Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36241) > Сторінка 272 з 605
| Фото | Назва | Виробник | Інформація |
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PTN3460IBS/F2Z | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 56HVQFNPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: LVDS Supplier Device Package: 56-HVQFN (7x7) |
товару немає в наявності |
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PTN36241GHXAZ | NXP USA Inc. |
Description: IC REDRIVER USB 3.0 12X2QFNPackaging: Tape & Reel (TR) Package / Case: 12-XFQFN Delay Time: 500ps Number of Channels: 2 Mounting Type: Surface Mount Type: Buffer, ReDriver Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.9V Applications: USB 3.0 Current - Supply: 105mA Data Rate (Max): 5Gbps Supplier Device Package: 12-X2QFN (1.25x2.10) Signal Conditioning: Input Equalization, Output De-Emphasis Part Status: Obsolete |
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PTN5100ABSZ | NXP USA Inc. |
Description: IC USB PD PHY TYPE C 20HVQFN |
товару немає в наявності |
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PTN5100DABSBZ | NXP USA Inc. |
Description: IC USB PD PHY TYPE C 20HVQFN |
товару немає в наявності |
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PTN5150HHXZ | NXP USA Inc. |
Description: IC USB HOST CTLR 12X2QFN |
товару немає в наявності |
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SA604AHRZ | NXP USA Inc. |
Description: IC FM IF SYSTEM LOW PWR 16UHXQFNPackaging: Tape & Reel (TR) Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Function: IF Receiver Frequency: 25MHz RF Type: FM Supplier Device Package: 16-HXQFN (3x3) |
товару немає в наявності |
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| SL2S1412FTBX | NXP USA Inc. |
Description: IC I-CODE ILT-M 3XSON Packaging: Tape & Reel (TR) Mounting Type: Surface Mount |
товару немає в наявності |
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SL2S1512FTBX | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 3XSONPackaging: Tape & Reel (TR) Package / Case: 3-XDFN Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.5V ~ 1.7V Standards: ISO 18000-6, EPC Supplier Device Package: 3-XSON (1x1.45) Part Status: Active |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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| SL2S1612FTBX | NXP USA Inc. | Description: IC I-CODE ILT-M 3XSON |
товару немає в наявності |
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| SL2S5302FTBX | NXP USA Inc. |
Description: IC I-CODE SLI 3XSON Packaging: Tape & Reel (TR) |
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SL3S1204FTB0X | NXP USA Inc. |
Description: IC RFID TRANSP 840-960MHZ 6XSONPackaging: Tape & Reel (TR) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 840MHz ~ 960MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C Supplier Device Package: 6-XSON (1.45x1.00) |
товару немає в наявності |
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SL3S1214FTB0X | NXP USA Inc. |
Description: IC RFID TRANSP 840-960MHZ 6XSONPackaging: Tape & Reel (TR) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 840MHz ~ 960MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C Supplier Device Package: 6-XSON (1.45x1.00) |
товару немає в наявності |
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TEA1833LTS/1H | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK SC74 Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 90% Frequency - Switching: 65kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V Supplier Device Package: SC-74 Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit Voltage - Start Up: 22 V |
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TEA1833LTS/1X | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK SC74Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 90% Frequency - Switching: 65kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V Supplier Device Package: SC-74 Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit Voltage - Start Up: 22 V |
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TEA1833TS/1H | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK SC74Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 90% Frequency - Switching: 65kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V Supplier Device Package: SC-74 Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit Voltage - Start Up: 22 V |
товару немає в наявності |
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TEA1833TS/1X | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK SC74Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 90% Frequency - Switching: 65kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V Supplier Device Package: SC-74 Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit Voltage - Start Up: 22 V |
товару немає в наявності |
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TEA1993TS/1H | NXP USA Inc. |
