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KKL03Z32CAF4R KKL03Z32CAF4R NXP USA Inc. KL03P24M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 20WLCSP
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MK10DX256VLH7R MK10DX256VLH7R NXP USA Inc. K10P64M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 26x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
на замовлення 5063 шт:
термін постачання 21-31 дні (днів)
1+686.72 грн
10+510.83 грн
25+498.11 грн
100+464.40 грн
250+429.72 грн
500+407.96 грн
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MK50DX128CLH7R MK50DX128CLH7R NXP USA Inc. K50PB.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Verified
на замовлення 1499 шт:
термін постачання 21-31 дні (днів)
1+885.98 грн
10+669.54 грн
25+623.52 грн
100+537.71 грн
250+515.08 грн
500+501.45 грн
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MKL03Z32CAF4R MKL03Z32CAF4R NXP USA Inc. KL03P24M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (2x1.61)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 5920 шт:
термін постачання 21-31 дні (днів)
2+243.72 грн
10+176.29 грн
25+161.61 грн
100+136.54 грн
250+129.33 грн
500+124.98 грн
1000+119.41 грн
2500+115.69 грн
Мінімальне замовлення: 2
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HEF4025BT,653 HEF4025BT,653 NXP USA Inc. HEF4025B.pdf Description: IC GATE NOR 3CH 3-INP 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 2.4mA, 2.4mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Part Status: Obsolete
Number of Circuits: 3
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MC33907AE MC33907AE NXP USA Inc. Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Obsolete
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AFT05MS006NT1 AFT05MS006NT1 NXP USA Inc. AFT05MS006N.pdf Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 6W
Gain: 18.3dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Not For New Designs
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
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AFT09MS015NT1 AFT09MS015NT1 NXP USA Inc. AFT09MS015N.pdf Description: RF MOSFET LDMOS 12.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 16W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 100 mA
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AFT20P060-4GNR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: Dual
Power - Output: 6.3W
Gain: 18.9dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
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AFT20P140-4WGNR3 NXP USA Inc. Description: FET RF 2CH 65V 1.91GHZ OM780-4GW
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Mounting Type: Surface Mount
Frequency: 1.88GHz ~ 1.91GHz
Configuration: Dual
Power - Output: 24W
Gain: 17.8dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
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AFT21S140W02GSR3 AFT21S140W02GSR3 NXP USA Inc. Description: FET RF 65V 2.14GHZ NI-780S-2
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 32W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
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AFT21S140W02SR3 AFT21S140W02SR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.14GHz
Power - Output: 32W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
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AFT21S220W02GSR3 AFT21S220W02GSR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 50W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.2 A
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AFT21S220W02SR3 AFT21S220W02SR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.14GHz
Power - Output: 50W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.2 A
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AFV09P350-04NR3 AFV09P350-04NR3 NXP USA Inc. AFV09P350-04N.pdf Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 860 mA
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MC22XSD200BEKR2 MC22XSD200BEKR2 NXP USA Inc. MC22XSD200BEK.pdf Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
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MC33882PEKR2 MC33882PEKR2 NXP USA Inc. Description: IC PWR DRIVER N-CHAN 1:1 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI, Parallel
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 400mOhm
Voltage - Load: 8V ~ 25V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Active
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MC33907AER2 MC33907AER2 NXP USA Inc. Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Obsolete
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MC50XSD200BEKR2 MC50XSD200BEKR2 NXP USA Inc. MC50XSD200BEK.pdf Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
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MCIMX283DVM4BR2 MCIMX283DVM4BR2 NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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MCIMX286CVM4BR2 MCIMX286CVM4BR2 NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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MCIMX6U5DVM10ACR MCIMX6U5DVM10ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
500+2251.63 грн
Мінімальне замовлення: 500
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MM9Z1I638BM2EPR2 NXP USA Inc. MM9Z1_638D1.pdf Description: IC BATT MONITOR MCU LIN 48QFN
Packaging: Tape & Reel (TR)
Part Status: Active
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MM9Z1J638BM2EPR2 MM9Z1J638BM2EPR2 NXP USA Inc. MM9Z1_638D1.pdf Description: IC BATT MONITOR MULTI-CHEM 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: CAN
Operating Temperature: -40°C ~ 125°C (TJ)
Battery Chemistry: Multi-Chemistry
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
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MMPF0100NPAEPR2 MMPF0100NPAEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
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MMPF0100NPAZESR2 MMPF0100NPAZESR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MMPF0200F0ANESR2 MMPF0200F0ANESR2 NXP USA Inc. MMPF0200.pdf Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
