Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36369) > Сторінка 4 з 607
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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MC68HC908QY1CDT | NXP USA Inc. |
 Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP |
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MC68HC908QY2CDW | NXP USA Inc. |
 Description: IC MCU 8BIT 1.5KB FLASH 16SOIC |
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MC68HC908QY2CDT | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP |
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MC68HC908QY4CP | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16DIP DigiKey Programmable: Not Verified Number of I/O: 13 Supplier Device Package: 16-PDIP Peripherals: LVD, POR, PWM Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x8b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 128 x 8 Program Memory Size: 4KB (4K x 8) Speed: 8MHz Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Packaging: Tube |
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MC68HC908QY4CDW | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16SOIC DigiKey Programmable: Not Verified Number of I/O: 13 Supplier Device Package: 16-SOIC Peripherals: LVD, POR, PWM Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x8b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 128 x 8 Program Memory Size: 4KB (4K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tube |
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MC68HC908QY4CDT | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOP Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 128 x 8 Program Memory Size: 4KB (4K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Packaging: Tube DigiKey Programmable: Not Verified Number of I/O: 13 Supplier Device Package: 16-TSSOP Peripherals: LVD, POR, PWM Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x8b |
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| M68DEMO908QT4 | NXP USA Inc. |
Description: MC68HC908QT4 EVAL BRD |
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DSP56301PW80 | NXP USA Inc. |
Description: IC DSP 24BIT 80MHZ 208-LQFP |
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| M5307C3 | NXP USA Inc. | Description: MCF5307 EVAL BRD |
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MBC13916T1 | NXP USA Inc. |
Description: IC AMP 100MHZ-2.5GHZ SOT343R Part Status: Obsolete Supplier Device Package: SOT-343R Test Frequency: 900MHz P1dB: 2.5dBm Current - Supply: 4.7mA Gain: 19dB Voltage - Supply: 2.7V ~ 5V Frequency: 100MHz ~ 2.5GHz Mounting Type: Surface Mount Package / Case: SC-82A, SOT-343 Packaging: Tape & Reel (TR) |
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MC33199DR2 | NXP USA Inc. |
Description: IC TRANSCEIVER 1/0 14SOIC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Driver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/0 Protocol: ISO 9141 Supplier Device Package: 14-SOIC Part Status: Obsolete |
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MC68332ACPV16 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP RAM Size: 2K x 8 Speed: 16MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 144-LQFP (20x20) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) |
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MC68332ACPV20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 144-LQFP (20x20) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Single-Core Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
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MC68332GCPV20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 144-LQFP (20x20) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Single-Core Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
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MC68336ACFT20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 7.5K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 160-QFP (28x28) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Core Size: 32-Bit Single-Core Data Converters: A/D 16x10b Core Processor: CPU32 |
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MC68336GCFT20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP RAM Size: 7.5K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 160-QFP (28x28) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Core Size: 32-Bit Single-Core Data Converters: A/D 16x10b Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) |
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MC68376BACFT20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 7.5K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 160-QFP (28x28) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Core Size: 32-Bit Data Converters: A/D 16x10b Core Processor: CPU32 |
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MC68376BGCFT20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 160-QFP (28x28) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Core Size: 32-Bit Data Converters: A/D 16x10b Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 7.5K x 8 Speed: 20MHz Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray |
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MC68HC705JJ7CDW | NXP USA Inc. |
Description: IC MCU 8BIT 6KB OTP 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 6KB (6K x 8) RAM Size: 224 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Data Converters: A/D 4x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SIO Peripherals: POR, Temp Sensor, WDT Supplier Device Package: 20-SOIC Number of I/O: 14 DigiKey Programmable: Not Verified |
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MC68HC705JP7CDW | NXP USA Inc. |
Description: IC MCU 8BIT 6KB OTP 28SOIC Packaging: Tube Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 6KB (6K x 8) RAM Size: 224 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Data Converters: A/D 4x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SIO Peripherals: POR, Temp Sensor, WDT Supplier Device Package: 28-SOIC Number of I/O: 22 DigiKey Programmable: Not Verified |
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MC68HC908GR8CFA | NXP USA Inc. |
Description: IC MCU 8BIT 7.5KB FLASH 32LQFP |
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MC68HC908JB8JP | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20DIP DigiKey Programmable: Not Verified Number of I/O: 13 Supplier Device Package: 20-DIP Peripherals: LVD, POR, PWM Connectivity: USB Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V Core Size: 8-Bit Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) RAM Size: 256 x 8 Program Memory Size: 8KB (8K x 8) Speed: 3MHz Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Packaging: Tube |
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MC68LK332ACPV16 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 144-LQFP (20x20) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Speed: 16.78MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
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MC68LK332GCPV16 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 144-LQFP (20x20) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Speed: 16.78MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