Description: IC CTRLR SYNC RECT SC-74Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Applications: Secondary-Side Controller, Synchronous Rectifier Supplier Device Package: SC-74 Part Status: Active Current - Supply: 200 µA DigiKey Programmable: Not Verified |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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TEA1993TS/1X | NXP USA Inc. |
Description: IC CTRLR SYNC RECT SC-74Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Applications: Secondary-Side Controller, Synchronous Rectifier Supplier Device Package: SC-74 Current - Supply: 200 µA DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| TFF1025HN/N1X | NXP USA Inc. |
Description: IC MIXER OSC PLL LNB 16DHVQFN Packaging: Tape & Reel (TR) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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JN5169/001K | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNPackaging: Tray Package / Case: 40-VFQFN Exposed Pad Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 3.6V Power - Output: 10dBm Protocol: Zigbee® Current - Receiving: 14.7mA Current - Transmitting: 23mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 20 RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 330 шт: термін постачання 21-31 дні (днів) |
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LPC18S10FET180E | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 136K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 4x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 49 DigiKey Programmable: Not Verified |
товару немає в наявності |
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LPC18S30FBD144E | NXP USA Inc. | Description: IC MCU 32BIT ROMLESS 144LQFP |
товару немає в наявності |
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LPC18S30FET100E | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 200K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 4x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 49 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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LPC18S37JBD144E | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1MB (1M x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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LPC18S57JBD208E | NXP USA Inc. | Description: IC MCU 32BIT 1MB FLASH 208LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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LPC43S20FET180E | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGAPackaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 264K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 118 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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LPC43S30FBD144E | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 204MHz RAM Size: 264K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 83 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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LPC43S30FET100E | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGA |
на замовлення 260 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||
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LPC43S37JBD144E | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 204MHz Program Memory Size: 1MB (1M x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 DigiKey Programmable: Not Verified |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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LPC43S57JBD208E | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 208LQFPPackaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 204MHz Program Memory Size: 1MB (1M x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 142 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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LPC43S70FET100E | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGAPackaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 282K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 16x10b, 6x12b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 49 DigiKey Programmable: Not Verified |
на замовлення 72 шт: термін постачання 21-31 дні (днів) |
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LPC54114J256BD64QL | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 50 DigiKey Programmable: Not Verified |
на замовлення 3057 шт: термін постачання 21-31 дні (днів) |
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PN5180A0ET/C1QL | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGAPackaging: Tray Package / Case: 64-TFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: SPI, UART Type: RFID Reader/Transponder Operating Temperature: -30°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 5.5V Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC Supplier Device Package: 64-TFBGA (5.5x5.5) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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PN5180A0HN/C1E | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFNPackaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: SPI, UART Type: RFID Reader/Transponder Operating Temperature: -30°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 5.5V Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC Supplier Device Package: 40-HVQFN (6x6) Part Status: Active |
