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XPC823VR81B2T XPC823VR81B2T NXP USA Inc. MPC823TS.pdf Description: IC MPU MPC8XX 81MHZ 256BGA
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XPC8260CVVHFBC XPC8260CVVHFBC NXP USA Inc. MPC8260EC.pdf Description: IC MPU MPC82XX 166MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
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XPC8260CVVIHBC XPC8260CVVIHBC NXP USA Inc. MPC8260EC.pdf Description: IC MPU MPC82XX 200MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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XPC8260VVIHBC XPC8260VVIHBC NXP USA Inc. MPC8260EC.pdf Description: IC MPU MPC82XX 200MHZ 480TBGA
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XPC850CVR66BU XPC850CVR66BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
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XPC850DECVR50BU XPC850DECVR50BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
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XPC850DECVR66BU XPC850DECVR66BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
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XPC850DEVR66BU XPC850DEVR66BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
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XPC850DEVR66BUR2 XPC850DEVR66BUR2 NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
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XPC850SRCVR66BU XPC850SRCVR66BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
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XPC850SRVR66BU XPC850SRVR66BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
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XPC850SRVR80BU XPC850SRVR80BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 80MHZ 256BGA
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JN5121-000-M00T JN5121-000-M00T NXP USA Inc. JN5121%20Product%20Brief.pdf Description: RF TXRX MOD 802.15.4 TRACE ANT
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MC33879EK MC33879EK NXP USA Inc. MC33879.pdf Description: IC PWR SWITCH N-CHAN 1:4 32SOIC
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P89V51RB2FA,529 P89V51RB2FA,529 NXP USA Inc. P89V51RB2_RC2_RD2.pdf Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V51RC2FA,512 P89V51RC2FA,512 NXP USA Inc. P89V51RB2_RC2_RD2.pdf Description: IC MCU 8BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V51RC2FBC,557 P89V51RC2FBC,557 NXP USA Inc. P89V51RB2_RC2_RD2.pdf Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V51RC2FN,112 P89V51RC2FN,112 NXP USA Inc. P89V51RB2_RC2_RD2.pdf Description: IC MCU 8BIT 32KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-DIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V51RD2FN,112 P89V51RD2FN,112 NXP USA Inc. P89V51RB2_RC2_RD2.pdf Description: IC MCU 8BIT 64KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-DIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V660FA,512 P89V660FA,512 NXP USA Inc. P89V660_662_664.pdf Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 36
DigiKey Programmable: Not Verified
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P89V660FBC,557 P89V660FBC,557 NXP USA Inc. P89V660_662_664.pdf Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
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P89V662FA,512 P89V662FA,512 NXP USA Inc. P89V660_662_664.pdf Description: IC MCU 8BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 36
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
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P89V662FBC,557 P89V662FBC,557 NXP USA Inc. P89V660_662_664.pdf Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
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P89V664FA,512 P89V664FA,512 NXP USA Inc. P89V660_662_664.pdf Description: IC MCU 8BIT 64KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 36
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P89V664FBC,557 P89V664FBC,557 NXP USA Inc. P89V660_662_664.pdf Description: IC MCU 8BIT 64KB FLASH 44TQFP
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TEA1522T/N2,518 TEA1522T/N2,518 NXP USA Inc. TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Active
Power (Watts): 30 W
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TEA1520P/N2,112 TEA1520P/N2,112 NXP USA Inc. TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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TEA1521P/N2,112 TEA1521P/N2,112 NXP USA Inc. TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Obsolete
Power (Watts): 30 W
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TEA1620P/N1,112 TEA1620P/N1,112 NXP USA Inc. TEA1620P_1.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
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TEA1622P/N1,112 TEA1622P/N1,112 NXP USA Inc. TEA1622P_1.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
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TEA1623P/N1,112 TEA1623P/N1,112 NXP USA Inc. TEA1623P_TEA1623PH.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
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TEA1522P/N2,112 TEA1522P/N2,112 NXP USA Inc. TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Obsolete
Power (Watts): 30 W