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MMPF0200F3AEPR2 MMPF0200F3AEPR2 NXP USA Inc. MMPF0200.pdf Description: IC REG CONV I.MX6 11OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
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MMPF0200F3ANESR2 MMPF0200F3ANESR2 NXP USA Inc. MMPF0200.pdf Description: IC REG CONV I.MX6 11OUT 56QFN
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MMPF0200F4AEPR2 MMPF0200F4AEPR2 NXP USA Inc. MMPF0200.pdf Description: IC REG CONV I.MX6 11OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
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MMPF0200NPAZESR2 MMPF0200NPAZESR2 NXP USA Inc. MMPF0200.pdf Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
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MMRF1004GNR1 MMRF1004GNR1 NXP USA Inc. Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
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MMRF1004NR1 MMRF1004NR1 NXP USA Inc. Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
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MMRF1005HR5 MMRF1005HR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.3GHz
Power - Output: 250W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MMRF1005HSR5 MMRF1005HSR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.3GHz
Power - Output: 250W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MMRF1006HSR5 NXP USA Inc. Description: FET RF 2CH 120V 450MHZ NI-1230S
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4
Frequency: 450MHz
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 150 mA
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MMRF1007HR5 NXP USA Inc. Description: FET RF 2CH 110V 1.03GHZ NI-1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4H
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
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MMRF1007HSR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
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MMRF1008HR5 MMRF1008HR5 NXP USA Inc. www.nxp.com Description: FET RF 100V 1.03GHZ NI-780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Last Time Buy
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MMRF1008HSR5 MMRF1008HSR5 NXP USA Inc. Description: FET RF 100V 1.03GHZ NI-780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
товару немає в наявності
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MMRF1009HR5 MMRF1009HR5 NXP USA Inc. www.nxp.com Description: FET RF 110V 1.03GHZ NI-780S
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Last Time Buy
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
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MMRF1009HSR5 MMRF1009HSR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Last Time Buy
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
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MMRF1020-04GNR3 NXP USA Inc. MMRF1020-04N.pdf Description: RF MOSFET LDMOS 48V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 860 mA
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MMRF1020-04NR3 MMRF1020-04NR3 NXP USA Inc. MMRF1020-04N.pdf Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 860 mA
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MMRF1304GNR1 MMRF1304GNR1 NXP USA Inc. Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
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MMRF1304LR5 MMRF1304LR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.9dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
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MMRF1304NR1 MMRF1304NR1 NXP USA Inc. Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
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MMRF1305HR5 MMRF1305HR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 512MHz
Configuration: Dual
Power - Output: 100W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
50+6151.30 грн
Мінімальне замовлення: 50
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MMRF1305HSR5 MMRF1305HSR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 512MHz
Configuration: Dual
Power - Output: 100W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MMRF1306HSR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MMRF2004NBR1 MMRF2004NBR1 NXP USA Inc. Description: RF MOSFET LDMOS 28V TO272-16
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 4W
Gain: 28.5dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 77 mA
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MRF8P20140WGHSR3 MRF8P20140WGHSR3 NXP USA Inc. www.nxp.com Description: FET RF 2CH 65V 1.91GHZ NI780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 1.88GHz ~ 1.91GHz
Configuration: Dual
Power - Output: 24W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
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MRFE6VP5300GNR1 MRFE6VP5300GNR1 NXP USA Inc. MRFE6VP5300N.pdf Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 600MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MRFE6VP5300NR1 MRFE6VP5300NR1 NXP USA Inc. MRFE6VP5300N.pdf Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 600MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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S9S08RNA32W1MLCR S9S08RNA32W1MLCR NXP USA Inc. S9S08RN60DS.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
2000+195.25 грн
Мінімальне замовлення: 2000
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S9S12G96F0MLHR S9S12G96F0MLHR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 96KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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SPC5674FF3MVY3R SPC5674FF3MVY3R NXP USA Inc. MPC5674F.pdf Description: IC MCU 32BIT 4MB FLASH 516PBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
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CP-MCTB-MKV10Z-N NXP USA Inc. Description: MATLAB SIMULINK MKV10Z PHY. LIC.