на замовлення 148 шт: термін постачання 21-31 дні (днів) |
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| TDA19971AHN/C181E | NXP USA Inc. |
Description: IC VIDEO RECEIVER 72HVQFN Packaging: Tray Mounting Type: Surface Mount Function: Receiver Voltage - Supply: 1.71V ~ 1.89V, 3.13V ~ 3.47V Applications: Consumer Video Standards: HDMI 1.4a, IEC 60958, IEC 61937, ITU-R BT.656 Part Status: Active Control Interface: I²C |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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TDF8546AJ/N1ZU | NXP USA Inc. |
Description: IC AMP CLASS AB QUAD 25W DBS27PPackaging: Tray Features: Depop, Short-Circuit and Thermal Protection Package / Case: 27-SIP, Formed Leads Output Type: 4-Channel (Quad) Mounting Type: Through Hole Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm Supplier Device Package: DBS27P Part Status: Obsolete |
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В кошику од. на суму грн. | ||||||||||
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TDF8546AJS/N1ZS | NXP USA Inc. |
Description: IC AMP CLSS AB QUAD 25W 27DBSMSPPackaging: Tube Features: Depop, Short-Circuit and Thermal Protection Package / Case: 27-PowerSMD Module Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm Supplier Device Package: 27-DBSMSP Part Status: Active |
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В кошику од. на суму грн. | ||||||||||
| TDF8546ASD/N1ZU | NXP USA Inc. |
Description: IC AMP CLASS AB QUAD 25W 27RDBSPackaging: Tube Features: Depop, Short-Circuit and Thermal Protection Package / Case: 27-SIP Formed Leads Output Type: 4-Channel (Quad) Mounting Type: Through Hole Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm Supplier Device Package: 27-RDBS Part Status: Active |
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TDF8546J/N2ZU | NXP USA Inc. |
Description: IC AMP CLASS AB QUAD 25W DBS27PPackaging: Tube Features: Depop, Short-Circuit and Thermal Protection Package / Case: 27-SIP, Formed Leads Output Type: 4-Channel (Quad) Mounting Type: Through Hole Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm Supplier Device Package: DBS27P Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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TDF8546JS/N2ZS | NXP USA Inc. |
Description: IC AMP CLSS AB QUAD 25W 27DBSMSPPackaging: Tube Features: Depop, Short-Circuit and Thermal Protection Package / Case: 27-PowerSMD Module Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm Supplier Device Package: 27-DBSMSP Part Status: Active |
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В кошику од. на суму грн. | ||||||||||
| TDF8548AJ/N1ZU | NXP USA Inc. |
Description: IC AMP CLASS AB QUAD 28W DBS27P Packaging: Tray Features: Depop, Short-Circuit and Thermal Protection Package / Case: 27-SIP, Formed Leads Output Type: 4-Channel (Quad) Mounting Type: Through Hole Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm Supplier Device Package: DBS27P Part Status: Obsolete |
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TDA8037T/C1S | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28SOPackaging: Tube Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: Smart Card Supplier Device Package: 28-SO |
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TDA8579T/N1SU | NXP USA Inc. |
Description: IC TRANSCEIVER 0/2 8SOPackaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Receiver Operating Temperature: -40°C ~ 85°C Voltage - Supply: 5V ~ 18V Number of Drivers/Receivers: 0/2 Supplier Device Package: 8-SO Part Status: Obsolete |
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В кошику од. на суму грн. | ||||||||||
| FRDMSTBCDP5004 | NXP USA Inc. |
Description: KIT EVAL PRESSURE SENS BOARDPackaging: Bulk Sensitivity: 1v/kPa Interface: Analog Voltage - Supply: 4.75V ~ 5.25V Sensor Type: Pressure Utilized IC / Part: MPXV5004DP Supplied Contents: Board(s) Embedded: No Sensing Range: 0 ~ 3.92 kPa Part Status: Active |
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MPC17529EJ | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.7-5.6V 20SSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 700mA Interface: Parallel Operating Temperature: -20°C ~ 150°C (TJ) Output Configuration: Half Bridge (4) Voltage - Supply: 2.7V ~ 5.6V Applications: Battery Powered Technology: CMOS Voltage - Load: 2V ~ 6.8V Supplier Device Package: 20-TSSOP Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MCIMX6G2CVK05AA | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 272MAPBGAPackaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MPC5777C-416DS | NXP USA Inc. |
Description: MPC5777C EVAL BRDPackaging: Bulk Mounting Type: Socket Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5777C Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MPC574XG-256DS | NXP USA Inc. |
