N-Channel Power - Output: 50W Gain: 17.8dB Technology: MOSFET (Metal Oxide) Supplier Device Package: NI-880XS-2 GULL Part Status: Discontinued at Digi-Key Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 1.3 A |
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MRF8S21100HR3 | NXP USA Inc. |
Description: RF MOSFET 28V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 2.17GHz Configuration: N-Channel Power - Output: 24W Gain: 18.3dB Technology: MOSFET (Metal Oxide) Supplier Device Package: NI-780H-2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 700 mA |
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MRF8S9202GNR3 | NXP USA Inc. |
Description: RF MOSFET 28V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2 Mounting Type: Surface Mount Frequency: 920MHz Configuration: N-Channel Power - Output: 58W Gain: 19dB Technology: MOSFET Supplier Device Package: OM-780-2 Part Status: Obsolete Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 1.3 A |
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MRF8S9232NR3 | NXP USA Inc. |
Description: RF MOSFET 28V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2 Mounting Type: Surface Mount Frequency: 960MHz Configuration: N-Channel Power - Output: 63W Gain: 18.1dB Technology: MOSFET Supplier Device Package: OM-780-2 Part Status: Obsolete Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 1.4 A |
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MRFE6VP100HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Package / Case: NI-780-4 Packaging: Tape & Reel (TR) Current - Test: 100 mA Voltage - Test: 50 V Voltage - Rated: 133 V Part Status: Active Supplier Device Package: NI-780-4 Technology: LDMOS Gain: 26dB Power - Output: 100W Frequency: 512MHz Mounting Type: Chassis Mount |
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MRFE6VP100HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Current - Test: 100 mA Voltage - Test: 50 V Voltage - Rated: 133 V Supplier Device Package: NI-780S-4L Technology: LDMOS Gain: 26dB Power - Output: 100W Frequency: 512MHz Mounting Type: Surface Mount Package / Case: NI-780S-4L Packaging: Tape & Reel (TR) |
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MRFE6VS25NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V TO270-2 Current - Test: 10 mA Voltage - Test: 50 V Voltage - Rated: 133 V Supplier Device Package: TO-270-2 Technology: LDMOS Gain: 25.4dB Power - Output: 25W Frequency: 512MHz Mounting Type: Surface Mount Package / Case: TO-270AA Packaging: Tape & Reel (TR) |
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S912XEP100J5MAGR | NXP USA Inc. |
Description: IC MCU 16BIT 1MB FLASH 144LQFP Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 24x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 64K x 8 Program Memory Size: 1MB (1M x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 119 Part Status: Active Supplier Device Package: 144-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT |
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S912XEP100J5VAGR | NXP USA Inc. |
Description: IC MCU 16BIT 1MB FLASH 144LQFP Number of I/O: 119 Part Status: Active Supplier Device Package: 144-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 24x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 64K x 8 Program Memory Size: 1MB (1M x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
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S912XEP768J5MAGR | NXP USA Inc. |
Description: IC MCU 16BIT 768KB FLASH 144LQFP |
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S912XEQ512J3CAGR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 119 DigiKey Programmable: Not Verified |
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S912XET512J3VALR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tape & Reel (TR) Number of I/O: 91 Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 50MHz DigiKey Programmable: Not Verified |
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S9S08AW60E5MFGER | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 44LQFP Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Program Memory Size: 60KB (60K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 44-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 34 Part Status: Active Supplier Device Package: 44-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: I²C, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: S08 |
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S9S08EL32F1MTJR | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 20TSSOP DigiKey Programmable: Not Verified Number of I/O: 16 Supplier Device Package: 20-TSSOP Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 12x10b Core Processor: S08 EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1K x 8 Program Memory Size: 32KB (32K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Tape & Reel (TR) |
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S9S08SG8E2CTGR | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16TSSOP DigiKey Programmable: Not Verified Number of I/O: 12 Supplier Device Package: 16-TSSOP Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Program Memory Size: 8KB (8K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Packaging: Tape & Reel (TR) |
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| MC35XS3400DHFKR2 |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:4 24PQFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:4
Current - Output (Max): 6A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 6V ~ 20V
Rds On (Typ): 35mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 4
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Description: IC PWR SWITCH N-CHAN 1:4 24PQFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:4
Current - Output (Max): 6A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 6V ~ 20V
