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P89V51RC2FA,512 P89V51RC2FA,512 NXP USA Inc. P89V51RB2_RC2_RD2.pdf Description: IC MCU 8BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V51RC2FBC,557 P89V51RC2FBC,557 NXP USA Inc. P89V51RB2_RC2_RD2.pdf Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V51RC2FN,112 P89V51RC2FN,112 NXP USA Inc. P89V51RB2_RC2_RD2.pdf Description: IC MCU 8BIT 32KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-DIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V51RD2FN,112 P89V51RD2FN,112 NXP USA Inc. P89V51RB2_RC2_RD2.pdf Description: IC MCU 8BIT 64KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-DIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V660FA,512 P89V660FA,512 NXP USA Inc. P89V660_662_664.pdf Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 36
DigiKey Programmable: Not Verified
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P89V660FBC,557 P89V660FBC,557 NXP USA Inc. P89V660_662_664.pdf Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
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P89V662FA,512 P89V662FA,512 NXP USA Inc. P89V660_662_664.pdf Description: IC MCU 8BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 36
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
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P89V662FBC,557 P89V662FBC,557 NXP USA Inc. P89V660_662_664.pdf Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
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P89V664FA,512 P89V664FA,512 NXP USA Inc. P89V660_662_664.pdf Description: IC MCU 8BIT 64KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 36
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P89V664FBC,557 P89V664FBC,557 NXP USA Inc. P89V660_662_664.pdf Description: IC MCU 8BIT 64KB FLASH 44TQFP
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TEA1522T/N2,518 TEA1522T/N2,518 NXP USA Inc. TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Active
Power (Watts): 30 W
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TEA1520P/N2,112 TEA1520P/N2,112 NXP USA Inc. TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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TEA1521P/N2,112 TEA1521P/N2,112 NXP USA Inc. TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Obsolete
Power (Watts): 30 W
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TEA1620P/N1,112 TEA1620P/N1,112 NXP USA Inc. TEA1620P_1.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
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TEA1622P/N1,112 TEA1622P/N1,112 NXP USA Inc. TEA1622P_1.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
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TEA1623P/N1,112 TEA1623P/N1,112 NXP USA Inc. TEA1623P_TEA1623PH.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
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TEA1522P/N2,112 TEA1522P/N2,112 NXP USA Inc. TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Obsolete
Power (Watts): 30 W
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TEA1523P/N2,112 TEA1523P/N2,112 NXP USA Inc. TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Obsolete
Power (Watts): 30 W
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TEA1522T/N2,518 TEA1522T/N2,518 NXP USA Inc. TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Active
Power (Watts): 30 W
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SA614AD/01,118 SA614AD/01,118 NXP USA Inc. SA614A.pdf Description: IC FM IF SYSTEM LOW PWR 16-SOIC
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SA614AD/01,118 SA614AD/01,118 NXP USA Inc. SA614A.pdf Description: IC FM IF SYSTEM LOW PWR 16-SOIC
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
1+428.74 грн
10+371.18 грн
25+350.97 грн
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P87LPC779HDH,529 P87LPC779HDH,529 NXP USA Inc. Description: IC MCU 8BIT 8KB OTP 20TSSOP
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PDTA143EE,115 PDTA143EE,115 NXP USA Inc. PDTA143E_SER.pdf Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Resistors Included: R1 and R2
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PDTC114TE,115 PDTC114TE,115 NXP USA Inc. PDTC114T_SER.pdf Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 10 kOhms
Resistors Included: R1 Only
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PDTC114YE,115 PDTC114YE,115 NXP USA Inc. PHGLS24123-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
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PDTC143EE,115 PDTC143EE,115 NXP USA Inc. Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Resistors Included: R1 and R2
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PDTC143XE,115 PDTC143XE,115 NXP USA Inc. PDTC143X_SER.pdf Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 10 kOhms
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TDA8024TT/C1,118 TDA8024TT/C1,118 NXP USA Inc. TDA8024.pdf Description: IC INTERFACE SPECIALIZED 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 6.5V
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
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TDA8024T-T TDA8024T-T NXP USA Inc. TDA8024.pdf Description: IC INTERFACE SPECIALIZED 28SO