Description: MPC574XC/G EVAL BRDPackaging: Bulk Mounting Type: Socket Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC574xC/G Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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MPC574XG-324DS | NXP USA Inc. |
Description: MPC574XC/G EVAL BRDPackaging: Bulk Mounting Type: Socket Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC574xC/G Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MPC574XG-MB | NXP USA Inc. |
Description: MPC574XC/G EVAL BRDPackaging: Bulk Mounting Type: Socket Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC574xC/G |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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SPC5748GGK1MMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGAPackaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
на замовлення 419 шт: термін постачання 21-31 дні (днів) |
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SPC5748GK1MKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLASH 176LQFPPackaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
на замовлення 108 шт: термін постачання 21-31 дні (днів) |
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FRDM-HB2001-EVM | NXP USA Inc. |
Description: HB2001 BOARD WITH FRDM-KL25ZPackaging: Box Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: KL1x, KL2x, MC33HB2001, mbed-Enabled Development Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Part Status: Active Contents: Board(s) Secondary Attributes: SPI Interface(s) |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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74HC4066PWHL | NXP USA Inc. |
Description: IC SW SPST-NOX4 95OHM 14TSSOPPackaging: Tape & Reel (TR) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 95Ohm -3db Bandwidth: 200MHz Supplier Device Package: 14-TSSOP Voltage - Supply, Single (V+): 2V ~ 10V Crosstalk: -60dB @ 1MHz Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Channel-to-Channel Matching (ΔRon): 3Ohm Switch Time (Ton, Toff) (Max): 30ns, 20ns Channel Capacitance (CS(off), CD(off)): 3.5pF Current - Leakage (IS(off)) (Max): 1µA Part Status: Obsolete Number of Circuits: 4 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| TFF1024HN/N1,135 | NXP USA Inc. |
Description: IC CLOCKPackaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Output: Clock Frequency - Max: 2.15MHz Input: Clock, Crystal Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Main Purpose: Ku band VSAT applications Ratio - Input:Output: 2:1 Differential - Input:Output: No/No Supplier Device Package: 16-DHVQFN (2.5x3.5) PLL: Yes Part Status: Active Number of Circuits: 1 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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UJA1131HW/5V0,518 | NXP USA Inc. |
Description: IC TRANSCEIVER |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| UJA1169TK/FZ | NXP USA Inc. |
Description: IC TRANSCEIVER |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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UJA1169TK/X/FZ | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 20HVSONPackaging: Tape & Reel (TR) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN Voltage - Supply: 5V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| UJA1169TK/XZ | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 20HVSON |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| UJA1169TKZ | NXP USA Inc. |
Description: IC TRANSCEIVER |
товару немає в наявності |
В кошику од. на суму грн. |
| PTN3460IBS/F2Z |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
товару немає в наявності
В кошику
од. на суму грн.
| PTN36241GHXAZ |
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Виробник: NXP USA Inc.
Description: IC REDRIVER USB 3.0 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 500ps
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB 3.0
Current - Supply: 105mA
Data Rate (Max): 5Gbps
Supplier Device Package: 12-X2QFN (1.25x2.10)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Obsolete
Description: IC REDRIVER USB 3.0 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 500ps
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB 3.0
Current - Supply: 105mA
Data Rate (Max): 5Gbps
Supplier Device Package: 12-X2QFN (1.25x2.10)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| PTN5100ABSZ |
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Виробник: NXP USA Inc.
Description: IC USB PD PHY TYPE C 20HVQFN
Description: IC USB PD PHY TYPE C 20HVQFN
товару немає в наявності
В кошику
од. на суму грн.
| PTN5100DABSBZ |
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Виробник: NXP USA Inc.
Description: IC USB PD PHY TYPE C 20HVQFN
Description: IC USB PD PHY TYPE C 20HVQFN
товару немає в наявності
В кошику
од. на суму грн.
| PTN5150HHXZ |
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Виробник: NXP USA Inc.
Description: IC USB HOST CTLR 12X2QFN
Description: IC USB HOST CTLR 12X2QFN
товару немає в наявності
В кошику
од. на суму грн.
| SA604AHRZ |
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Виробник: NXP USA Inc.