Rds On (Typ): 35mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 4
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
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| MC35XS3500HFKR2 |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Features: Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 35mOhm (Max)
Voltage - Load: 7V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:6
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Features: Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 35mOhm (Max)
Voltage - Load: 7V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:6
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
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| MC56F8035VLDR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
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| MC9RS08KA4CWJR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-SOIC
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: RS08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 126 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-SOIC
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: RS08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 126 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
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| MC9S08GT16ACFCER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 24
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 8BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 24
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| MCIMX283CVM4BR2 |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Part Status: Active
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: LVDDR, LVDDR2, DDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Part Status: Active
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: LVDDR, LVDDR2, DDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1000+ | 966.75 грн |
| MCZ33903C3EKR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
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| MCZ33903CP5EKR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
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| MCZ33903CS5EKR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
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| MCZ33904C5EKR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
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| MCZ33905CD3EKR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
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| MCZ33905CD5EKR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
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| MCZ33905CS3EKR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
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| MD7IC2251GNR1 |
Виробник: NXP USA Inc.
Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
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| MK10DN512ZVMC10R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Description: IC MCU 32B 512KB FLASH 121MAPBGA
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| MK10DX256VLK7R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 56
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 31x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 256KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 56
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 31x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
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| MK20DN512ZVLQ10R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 42x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 42x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
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| MK60DN512ZVLQ10R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 42x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 42x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
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| MM908E624ACPEWR2 |
|
Виробник: NXP USA Inc.
Description: IC SW TRPL HISIDE MCU/LIN 54SOIC
Core Processor: HC08
DigiKey Programmable: Not Verified
Number of I/O: 16
Supplier Device Package: 54-SOIC
Grade: Automotive
Applications: Mirror Control
Program Memory Type: FLASH (16kB)
Controller Series: 908E
Voltage - Supply: 5.5V ~ 18V
Operating Temperature: -40°C ~ 85°C
RAM Size: 512 x 8
Interface: SCI, SPI
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: IC SW TRPL HISIDE MCU/LIN 54SOIC
Core Processor: HC08
DigiKey Programmable: Not Verified
Number of I/O: 16
Supplier Device Package: 54-SOIC
Grade: Automotive
Applications: Mirror Control
Program Memory Type: FLASH (16kB)
Controller Series: 908E
Voltage - Supply: 5.5V ~ 18V
Operating Temperature: -40°C ~ 85°C
RAM Size: 512 x 8
Interface: SCI, SPI
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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| MM908E624AYPEWR2 |
|
Виробник: NXP USA Inc.
Description: IC SW TRPL HISIDE MCU/LIN 54SOIC
DigiKey Programmable: Not Verified
Number of I/O: 16
Grade: Automotive
Supplier Device Package: 54-SOIC
Core Processor: HC08
Applications: Mirror Control
Program Memory Type: FLASH (16kB)
Controller Series: 908E
Voltage - Supply: 5.5V ~ 18V
Operating Temperature: -40°C ~ 125°C
RAM Size: 512 x 8
Interface: SCI, SPI
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: IC SW TRPL HISIDE MCU/LIN 54SOIC
DigiKey Programmable: Not Verified
Number of I/O: 16
Grade: Automotive
Supplier Device Package: 54-SOIC
Core Processor: HC08
Applications: Mirror Control
Program Memory Type: FLASH (16kB)
Controller Series: 908E
Voltage - Supply: 5.5V ~ 18V
Operating Temperature: -40°C ~ 125°C
RAM Size: 512 x 8
Interface: SCI, SPI
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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| MM912IP812AMAFR2 |
|
Виробник: NXP USA Inc.