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TEA1523P/N2,112 TEA1523P/N2,112 NXP USA Inc. TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Obsolete
Power (Watts): 30 W
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TEA1522T/N2,518 TEA1522T/N2,518 NXP USA Inc. TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Active
Power (Watts): 30 W
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SA614AD/01,118 SA614AD/01,118 NXP USA Inc. SA614A.pdf Description: IC FM IF SYSTEM LOW PWR 16-SOIC
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SA614AD/01,118 SA614AD/01,118 NXP USA Inc. SA614A.pdf Description: IC FM IF SYSTEM LOW PWR 16-SOIC
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
1+427.60 грн
10+370.19 грн
25+350.04 грн
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P87LPC779HDH,529 P87LPC779HDH,529 NXP USA Inc. Description: IC MCU 8BIT 8KB OTP 20TSSOP
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PDTA143EE,115 PDTA143EE,115 NXP USA Inc. PDTA143E_SER.pdf Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Resistors Included: R1 and R2
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PDTC114TE,115 PDTC114TE,115 NXP USA Inc. PDTC114T_SER.pdf Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 10 kOhms
Resistors Included: R1 Only
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PDTC114YE,115 PDTC114YE,115 NXP USA Inc. PHGLS24123-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
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PDTC143EE,115 PDTC143EE,115 NXP USA Inc. Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Resistors Included: R1 and R2
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PDTC143XE,115 PDTC143XE,115 NXP USA Inc. PDTC143X_SER.pdf Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 10 kOhms
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TDA8024TT/C1,118 TDA8024TT/C1,118 NXP USA Inc. TDA8024.pdf Description: IC INTERFACE SPECIALIZED 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 6.5V
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
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TDA8024T-T TDA8024T-T NXP USA Inc. TDA8024.pdf Description: IC INTERFACE SPECIALIZED 28SO
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TDA8024TT/C1,118 TDA8024TT/C1,118 NXP USA Inc. TDA8024.pdf Description: IC INTERFACE SPECIALIZED 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 6.5V
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
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TDA8024T-T TDA8024T-T NXP USA Inc. TDA8024.pdf Description: IC INTERFACE SPECIALIZED 28SO
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1320XRFC 1320XRFC NXP USA Inc. MC1320xRFCUG.pdf Description: DAUGHTER CARD FOR MC1320X+G12
Packaging: Bulk
For Use With/Related Products: MC1320x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
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1321XDSK 1321XDSK NXP USA Inc. 1321x%20Dev%20Kits.pdf description Description: KIT STARTER DEVELOPER 1321X
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1321XDSK-BDM 1321XDSK-BDM NXP USA Inc. 1321x%20Dev%20Kits.pdf Description: KIT STARTER DEV 1321X W/USB
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1321XNSK-BDM 1321XNSK-BDM NXP USA Inc. 1321x%20Dev%20Kits.pdf description Description: KIT STARTER NETWORK 1321X W/USB
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DEMO9S08AW60E DEMO9S08AW60E NXP USA Inc. DEMO9S08AW60E_UG.pdf Description: MC9S08AW60 EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08AW60
Part Status: Not For New Designs
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DEMO9S12XDT512 NXP USA Inc. DEMO9S12XDT512UG.pdf Description: MC9S12XDT512 EVAL BRD
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FSL-ZB-SNF NXP USA Inc. FSL-ZB-SNF.pdf Description: PROTOCOL ANALYZER KIT
Packaging: Bulk
Tool Type: Protocol Analyzer
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KIT3109MMA6270QE KIT3109MMA6270QE NXP USA Inc. AN3109.pdf Description: KIT EVAL FOR 1.5-6 XY-AXIS ACCEL
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KIT3109MMA7261QE NXP USA Inc. Description: KIT EVAL FOR 2.5 XYZ-AXIS ACCEL
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M5208EVB NXP USA Inc. Description: MCF5207/MCF5208 EVAL BRD
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M5211DEMO M5211DEMO NXP USA Inc. MCF5211.pdf Description: MCF5211 EVAL BRD
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M5213EVB NXP USA Inc. Description: MCF5213 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5213
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M5329EVB NXP USA Inc. Description: ZOOM MCF5329 EVAL BRD
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M5373EVB NXP USA Inc. MCF5373DS.pdf Description: MCF537X EVAL BRD
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XPC823VR81B2T MPC823TS.pdf
XPC823VR81B2T
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 81MHZ 256BGA
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XPC8260CVVHFBC MPC8260EC.pdf
XPC8260CVVHFBC
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 166MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