Description: IC FM IF SYSTEM LOW PWR 16UHXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Function: IF Receiver
Frequency: 25MHz
RF Type: FM
Supplier Device Package: 16-HXQFN (3x3)
Description: IC FM IF SYSTEM LOW PWR 16UHXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Function: IF Receiver
Frequency: 25MHz
RF Type: FM
Supplier Device Package: 16-HXQFN (3x3)
товару немає в наявності
В кошику
од. на суму грн.
| SL2S1412FTBX |
Виробник: NXP USA Inc.
Description: IC I-CODE ILT-M 3XSON
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Description: IC I-CODE ILT-M 3XSON
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
товару немає в наявності
В кошику
од. на суму грн.
| SL2S1512FTBX |
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Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Tape & Reel (TR)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 18000-6, EPC
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Tape & Reel (TR)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 18000-6, EPC
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5000+ | 16.30 грн |
| SL2S1612FTBX |
Виробник: NXP USA Inc.
Description: IC I-CODE ILT-M 3XSON
Description: IC I-CODE ILT-M 3XSON
товару немає в наявності
В кошику
од. на суму грн.
| SL3S1204FTB0X |
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Виробник: NXP USA Inc.
Description: IC RFID TRANSP 840-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 6-XSON (1.45x1.00)
Description: IC RFID TRANSP 840-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 6-XSON (1.45x1.00)
товару немає в наявності
В кошику
од. на суму грн.
| SL3S1214FTB0X |
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Виробник: NXP USA Inc.
Description: IC RFID TRANSP 840-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 6-XSON (1.45x1.00)
Description: IC RFID TRANSP 840-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 6-XSON (1.45x1.00)
товару немає в наявності
В кошику
од. на суму грн.
| TEA1833LTS/1H |
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 65kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 65kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
товару немає в наявності
В кошику
од. на суму грн.
| TEA1833LTS/1X |
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Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 65kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 65kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
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В кошику
од. на суму грн.
| TEA1833TS/1H |
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Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 65kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 65kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
товару немає в наявності
В кошику
од. на суму грн.
| TEA1833TS/1X |
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Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 65kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 65kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
товару немає в наявності
В кошику
од. на суму грн.
| TEA1993TS/1H |
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Виробник: NXP USA Inc.
Description: IC CTRLR SYNC RECT SC-74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Part Status: Active
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
Description: IC CTRLR SYNC RECT SC-74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Part Status: Active
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3000+ | 35.24 грн |
| TEA1993TS/1X |
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Виробник: NXP USA Inc.
Description: IC CTRLR SYNC RECT SC-74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
Description: IC CTRLR SYNC RECT SC-74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| TFF1025HN/N1X |
Виробник: NXP USA Inc.
Description: IC MIXER OSC PLL LNB 16DHVQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC MIXER OSC PLL LNB 16DHVQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| JN5169/001K |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 14.7mA
Current - Transmitting: 23mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 14.7mA
Current - Transmitting: 23mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 330 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 445.04 грн |
| 10+ | 392.53 грн |
| 25+ | 356.82 грн |
| 80+ | 301.37 грн |
| 230+ | 276.25 грн |
| LPC18S10FET180E |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 49
DigiKey Programmable: Not Verified
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| LPC18S30FBD144E |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Description: IC MCU 32BIT ROMLESS 144LQFP
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| LPC18S30FET100E |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
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| LPC18S37JBD144E |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
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| LPC18S57JBD208E |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208LQFP
Description: IC MCU 32BIT 1MB FLASH 208LQFP
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| LPC43S20FET180E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 118
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 118
DigiKey Programmable: Not Verified
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| LPC43S30FBD144E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
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| LPC43S30FET100E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Description: IC MCU 32BIT ROMLESS 100TFBGA
на замовлення 260 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| LPC43S37JBD144E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 48 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 789.99 грн |
| 10+ | 736.93 грн |
| LPC43S57JBD208E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 142
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 142
DigiKey Programmable: Not Verified
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| LPC43S70FET100E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
на замовлення 72 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 793.84 грн |
| 10+ | 596.57 грн |
| 25+ | 517.98 грн |
| LPC54114J256BD64QL |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
на замовлення 3057 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 287.20 грн |
| 10+ | 273.74 грн |
| 25+ | 273.09 грн |
| PN5180A0ET/C1QL |
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Виробник: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
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| PN5180A0HN/C1E |
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Виробник: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
на замовлення 148 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 660.64 грн |
| 10+ | 495.88 грн |
| 25+ | 460.98 грн |
| 100+ | 396.55 грн |
| TDA19971AHN/C181E |
Виробник: NXP USA Inc.