Description: IC DRVR INJECTOR/IGN 100LQFP
Description: IC DRVR INJECTOR/IGN 100LQFP
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| MM912JP812AMAFR2 |
|
Виробник: NXP USA Inc.
Description: IC DRVR INJECTOR/IGN 100LQFP
Supplier Device Package: 100-LQFP-EP (14x14)
Core Processor: S12P
Applications: Engine Control
Program Memory Type: FLASH (128kB)
Controller Series: HCS12
Voltage - Supply: 4.7V ~ 36V
Operating Temperature: -40°C ~ 125°C
RAM Size: 6K x 8
Interface: CAN, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 8
Description: IC DRVR INJECTOR/IGN 100LQFP
Supplier Device Package: 100-LQFP-EP (14x14)
Core Processor: S12P
Applications: Engine Control
Program Memory Type: FLASH (128kB)
Controller Series: HCS12
Voltage - Supply: 4.7V ~ 36V
Operating Temperature: -40°C ~ 125°C
RAM Size: 6K x 8
Interface: CAN, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 8
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| MMA1200KEGR2 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 281G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±281g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 8
Description: ACCELEROMETER 281G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±281g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 8
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| MMA1210KEGR2 |
|
Виробник: NXP USA Inc.
Description: ACCEL 112.5G ANALOG 16SOIC
Grade: Automotive
Sensitivity (mV/g): 20
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±112.5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Qualification: AEC-Q100
Packaging: Tape & Reel (TR)
Description: ACCEL 112.5G ANALOG 16SOIC
Grade: Automotive
Sensitivity (mV/g): 20
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±112.5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Qualification: AEC-Q100
Packaging: Tape & Reel (TR)
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| MMA1211KEGR2 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 169G ANALOG 16SOIC
Sensitivity (mV/g): 13.33
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±169g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: ACCELEROMETER 169G ANALOG 16SOIC
Sensitivity (mV/g): 13.33
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±169g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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| MMA1220KEGR2 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 8G ANALOG 16SOIC
Description: ACCELEROMETER 8G ANALOG 16SOIC
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| MMA1250KEGR2 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 5G ANALOG 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 400
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: ACCELEROMETER 5G ANALOG 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 400
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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| MMA1251KEGR2 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 5G ANALOG 16SOIC
Description: ACCELEROMETER 5G ANALOG 16SOIC
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| MMA1254KEGR2 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 5G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Sensitivity (mV/g): 400
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C (TA)
Acceleration Range: ±5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Description: ACCELEROMETER 5G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Sensitivity (mV/g): 400
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C (TA)
Acceleration Range: ±5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
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| MMA1270KEGR2 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2.5G ANALOG 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 750
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±2.5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: ACCELEROMETER 2.5G ANALOG 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 750
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±2.5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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| MMA2202KEGR2 |
|
Виробник: NXP USA Inc.