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TDA8024TT/C1,118 TDA8024TT/C1,118 NXP USA Inc. TDA8024.pdf Description: IC INTERFACE SPECIALIZED 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 6.5V
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
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TDA8024T-T TDA8024T-T NXP USA Inc. TDA8024.pdf Description: IC INTERFACE SPECIALIZED 28SO
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1320XRFC 1320XRFC NXP USA Inc. MC1320xRFCUG.pdf Description: DAUGHTER CARD FOR MC1320X+G12
Packaging: Bulk
For Use With/Related Products: MC1320x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
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1321XDSK 1321XDSK NXP USA Inc. 1321x%20Dev%20Kits.pdf description Description: KIT STARTER DEVELOPER 1321X
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1321XDSK-BDM 1321XDSK-BDM NXP USA Inc. 1321x%20Dev%20Kits.pdf Description: KIT STARTER DEV 1321X W/USB
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1321XNSK-BDM 1321XNSK-BDM NXP USA Inc. 1321x%20Dev%20Kits.pdf description Description: KIT STARTER NETWORK 1321X W/USB
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DEMO9S08AW60E DEMO9S08AW60E NXP USA Inc. DEMO9S08AW60E_UG.pdf Description: MC9S08AW60 EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08AW60
Part Status: Not For New Designs
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DEMO9S12XDT512 NXP USA Inc. DEMO9S12XDT512UG.pdf Description: MC9S12XDT512 EVAL BRD
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FSL-ZB-SNF NXP USA Inc. FSL-ZB-SNF.pdf Description: PROTOCOL ANALYZER KIT
Packaging: Bulk
Tool Type: Protocol Analyzer
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KIT3109MMA6270QE KIT3109MMA6270QE NXP USA Inc. AN3109.pdf Description: KIT EVAL FOR 1.5-6 XY-AXIS ACCEL
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KIT3109MMA7261QE NXP USA Inc. Description: KIT EVAL FOR 2.5 XYZ-AXIS ACCEL
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M5208EVB NXP USA Inc. Description: MCF5207/MCF5208 EVAL BRD
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M5211DEMO M5211DEMO NXP USA Inc. MCF5211.pdf Description: MCF5211 EVAL BRD
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M5213EVB NXP USA Inc. Description: MCF5213 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5213
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M5329EVB NXP USA Inc. Description: ZOOM MCF5329 EVAL BRD
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M5373EVB NXP USA Inc. MCF5373DS.pdf Description: MCF537X EVAL BRD
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MC13201FC MC13201FC NXP USA Inc. MC13201.pdf Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
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MC13201FCR2 MC13201FCR2 NXP USA Inc. MC13201.pdf Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
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MC13202FCR2 MC13202FCR2 NXP USA Inc. MC13202.pdf Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC13211 MC13211 NXP USA Inc. MC1321x.pdf Description: IC RF TXRX+MCU 802.15.4 71VFLGA
Packaging: Tray
Package / Case: 71-VFLGA Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 16kB Flash, 1kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 3dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 71-LGA (9x9)
GPIO: 32
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, SPI
Part Status: Obsolete
на замовлення 462 шт:
термін постачання 21-31 дні (днів)
1+628.65 грн
10+554.94 грн
25+504.50 грн
80+426.12 грн
260+390.61 грн
В кошику  од. на суму  грн.
MC13212 MC13212 NXP USA Inc. MC1321x.pdf Description: IC RF TXRX+MCU 802.15.4 71VFLGA
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MC908JL16CPE MC908JL16CPE NXP USA Inc. MC68HC908JL16.pdf Description: IC MCU 8BIT 16KB FLASH 28DIP
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MC908JL16CSPE MC908JL16CSPE NXP USA Inc. MC68HC908JL16.pdf Description: IC MCU 8BIT 16KB FLASH 32SDIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-SDIP
Part Status: Obsolete
Number of I/O: 26
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MC908QB8CDTE MC908QB8CDTE NXP USA Inc. MC68HC908QB8.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
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MC908QB8CDWE MC908QB8CDWE NXP USA Inc. MC68HC908QB8.pdf Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
на замовлення 132 шт:
термін постачання 21-31 дні (днів)
1+533.65 грн
10+396.00 грн
47+350.03 грн
В кошику  од. на суму  грн.
MC908QB8CPE MC908QB8CPE NXP USA Inc. MC68HC908QB8.pdf Description: IC MCU 8BIT 8KB FLASH 16DIP
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MC9S08AW16CFDE MC9S08AW16CFDE NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 16KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Verified
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MC9S08AW16CFGE MC9S08AW16CFGE NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 1722 шт:
термін постачання 21-31 дні (днів)
1+723.65 грн
10+542.29 грн
25+503.58 грн
80+438.09 грн
230+415.17 грн
800+395.56 грн
1600+380.94 грн
В кошику  од. на суму  грн.