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XPC8260CVVIHBC MPC8260EC.pdf
XPC8260CVVIHBC
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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XPC8260VVIHBC MPC8260EC.pdf
XPC8260VVIHBC
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ 480TBGA
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XPC850CVR66BU MPC850%20PowerQUICC.pdf
XPC850CVR66BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
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XPC850DECVR50BU MPC850%20PowerQUICC.pdf
XPC850DECVR50BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
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XPC850DECVR66BU MPC850%20PowerQUICC.pdf
XPC850DECVR66BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
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XPC850DEVR66BU MPC850%20PowerQUICC.pdf
XPC850DEVR66BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
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XPC850DEVR66BUR2 MPC850%20PowerQUICC.pdf
XPC850DEVR66BUR2
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
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XPC850SRCVR66BU MPC850%20PowerQUICC.pdf
XPC850SRCVR66BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
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XPC850SRVR66BU MPC850%20PowerQUICC.pdf
XPC850SRVR66BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
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XPC850SRVR80BU MPC850%20PowerQUICC.pdf
XPC850SRVR80BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
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JN5121-000-M00T JN5121%20Product%20Brief.pdf
JN5121-000-M00T
Виробник: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TRACE ANT
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MC33879EK MC33879.pdf
MC33879EK
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:4 32SOIC
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P89V51RB2FA,529 P89V51RB2_RC2_RD2.pdf
P89V51RB2FA,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V51RC2FA,512 P89V51RB2_RC2_RD2.pdf
P89V51RC2FA,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V51RC2FBC,557 P89V51RB2_RC2_RD2.pdf
P89V51RC2FBC,557
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V51RC2FN,112 P89V51RB2_RC2_RD2.pdf
P89V51RC2FN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-DIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V51RD2FN,112 P89V51RB2_RC2_RD2.pdf
P89V51RD2FN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-DIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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P89V660FA,512 P89V660_662_664.pdf
P89V660FA,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 36
DigiKey Programmable: Not Verified
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P89V660FBC,557 P89V660_662_664.pdf
P89V660FBC,557
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
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P89V662FA,512 P89V660_662_664.pdf
P89V662FA,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 36
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
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P89V662FBC,557 P89V660_662_664.pdf
P89V662FBC,557
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
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P89V664FA,512 P89V660_662_664.pdf
P89V664FA,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 36
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P89V664FBC,557 P89V660_662_664.pdf
P89V664FBC,557
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 44TQFP
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TEA1522T/N2,518 TEA152X.pdf
TEA1522T/N2,518
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Active
Power (Watts): 30 W
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TEA1520P/N2,112 TEA152X.pdf
TEA1520P/N2,112
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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TEA1521P/N2,112 TEA152X.pdf
TEA1521P/N2,112
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Obsolete
Power (Watts): 30 W
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TEA1620P/N1,112 TEA1620P_1.pdf
TEA1620P/N1,112
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
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TEA1622P/N1,112 TEA1622P_1.pdf
TEA1622P/N1,112
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
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TEA1623P/N1,112 TEA1623P_TEA1623PH.pdf
TEA1623P/N1,112
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
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TEA1522P/N2,112 TEA152X.pdf
TEA1522P/N2,112
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Obsolete
Power (Watts): 30 W
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TEA1523P/N2,112 TEA152X.pdf
TEA1523P/N2,112
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Obsolete
Power (Watts): 30 W
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TEA1522T/N2,518 TEA152X.pdf
TEA1522T/N2,518
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Active
Power (Watts): 30 W
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SA614AD/01,118 SA614A.pdf
SA614AD/01,118
Виробник: NXP USA Inc.