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DL-MCTB-MKV10Z-N NXP USA Inc. Description: MATLAB SIMULINK MKV10Z DNLD LIC.
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D-MCTB-MC56F82-N NXP USA Inc. Description: DOWNLOAD TOOLBOX MBD MC56F82XX
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KKL03Z32CAF4R KL03P24M48SF0.pdf
KKL03Z32CAF4R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
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MK10DX256VLH7R K10P64M72SF1.pdf
MK10DX256VLH7R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 26x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
на замовлення 5063 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+686.72 грн
10+510.83 грн
25+498.11 грн
100+464.40 грн
250+429.72 грн
500+407.96 грн
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MK50DX128CLH7R K50PB.pdf
MK50DX128CLH7R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Verified
на замовлення 1499 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+885.98 грн
10+669.54 грн
25+623.52 грн
100+537.71 грн
250+515.08 грн
500+501.45 грн
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MKL03Z32CAF4R KL03P24M48SF0.pdf
MKL03Z32CAF4R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (2x1.61)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 5920 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+243.72 грн
10+176.29 грн
25+161.61 грн
100+136.54 грн
250+129.33 грн
500+124.98 грн
1000+119.41 грн
2500+115.69 грн
Мінімальне замовлення: 2
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HEF4025BT,653 HEF4025B.pdf
HEF4025BT,653
Виробник: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 2.4mA, 2.4mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Part Status: Obsolete
Number of Circuits: 3
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MC33907AE
MC33907AE
Виробник: NXP USA Inc.
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Obsolete
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AFT05MS006NT1 AFT05MS006N.pdf
AFT05MS006NT1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 6W
Gain: 18.3dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Not For New Designs
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
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AFT09MS015NT1 AFT09MS015N.pdf
AFT09MS015NT1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 16W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 100 mA
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AFT20P060-4GNR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: Dual
Power - Output: 6.3W
Gain: 18.9dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
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AFT20P140-4WGNR3
Виробник: NXP USA Inc.
Description: FET RF 2CH 65V 1.91GHZ OM780-4GW
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Mounting Type: Surface Mount
Frequency: 1.88GHz ~ 1.91GHz
Configuration: Dual
Power - Output: 24W
Gain: 17.8dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
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AFT21S140W02GSR3
AFT21S140W02GSR3
Виробник: NXP USA Inc.
Description: FET RF 65V 2.14GHZ NI-780S-2
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 32W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
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AFT21S140W02SR3
AFT21S140W02SR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.14GHz
Power - Output: 32W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
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AFT21S220W02GSR3
AFT21S220W02GSR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 50W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.2 A
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AFT21S220W02SR3
AFT21S220W02SR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.14GHz
Power - Output: 50W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.2 A
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AFV09P350-04NR3 AFV09P350-04N.pdf
AFV09P350-04NR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 860 mA
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MC22XSD200BEKR2 MC22XSD200BEK.pdf
MC22XSD200BEKR2
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
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MC33882PEKR2
MC33882PEKR2
Виробник: NXP USA Inc.
Description: IC PWR DRIVER N-CHAN 1:1 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI, Parallel
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 400mOhm
Voltage - Load: 8V ~ 25V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Active
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MC33907AER2
MC33907AER2
Виробник: NXP USA Inc.
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Obsolete
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MC50XSD200BEKR2 MC50XSD200BEK.pdf
MC50XSD200BEKR2
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
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MCIMX283DVM4BR2 IMX28CEC.pdf
MCIMX283DVM4BR2
Виробник: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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MCIMX286CVM4BR2 IMX28CEC.pdf
MCIMX286CVM4BR2
Виробник: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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MCIMX6U5DVM10ACR IMX6SDLAEC.pdf
MCIMX6U5DVM10ACR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
500+2251.63 грн
Мінімальне замовлення: 500
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MM9Z1I638BM2EPR2 MM9Z1_638D1.pdf
Виробник: NXP USA Inc.
Description: IC BATT MONITOR MCU LIN 48QFN
Packaging: Tape & Reel (TR)
Part Status: Active
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MM9Z1J638BM2EPR2 MM9Z1_638D1.pdf
MM9Z1J638BM2EPR2
Виробник: NXP USA Inc.