Description: ACCEL 56.3G ANALOG 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 40
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±56.3g
Axis: X
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: ACCEL 56.3G ANALOG 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 40
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±56.3g
Axis: X
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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| MMA2206KEGR2 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 80G ANALOG 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 20
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±80g
Axis: X
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: ACCELEROMETER 80G ANALOG 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 20
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±80g
Axis: X
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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| MMA5106KWR2 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 60G PCM/SPI 16QFN
Part Status: Obsolete
Sensitivity (LSB/g): 8
Supplier Device Package: 16-QFN (6x6)
Voltage - Supply: 4.2V ~ 17V
Operating Temperature: -40°C ~ 125°C (TA)
Acceleration Range: ±60g
Axis: Z
Type: Digital
Mounting Type: Surface Mount
Output Type: PCM, SPI
Package / Case: 16-QFN Exposed Pad
Features: Selectable Low Pass Filter
Packaging: Tape & Reel (TR)
Description: ACCELEROMETER 60G PCM/SPI 16QFN
Part Status: Obsolete
Sensitivity (LSB/g): 8
Supplier Device Package: 16-QFN (6x6)
Voltage - Supply: 4.2V ~ 17V
Operating Temperature: -40°C ~ 125°C (TA)
Acceleration Range: ±60g
Axis: Z
Type: Digital
Mounting Type: Surface Mount
Output Type: PCM, SPI
Package / Case: 16-QFN Exposed Pad
Features: Selectable Low Pass Filter
Packaging: Tape & Reel (TR)
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| MMA5124KWR2 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (LSB/g): 2
Supplier Device Package: 16-QFN (6x6)
Voltage - Supply: 4.2V ~ 17V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±240g
Axis: Z
Type: Digital
Mounting Type: Surface Mount
Output Type: PCM, SPI
Package / Case: 16-QFN Exposed Pad
Features: Selectable Low Pass Filter
Packaging: Tape & Reel (TR)
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (LSB/g): 2
Supplier Device Package: 16-QFN (6x6)
Voltage - Supply: 4.2V ~ 17V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±240g
Axis: Z
Type: Digital
Mounting Type: Surface Mount
Output Type: PCM, SPI
Package / Case: 16-QFN Exposed Pad
Features: Selectable Low Pass Filter
Packaging: Tape & Reel (TR)
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| MMA6813KWR2 |
Виробник: NXP USA Inc.
Description: ACCELEROMETER 50G SPI 16QFN
Qualification: AEC-Q100
Grade: Automotive
Part Status: Obsolete
Sensitivity (LSB/g): 9.766
Supplier Device Package: 16-QFN (6x6)
Voltage - Supply: 3.135V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±50g
Axis: X, Y
Type: Digital
Mounting Type: Surface Mount
Output Type: SPI
Package / Case: 16-QFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: ACCELEROMETER 50G SPI 16QFN
Qualification: AEC-Q100
Grade: Automotive
Part Status: Obsolete
Sensitivity (LSB/g): 9.766
Supplier Device Package: 16-QFN (6x6)
Voltage - Supply: 3.135V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±50g
Axis: X, Y
Type: Digital
Mounting Type: Surface Mount
Output Type: SPI
Package / Case: 16-QFN Exposed Pad
Packaging: Tape & Reel (TR)
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| MMA6821BKWR2 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 120G/25G SPI 16QFN
Description: ACCELEROMETER 120G/25G SPI 16QFN
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| MMZ09312BT1 |
|
Виробник: NXP USA Inc.
Description: IC RF AMP CDMA 400MHZ-1GHZ 12QFN
Supplier Device Package: 12-QFN (3x3)
Test Frequency: 900MHz
P1dB: 29.6dBm
Noise Figure: 4dB
Current - Supply: 74mA
Gain: 31.7dB
Voltage - Supply: 3V ~ 5V
RF Type: CDMA, GSM
Frequency: 400MHz ~ 1GHz
Mounting Type: Surface Mount
Package / Case: 12-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Description: IC RF AMP CDMA 400MHZ-1GHZ 12QFN
Supplier Device Package: 12-QFN (3x3)
Test Frequency: 900MHz
P1dB: 29.6dBm
Noise Figure: 4dB
Current - Supply: 74mA
Gain: 31.7dB
Voltage - Supply: 3V ~ 5V
RF Type: CDMA, GSM
Frequency: 400MHz ~ 1GHz
Mounting Type: Surface Mount
Package / Case: 12-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1000+ | 229.88 грн |
| MMZ25332BT1 |
|
Виробник: NXP USA Inc.