Description: IC VIDEO RECEIVER 72HVQFN
Packaging: Tray
Mounting Type: Surface Mount
Function: Receiver
Voltage - Supply: 1.71V ~ 1.89V, 3.13V ~ 3.47V
Applications: Consumer Video
Standards: HDMI 1.4a, IEC 60958, IEC 61937, ITU-R BT.656
Part Status: Active
Control Interface: I²C
Description: IC VIDEO RECEIVER 72HVQFN
Packaging: Tray
Mounting Type: Surface Mount
Function: Receiver
Voltage - Supply: 1.71V ~ 1.89V, 3.13V ~ 3.47V
Applications: Consumer Video
Standards: HDMI 1.4a, IEC 60958, IEC 61937, ITU-R BT.656
Part Status: Active
Control Interface: I²C
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| TDF8546AJ/N1ZU |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 25W DBS27P
Packaging: Tray
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Description: IC AMP CLASS AB QUAD 25W DBS27P
Packaging: Tray
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
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| TDF8546AJS/N1ZS |
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Виробник: NXP USA Inc.
Description: IC AMP CLSS AB QUAD 25W 27DBSMSP
Packaging: Tube
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Active
Description: IC AMP CLSS AB QUAD 25W 27DBSMSP
Packaging: Tube
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Active
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| TDF8546ASD/N1ZU |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 25W 27RDBS
Packaging: Tube
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-RDBS
Part Status: Active
Description: IC AMP CLASS AB QUAD 25W 27RDBS
Packaging: Tube
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-RDBS
Part Status: Active
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| TDF8546J/N2ZU |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 25W DBS27P
Packaging: Tube
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Description: IC AMP CLASS AB QUAD 25W DBS27P
Packaging: Tube
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
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| TDF8546JS/N2ZS |
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Виробник: NXP USA Inc.
Description: IC AMP CLSS AB QUAD 25W 27DBSMSP
Packaging: Tube
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Active
Description: IC AMP CLSS AB QUAD 25W 27DBSMSP
Packaging: Tube
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Active
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| TDF8548AJ/N1ZU |
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 28W DBS27P
Packaging: Tray
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Description: IC AMP CLASS AB QUAD 28W DBS27P
Packaging: Tray
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
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| TDA8037T/C1S |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SO
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: Smart Card
Supplier Device Package: 28-SO
Description: IC INTERFACE SPECIALIZED 28SO
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: Smart Card
Supplier Device Package: 28-SO
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| TDA8579T/N1SU |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 0/2 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Receiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 0/2
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: IC TRANSCEIVER 0/2 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Receiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 0/2
Supplier Device Package: 8-SO
Part Status: Obsolete
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| FRDMSTBCDP5004 |
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Виробник: NXP USA Inc.