Description: IC BATT MONITOR MULTI-CHEM 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: CAN
Operating Temperature: -40°C ~ 125°C (TJ)
Battery Chemistry: Multi-Chemistry
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
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MMPF0100NPAEPR2 MMPF0100.pdf
MMPF0100NPAEPR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
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MMPF0100NPAZESR2 MMPF0100.pdf
MMPF0100NPAZESR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MMPF0200F0ANESR2 MMPF0200.pdf
MMPF0200F0ANESR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
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MMPF0200F3AEPR2 MMPF0200.pdf
MMPF0200F3AEPR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
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MMPF0200F3ANESR2 MMPF0200.pdf
MMPF0200F3ANESR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56QFN
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MMPF0200F4AEPR2 MMPF0200.pdf
MMPF0200F4AEPR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
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MMPF0200NPAZESR2 MMPF0200.pdf
MMPF0200NPAZESR2
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
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MMRF1004GNR1
MMRF1004GNR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
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MMRF1004NR1
MMRF1004NR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
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MMRF1005HR5
MMRF1005HR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.3GHz
Power - Output: 250W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MMRF1005HSR5
MMRF1005HSR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.3GHz
Power - Output: 250W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MMRF1006HSR5
Виробник: NXP USA Inc.
Description: FET RF 2CH 120V 450MHZ NI-1230S
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4
Frequency: 450MHz
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 150 mA
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MMRF1007HR5
Виробник: NXP USA Inc.
Description: FET RF 2CH 110V 1.03GHZ NI-1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4H
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
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MMRF1007HSR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
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MMRF1008HR5 www.nxp.com
MMRF1008HR5
Виробник: NXP USA Inc.
Description: FET RF 100V 1.03GHZ NI-780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Last Time Buy
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MMRF1008HSR5
MMRF1008HSR5
Виробник: NXP USA Inc.
Description: FET RF 100V 1.03GHZ NI-780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MMRF1009HR5 www.nxp.com
MMRF1009HR5
Виробник: NXP USA Inc.
Description: FET RF 110V 1.03GHZ NI-780S
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Last Time Buy
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
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MMRF1009HSR5
MMRF1009HSR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Last Time Buy
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
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MMRF1020-04GNR3 MMRF1020-04N.pdf
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 860 mA
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MMRF1020-04NR3 MMRF1020-04N.pdf
MMRF1020-04NR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 860 mA
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MMRF1304GNR1
MMRF1304GNR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
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MMRF1304LR5
MMRF1304LR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.9dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
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MMRF1304NR1
MMRF1304NR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
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MMRF1305HR5
MMRF1305HR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 512MHz
Configuration: Dual
Power - Output: 100W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
50+6151.30 грн
Мінімальне замовлення: 50
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MMRF1305HSR5
MMRF1305HSR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 512MHz
Configuration: Dual
Power - Output: 100W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MMRF1306HSR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MMRF2004NBR1
MMRF2004NBR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO272-16
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 4W
Gain: 28.5dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 77 mA
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MRF8P20140WGHSR3 www.nxp.com
MRF8P20140WGHSR3
Виробник: NXP USA Inc.
Description: FET RF 2CH 65V 1.91GHZ NI780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 1.88GHz ~ 1.91GHz
Configuration: Dual
Power - Output: 24W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
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MRFE6VP5300GNR1 MRFE6VP5300N.pdf
MRFE6VP5300GNR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 600MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MRFE6VP5300NR1 MRFE6VP5300N.pdf
MRFE6VP5300NR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 600MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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S9S08RNA32W1MLCR S9S08RN60DS.pdf
S9S08RNA32W1MLCR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2000+195.25 грн
Мінімальне замовлення: 2000
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S9S12G96F0MLHR MC9S12GRMV1.pdf
S9S12G96F0MLHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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SPC5674FF3MVY3R MPC5674F.pdf
SPC5674FF3MVY3R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 516PBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
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CP-MCTB-MKV10Z-N
Виробник: NXP USA Inc.
Description: MATLAB SIMULINK MKV10Z PHY. LIC.
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DL-MCTB-MKV10Z-N
Виробник: NXP USA Inc.
Description: MATLAB SIMULINK MKV10Z DNLD LIC.
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D-MCTB-MC56F82-N
Виробник: NXP USA Inc.
Description: DOWNLOAD TOOLBOX MBD MC56F82XX
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