Description: IC AMP LTE 1.8GHZ-2.8GHZ 12QFN
Supplier Device Package: 12-QFN (3x3)
Test Frequency: 2.5GHz
P1dB: 33dBm
Noise Figure: 5.8dB
Current - Supply: 390mA
Gain: 26.5dB
Voltage - Supply: 3V ~ 5V
RF Type: LTE, TDS-CDMA, W-CDMA
Frequency: 1.8GHz ~ 2.8GHz
Mounting Type: Surface Mount
Package / Case: 12-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC AMP LTE 1.8GHZ-2.8GHZ 12QFN
Supplier Device Package: 12-QFN (3x3)
Test Frequency: 2.5GHz
P1dB: 33dBm
Noise Figure: 5.8dB
Current - Supply: 390mA
Gain: 26.5dB
Voltage - Supply: 3V ~ 5V
RF Type: LTE, TDS-CDMA, W-CDMA
Frequency: 1.8GHz ~ 2.8GHz
Mounting Type: Surface Mount
Package / Case: 12-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| MRF6VP121KHSR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Obsolete
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 20dB
Power - Output: 1000W
Configuration: Dual
Frequency: 1.03GHz
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Obsolete
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 20dB
Power - Output: 1000W
Configuration: Dual
Frequency: 1.03GHz
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
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| MRF6VP3091NBR5 |
|
Виробник: NXP USA Inc.
Description: FET RF 2CH 115V 860MHZ TO272-4
Description: FET RF 2CH 115V 860MHZ TO272-4
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| MRF6VP3091NR5 |
|
Виробник: NXP USA Inc.
Description: FET RF 2CH 115V 860MHZ TO272-4
Description: FET RF 2CH 115V 860MHZ TO272-4
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| MRF8P23160WHR3 |
|
Виробник: NXP USA Inc.
Description: FET RF 2CH 65V 2.32GHZ NI780-4
Description: FET RF 2CH 65V 2.32GHZ NI780-4
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| MRF8P23160WHSR3 |
|
Виробник: NXP USA Inc.
Description: FET RF 2CH 65V 2.32GHZ NI780-4
Current - Test: 600 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-780-4
Technology: MOSFET
Gain: 14.1dB
Power - Output: 30W
Configuration: N-Channel
Frequency: 2.32GHz
Package / Case: NI-780-4
Packaging: Tape & Reel (TR)
Description: FET RF 2CH 65V 2.32GHZ NI780-4
Current - Test: 600 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-780-4
Technology: MOSFET
Gain: 14.1dB
Power - Output: 30W
Configuration: N-Channel
Frequency: 2.32GHz
Package / Case: NI-780-4
Packaging: Tape & Reel (TR)
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| MRF8P9040NBR1 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO272-4
Current - Test: 320 mA
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: TO-272 WB-4
Technology: LDMOS
Gain: 19.1dB
Power - Output: 4W
Configuration: Dual
Frequency: 960MHz
Mounting Type: Chassis Mount
Package / Case: TO-272BB
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V TO272-4
Current - Test: 320 mA
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: TO-272 WB-4
Technology: LDMOS
Gain: 19.1dB
Power - Output: 4W
Configuration: Dual
Frequency: 960MHz
Mounting Type: Chassis Mount
Package / Case: TO-272BB
Packaging: Tape & Reel (TR)
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| MRF8S18210WGHSR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET 30V NI880XS
Current - Test: 1.3 A
Voltage - Test: 30 V
Voltage - Rated: 65 V
Supplier Device Package: NI-880XS-2 GULL
Technology: MOSFET (Metal Oxide)
Gain: 17.8dB
Power - Output: 50W
Configuration: N-Channel
Frequency: 1.93GHz
Mounting Type: Surface Mount
Package / Case: NI-880XS-2 GW
Packaging: Tape & Reel (TR)
Description: RF MOSFET 30V NI880XS
Current - Test: 1.3 A
Voltage - Test: 30 V
Voltage - Rated: 65 V
Supplier Device Package: NI-880XS-2 GULL
Technology: MOSFET (Metal Oxide)
Gain: 17.8dB
Power - Output: 50W
Configuration: N-Channel
Frequency: 1.93GHz
Mounting Type: Surface Mount
Package / Case: NI-880XS-2 GW
Packaging: Tape & Reel (TR)
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| MRF8S18210WGHSR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET 30V NI880XS
Packaging: Tape & Reel (TR)
Package / Case: NI-880XS-2 GW
Mounting Type: Surface Mount
Frequency: 1.93GHz
Configuration: N-Channel
Power - Output: 50W
Gain: 17.8dB
Technology: MOSFET (Metal Oxide)
Supplier Device Package: NI-880XS-2 GULL
Part Status: Discontinued at Digi-Key
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.3 A
Description: RF MOSFET 30V NI880XS
Packaging: Tape & Reel (TR)
Package / Case: NI-880XS-2 GW
Mounting Type: Surface Mount
Frequency: 1.93GHz
Configuration: N-Channel
Power - Output: 50W
Gain: 17.8dB
Technology: MOSFET (Metal Oxide)
Supplier Device Package: NI-880XS-2 GULL
Part Status: Discontinued at Digi-Key
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.3 A