Description: IC FM IF SYSTEM LOW PWR 16-SOIC
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SA614AD/01,118 SA614A.pdf
SA614AD/01,118
Виробник: NXP USA Inc.
Description: IC FM IF SYSTEM LOW PWR 16-SOIC
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+427.60 грн
10+370.19 грн
25+350.04 грн
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P87LPC779HDH,529
P87LPC779HDH,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 20TSSOP
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PDTA143EE,115 PDTA143E_SER.pdf
PDTA143EE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Resistors Included: R1 and R2
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PDTC114TE,115 PDTC114T_SER.pdf
PDTC114TE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 10 kOhms
Resistors Included: R1 Only
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PDTC114YE,115 PHGLS24123-1.pdf?t.download=true&u=5oefqw
PDTC114YE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
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PDTC143EE,115
PDTC143EE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Resistors Included: R1 and R2
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PDTC143XE,115 PDTC143X_SER.pdf
PDTC143XE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 10 kOhms
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TDA8024TT/C1,118 TDA8024.pdf
TDA8024TT/C1,118
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 6.5V
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
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TDA8024T-T TDA8024.pdf
TDA8024T-T
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SO
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TDA8024TT/C1,118 TDA8024.pdf
TDA8024TT/C1,118
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 6.5V
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
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TDA8024T-T TDA8024.pdf
TDA8024T-T
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SO
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1320XRFC MC1320xRFCUG.pdf
1320XRFC
Виробник: NXP USA Inc.
Description: DAUGHTER CARD FOR MC1320X+G12
Packaging: Bulk
For Use With/Related Products: MC1320x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
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1321XDSK description 1321x%20Dev%20Kits.pdf
1321XDSK
Виробник: NXP USA Inc.
Description: KIT STARTER DEVELOPER 1321X
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1321XDSK-BDM 1321x%20Dev%20Kits.pdf
1321XDSK-BDM
Виробник: NXP USA Inc.
Description: KIT STARTER DEV 1321X W/USB
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1321XNSK-BDM description 1321x%20Dev%20Kits.pdf
1321XNSK-BDM
Виробник: NXP USA Inc.
Description: KIT STARTER NETWORK 1321X W/USB
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DEMO9S08AW60E DEMO9S08AW60E_UG.pdf
DEMO9S08AW60E
Виробник: NXP USA Inc.
Description: MC9S08AW60 EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08AW60
Part Status: Not For New Designs
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DEMO9S12XDT512 DEMO9S12XDT512UG.pdf
Виробник: NXP USA Inc.
Description: MC9S12XDT512 EVAL BRD
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FSL-ZB-SNF FSL-ZB-SNF.pdf
Виробник: NXP USA Inc.
Description: PROTOCOL ANALYZER KIT
Packaging: Bulk
Tool Type: Protocol Analyzer
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KIT3109MMA6270QE AN3109.pdf
KIT3109MMA6270QE
Виробник: NXP USA Inc.
Description: KIT EVAL FOR 1.5-6 XY-AXIS ACCEL
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KIT3109MMA7261QE
Виробник: NXP USA Inc.
Description: KIT EVAL FOR 2.5 XYZ-AXIS ACCEL
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M5208EVB
Виробник: NXP USA Inc.
Description: MCF5207/MCF5208 EVAL BRD
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M5211DEMO MCF5211.pdf
M5211DEMO
Виробник: NXP USA Inc.
Description: MCF5211 EVAL BRD
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M5213EVB
Виробник: NXP USA Inc.
Description: MCF5213 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5213
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M5329EVB
Виробник: NXP USA Inc.
Description: ZOOM MCF5329 EVAL BRD
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M5373EVB MCF5373DS.pdf
Виробник: NXP USA Inc.
Description: MCF537X EVAL BRD
товару немає в наявності
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