MC9S08AW16CFUE MC9S08AW16CFUE NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 16KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 378 шт:
термін постачання 21-31 дні (днів)
1+879.79 грн
10+665.11 грн
80+550.68 грн
В кошику  од. на суму  грн.
MC9S08AW16CPUE MC9S08AW16CPUE NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 16KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 651 шт:
термін постачання 21-31 дні (днів)
1+744.31 грн
10+557.64 грн
25+517.99 грн
80+450.78 грн
230+427.29 грн
В кошику  од. на суму  грн.
MC9S08AW32CFDE MC9S08AW32CFDE NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 32KB FLASH 48QFN
на замовлення 440 шт:
термін постачання 21-31 дні (днів)
1+1233.35 грн
10+933.43 грн
80+772.80 грн
В кошику  од. на суму  грн.
P89V51RC2FA,512 P89V51RB2_RC2_RD2.pdf
P89V51RC2FA,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V51RC2FBC,557 P89V51RB2_RC2_RD2.pdf
P89V51RC2FBC,557
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V51RC2FN,112 P89V51RB2_RC2_RD2.pdf
P89V51RC2FN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-DIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V51RD2FN,112 P89V51RB2_RC2_RD2.pdf
P89V51RD2FN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-DIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V660FA,512 P89V660_662_664.pdf
P89V660FA,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 36
DigiKey Programmable: Not Verified
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P89V660FBC,557 P89V660_662_664.pdf
P89V660FBC,557
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
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P89V662FA,512 P89V660_662_664.pdf
P89V662FA,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 36
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
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P89V662FBC,557 P89V660_662_664.pdf
P89V662FBC,557
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
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P89V664FA,512 P89V660_662_664.pdf
P89V664FA,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 36
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P89V664FBC,557 P89V660_662_664.pdf
P89V664FBC,557
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 44TQFP
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TEA1522T/N2,518 TEA152X.pdf
TEA1522T/N2,518
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Active
Power (Watts): 30 W
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TEA1520P/N2,112 TEA152X.pdf
TEA1520P/N2,112
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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TEA1521P/N2,112 TEA152X.pdf
TEA1521P/N2,112
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Obsolete
Power (Watts): 30 W
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TEA1620P/N1,112 TEA1620P_1.pdf
TEA1620P/N1,112
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
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TEA1622P/N1,112 TEA1622P_1.pdf
TEA1622P/N1,112
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
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TEA1623P/N1,112 TEA1623P_TEA1623PH.pdf
TEA1623P/N1,112
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
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TEA1522P/N2,112 TEA152X.pdf
TEA1522P/N2,112
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Obsolete
Power (Watts): 30 W
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TEA1523P/N2,112 TEA152X.pdf
TEA1523P/N2,112
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Obsolete
Power (Watts): 30 W
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TEA1522T/N2,518 TEA152X.pdf
TEA1522T/N2,518
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Active
Power (Watts): 30 W
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SA614AD/01,118 SA614A.pdf
SA614AD/01,118
Виробник: NXP USA Inc.
Description: IC FM IF SYSTEM LOW PWR 16-SOIC
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SA614AD/01,118 SA614A.pdf
SA614AD/01,118
Виробник: NXP USA Inc.
Description: IC FM IF SYSTEM LOW PWR 16-SOIC
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+428.74 грн
10+371.18 грн
25+350.97 грн
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P87LPC779HDH,529
P87LPC779HDH,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 20TSSOP
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PDTA143EE,115 PDTA143E_SER.pdf
PDTA143EE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Resistors Included: R1 and R2
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PDTC114TE,115 PDTC114T_SER.pdf
PDTC114TE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 10 kOhms
Resistors Included: R1 Only
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PDTC114YE,115 PHGLS24123-1.pdf?t.download=true&u=5oefqw
PDTC114YE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
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PDTC143EE,115
PDTC143EE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Resistors Included: R1 and R2
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PDTC143XE,115 PDTC143X_SER.pdf
PDTC143XE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 10 kOhms
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TDA8024TT/C1,118 TDA8024.pdf
TDA8024TT/C1,118
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 6.5V
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
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TDA8024T-T TDA8024.pdf
TDA8024T-T
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SO
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TDA8024TT/C1,118 TDA8024.pdf
TDA8024TT/C1,118
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 6.5V
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
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TDA8024T-T TDA8024.pdf
TDA8024T-T
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SO
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1320XRFC MC1320xRFCUG.pdf
1320XRFC
Виробник: NXP USA Inc.
Description: DAUGHTER CARD FOR MC1320X+G12
Packaging: Bulk
For Use With/Related Products: MC1320x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
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1321XDSK description 1321x%20Dev%20Kits.pdf
1321XDSK
Виробник: NXP USA Inc.