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| MRF8S21100HR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.17GHz
Configuration: N-Channel
Power - Output: 24W
Gain: 18.3dB
Technology: MOSFET (Metal Oxide)
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 700 mA
Description: RF MOSFET 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.17GHz
Configuration: N-Channel
Power - Output: 24W
Gain: 18.3dB
Technology: MOSFET (Metal Oxide)
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 700 mA
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| MRF8S9202GNR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: N-Channel
Power - Output: 58W
Gain: 19dB
Technology: MOSFET
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.3 A
Description: RF MOSFET 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: N-Channel
Power - Output: 58W
Gain: 19dB
Technology: MOSFET
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.3 A
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| MRF8S9232NR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Configuration: N-Channel
Power - Output: 63W
Gain: 18.1dB
Technology: MOSFET
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Description: RF MOSFET 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Configuration: N-Channel
Power - Output: 63W
Gain: 18.1dB
Technology: MOSFET
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
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| MRFE6VP100HR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Package / Case: NI-780-4
Packaging: Tape & Reel (TR)
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Part Status: Active
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 26dB
Power - Output: 100W
Frequency: 512MHz
Mounting Type: Chassis Mount
Description: RF MOSFET LDMOS 50V NI780
Package / Case: NI-780-4
Packaging: Tape & Reel (TR)
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Part Status: Active
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 26dB
Power - Output: 100W
Frequency: 512MHz
Mounting Type: Chassis Mount
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| MRFE6VP100HSR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-780S-4L
Technology: LDMOS
Gain: 26dB
Power - Output: 100W
Frequency: 512MHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 50V NI780
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-780S-4L
Technology: LDMOS
Gain: 26dB
Power - Output: 100W
Frequency: 512MHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Tape & Reel (TR)
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| MRFE6VS25NR1 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-2
Current - Test: 10 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 25.4dB
Power - Output: 25W
Frequency: 512MHz
Mounting Type: Surface Mount
Package / Case: TO-270AA
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 50V TO270-2
Current - Test: 10 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 25.4dB
Power - Output: 25W
Frequency: 512MHz
Mounting Type: Surface Mount
Package / Case: TO-270AA
Packaging: Tape & Reel (TR)
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| S912XEP100J5MAGR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
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| S912XEP100J5VAGR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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| S912XEP768J5MAGR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Description: IC MCU 16BIT 768KB FLASH 144LQFP
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| S912XEQ512J3CAGR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
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| S912XET512J3VALR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
DigiKey Programmable: Not Verified
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| S9S08AW60E5MFGER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
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| S9S08EL32F1MTJR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 20TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 16
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Description: IC MCU 8BIT 32KB FLASH 20TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 16
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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| S9S08SG8E2CTGR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 12
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 12
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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