Description: KIT EVAL PRESSURE SENS BOARD
Packaging: Bulk
Sensitivity: 1v/kPa
Interface: Analog
Voltage - Supply: 4.75V ~ 5.25V
Sensor Type: Pressure
Utilized IC / Part: MPXV5004DP
Supplied Contents: Board(s)
Embedded: No
Sensing Range: 0 ~ 3.92 kPa
Part Status: Active
Description: KIT EVAL PRESSURE SENS BOARD
Packaging: Bulk
Sensitivity: 1v/kPa
Interface: Analog
Voltage - Supply: 4.75V ~ 5.25V
Sensor Type: Pressure
Utilized IC / Part: MPXV5004DP
Supplied Contents: Board(s)
Embedded: No
Sensing Range: 0 ~ 3.92 kPa
Part Status: Active
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| MPC17529EJ |
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.6V 20SSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-TSSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: IC MTR DRV BIPLR 2.7-5.6V 20SSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-TSSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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| MCIMX6G2CVK05AA |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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| MPC5777C-416DS |
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Виробник: NXP USA Inc.
Description: MPC5777C EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5777C
Part Status: Active
Description: MPC5777C EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5777C
Part Status: Active
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| MPC574XG-256DS |
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Виробник: NXP USA Inc.
Description: MPC574XC/G EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC574xC/G
Part Status: Active
Description: MPC574XC/G EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC574xC/G
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 35500.28 грн |
| MPC574XG-324DS |
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Виробник: NXP USA Inc.
Description: MPC574XC/G EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC574xC/G
Part Status: Active
Description: MPC574XC/G EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC574xC/G
Part Status: Active
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| MPC574XG-MB |
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Виробник: NXP USA Inc.
Description: MPC574XC/G EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC574xC/G
Description: MPC574XC/G EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC574xC/G
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 45917.21 грн |
| SPC5748GGK1MMJ6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
на замовлення 419 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2926.66 грн |
| 10+ | 2316.30 грн |
| 25+ | 2190.88 грн |
| 100+ | 1995.27 грн |
| SPC5748GK1MKU6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
на замовлення 108 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3046.77 грн |
| 10+ | 2401.94 грн |
| 25+ | 2269.20 грн |
| FRDM-HB2001-EVM |
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Виробник: NXP USA Inc.
Description: HB2001 BOARD WITH FRDM-KL25Z
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: KL1x, KL2x, MC33HB2001, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s)
Secondary Attributes: SPI Interface(s)
Description: HB2001 BOARD WITH FRDM-KL25Z
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: KL1x, KL2x, MC33HB2001, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s)
Secondary Attributes: SPI Interface(s)
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 12537.44 грн |
| 74HC4066PWHL |
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Виробник: NXP USA Inc.
Description: IC SW SPST-NOX4 95OHM 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-TSSOP
Voltage - Supply, Single (V+): 2V ~ 10V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 3Ohm
Switch Time (Ton, Toff) (Max): 30ns, 20ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Part Status: Obsolete
Number of Circuits: 4
Description: IC SW SPST-NOX4 95OHM 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-TSSOP
Voltage - Supply, Single (V+): 2V ~ 10V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 3Ohm
Switch Time (Ton, Toff) (Max): 30ns, 20ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Part Status: Obsolete
Number of Circuits: 4
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| TFF1024HN/N1,135 |
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Виробник: NXP USA Inc.
Description: IC CLOCK
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 2.15MHz
Input: Clock, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 2:1
Differential - Input:Output: No/No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
PLL: Yes
Part Status: Active
Number of Circuits: 1
DigiKey Programmable: Not Verified
Description: IC CLOCK
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 2.15MHz
Input: Clock, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 2:1
Differential - Input:Output: No/No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
PLL: Yes
Part Status: Active
Number of Circuits: 1
DigiKey Programmable: Not Verified
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| UJA1131HW/5V0,518 |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER
Description: IC TRANSCEIVER
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| UJA1169TK/FZ |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER
Description: IC TRANSCEIVER
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| UJA1169TK/X/FZ |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 20HVSON
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Obsolete
Description: IC INTFACE SPECIALIZED 20HVSON
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Obsolete
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| UJA1169TK/XZ |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 20HVSON
Description: IC INTFACE SPECIALIZED 20HVSON
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| UJA1169TKZ |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER
Description: IC TRANSCEIVER
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