Description: KIT STARTER DEVELOPER 1321X
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1321XDSK-BDM 1321x%20Dev%20Kits.pdf
1321XDSK-BDM
Виробник: NXP USA Inc.
Description: KIT STARTER DEV 1321X W/USB
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1321XNSK-BDM description 1321x%20Dev%20Kits.pdf
1321XNSK-BDM
Виробник: NXP USA Inc.
Description: KIT STARTER NETWORK 1321X W/USB
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DEMO9S08AW60E DEMO9S08AW60E_UG.pdf
DEMO9S08AW60E
Виробник: NXP USA Inc.
Description: MC9S08AW60 EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08AW60
Part Status: Not For New Designs
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DEMO9S12XDT512 DEMO9S12XDT512UG.pdf
Виробник: NXP USA Inc.
Description: MC9S12XDT512 EVAL BRD
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FSL-ZB-SNF FSL-ZB-SNF.pdf
Виробник: NXP USA Inc.
Description: PROTOCOL ANALYZER KIT
Packaging: Bulk
Tool Type: Protocol Analyzer
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KIT3109MMA6270QE AN3109.pdf
KIT3109MMA6270QE
Виробник: NXP USA Inc.
Description: KIT EVAL FOR 1.5-6 XY-AXIS ACCEL
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KIT3109MMA7261QE
Виробник: NXP USA Inc.
Description: KIT EVAL FOR 2.5 XYZ-AXIS ACCEL
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M5208EVB
Виробник: NXP USA Inc.
Description: MCF5207/MCF5208 EVAL BRD
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M5211DEMO MCF5211.pdf
M5211DEMO
Виробник: NXP USA Inc.
Description: MCF5211 EVAL BRD
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M5213EVB
Виробник: NXP USA Inc.
Description: MCF5213 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5213
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M5329EVB
Виробник: NXP USA Inc.
Description: ZOOM MCF5329 EVAL BRD
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M5373EVB MCF5373DS.pdf
Виробник: NXP USA Inc.
Description: MCF537X EVAL BRD
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MC13201FC MC13201.pdf
MC13201FC
Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
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MC13201FCR2 MC13201.pdf
MC13201FCR2
Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
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MC13202FCR2 MC13202.pdf
MC13202FCR2
Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC13211 MC1321x.pdf
MC13211
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 71VFLGA
Packaging: Tray
Package / Case: 71-VFLGA Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 16kB Flash, 1kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 3dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 71-LGA (9x9)
GPIO: 32
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, SPI
Part Status: Obsolete
на замовлення 462 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+628.65 грн
10+554.94 грн
25+504.50 грн
80+426.12 грн
260+390.61 грн
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MC13212 MC1321x.pdf
MC13212
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 71VFLGA
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MC908JL16CPE MC68HC908JL16.pdf
MC908JL16CPE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28DIP
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MC908JL16CSPE MC68HC908JL16.pdf
MC908JL16CSPE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32SDIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-SDIP
Part Status: Obsolete
Number of I/O: 26
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MC908QB8CDTE MC68HC908QB8.pdf
MC908QB8CDTE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
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MC908QB8CDWE MC68HC908QB8.pdf
MC908QB8CDWE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
на замовлення 132 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+533.65 грн
10+396.00 грн
47+350.03 грн
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MC908QB8CPE MC68HC908QB8.pdf
MC908QB8CPE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16DIP
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MC9S08AW16CFDE MC9S08AW60.pdf
MC9S08AW16CFDE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Verified
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MC9S08AW16CFGE MC9S08AW60.pdf
MC9S08AW16CFGE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 1722 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+723.65 грн
10+542.29 грн
25+503.58 грн
80+438.09 грн
230+415.17 грн
800+395.56 грн
1600+380.94 грн
В кошику  од. на суму  грн.
MC9S08AW16CFUE MC9S08AW60.pdf
MC9S08AW16CFUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 378 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+879.79 грн
10+665.11 грн
80+550.68 грн
В кошику  од. на суму  грн.
MC9S08AW16CPUE MC9S08AW60.pdf
MC9S08AW16CPUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 651 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+744.31 грн
10+557.64 грн
25+517.99 грн
80+450.78 грн
230+427.29 грн
В кошику  од. на суму  грн.
MC9S08AW32CFDE MC9S08AW60.pdf
MC9S08AW32CFDE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48QFN
на замовлення 440 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1233.35 грн
10+933.43 грн
80+772.80 грн
В кошику  од. на суму  грн.
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