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MC908AZ60AMFU | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 52 Part Status: Obsolete Supplier Device Package: 64-QFP (14x14) Peripherals: LVD, POR, PWM Connectivity: CANbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 15x8b Core Processor: HC08 EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Program Memory Size: 60KB (60K x 8) Speed: 8.4MHz Mounting Type: Surface Mount Package / Case: 64-QFP |
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MCF5307FT66B | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 208FQFP Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I2C, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Core Processor: Coldfire V3 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) RAM Size: 4K x 8 Speed: 66MHz Mounting Type: Surface Mount Package / Case: 208-BFQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 16 Supplier Device Package: 208-FQFP (28x28) |
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MCF5307FT90B | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 208FQFP DigiKey Programmable: Not Verified Number of I/O: 16 Supplier Device Package: 208-FQFP (28x28) Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I2C, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Core Processor: Coldfire V3 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) RAM Size: 4K x 8 Speed: 90MHz Mounting Type: Surface Mount Package / Case: 208-BFQFP Packaging: Tray |
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MMC2107CFCPU33 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP |
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| MMCEVB2107 | NXP USA Inc. |
Description: MMC2107 EVAL BRD |
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| MPC555CME | NXP USA Inc. |
Description: MPC555 EVAL BRD |
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MPC561CZP40 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA DigiKey Programmable: Not Verified Number of I/O: 64 Part Status: Not For New Designs Supplier Device Package: 388-PBGA (27x27) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Core Size: 32-Bit Data Converters: A/D 32x10b Core Processor: PowerPC Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Speed: 40MHz Mounting Type: Surface Mount Package / Case: 388-BBGA Packaging: Tray |
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MPC563CZP40 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA DigiKey Programmable: Not Verified Number of I/O: 56 Supplier Device Package: 388-PBGA (27x27) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Core Size: 32-Bit Single-Core Data Converters: A/D 32x10b Core Processor: PowerPC Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 388-BBGA Packaging: Tray |
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MPC564CZP40 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA DigiKey Programmable: Not Verified Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 388-BBGA Packaging: Tray Number of I/O: 56 Supplier Device Package: 388-PBGA (27x27) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Core Size: 32-Bit Single-Core Data Converters: A/D 32x10b Core Processor: PowerPC Program Memory Type: FLASH Oscillator Type: External |
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MPC942CFA | NXP USA Inc. |
Description: IC DRVR CLK PLL 2.5/3.3V 32-TQFP DigiKey Programmable: Not Verified Number of Circuits: 1 PLL: No Supplier Device Package: 32-TQFP (7x7) Differential - Input:Output: No/No Ratio - Input:Output: 1:18 Main Purpose: Intel CPU Servers Voltage - Supply: 2.375V ~ 3.465V Operating Temperature: 0°C ~ 70°C Input: LVCMOS, LVTTL Frequency - Max: 250MHz Output: LVCMOS Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
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MC68HC705B16NCFN | NXP USA Inc. |
Description: IC MCU 8BIT 15KB OTP 52PLCC Data Converters: A/D 8x8b Core Processor: HC05 EEPROM Size: 256 x 8 Program Memory Type: OTP Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 352 x 8 Program Memory Size: 15KB (15K x 8) Speed: 2.1MHz Mounting Type: Surface Mount Package / Case: 52-LCC (J-Lead) Packaging: Tube DigiKey Programmable: Not Verified Number of I/O: 32 Supplier Device Package: 52-PLCC (19.1x19.1) Peripherals: POR, WDT Connectivity: SCI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit |
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| M68MULTILINK08 | NXP USA Inc. |
Description: PROGRAMMER FOR 68HC908 Packaging: Bulk For Use With/Related Products: 68HC908 FLASH MCUs Type: Debugger, Programmer (In-Circuit/In-System) Contents: Board(s), Cable(s) Utilized IC / Part: 68HC908 FLASH MCUs |
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MMA1260D | NXP USA Inc. |
Description: ACCELEROMETER 1.5G ANALOG 16SOIC Sensitivity (mV/g): 1200 Supplier Device Package: 16-SOIC Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tube Acceleration Range: ±1.5g Axis: Z Type: Analog Mounting Type: Surface Mount Output Type: Analog Voltage Bandwidth: 50Hz Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 105°C |
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MPX2202AP | NXP USA Inc. |
Description: SENSOR 29.01PSIA 0.19" .04V Part Status: Obsolete Maximum Pressure: 58.02PSI (400kPa) Port Style: Barbed Applications: Board Mount Port Size: Male - 0.19" (4.93mm) Tube Voltage - Supply: 10V ~ 16V Termination Style: PC Pin Operating Temperature: -40°C ~ 125°C Pressure Type: Absolute Operating Pressure: 29.01PSI (200kPa) Output: 0 mV ~ 40 mV (10V) Mounting Type: Through Hole Output Type: Wheatstone Bridge Package / Case: 4-SIP Module Features: Temperature Compensated Packaging: Tray |
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MPXV5010DP | NXP USA Inc. |
Description: SENSOR 1.45PSID 0.13" 4.7V 8SOP Packaging: Tray Features: Temperature Compensated Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.2 V ~ 4.7 V Operating Pressure: 1.45PSI (10kPa) Pressure Type: Differential Accuracy: ±5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 4.75V ~ 5.25V Port Size: Male - 0.13" (3.3mm) Tube, Dual Applications: Board Mount Supplier Device Package: 8-SOP Port Style: Barbed Maximum Pressure: 5.8PSI (40kPa) Part Status: Active |
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MC68332ACPV25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Speed: 25MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 144-LQFP (20x20) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 32-Bit Single-Core Core Processor: CPU32 |
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DSP56301PW100 | NXP USA Inc. |
Description: IC DSP 24BIT FIXED-POINT 208LQFP |
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DSP56301VF100 | NXP USA Inc. |
Description: IC DSP 24BIT FIXED-POINT 252-BGA |
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| DSP56303EVM | NXP USA Inc. |
Description: DSP56303 EVAL BRD |
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DSP56309EVM | NXP USA Inc. |
Description: DSP56309 EVAL BRD |
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| DSP56311EVM | NXP USA Inc. | Description: DSP56311 EVAL BRD |
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MC100ES6111FA | NXP USA Inc. |
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP Packaging: Tray Package / Case: 32-LQFP Number of Circuits: 1 Mounting Type: Surface Mount Output: ECL, PECL Type: Fanout Buffer (Distribution), Multiplexer Input: ECL, HSTL, PECL Operating Temperature: -40°C ~ 110°C Voltage - Supply: 2.375V ~ 3.465V Ratio - Input:Output: 2:10 Differential - Input:Output: Yes/Yes Supplier Device Package: 32-LQFP (7x7) Frequency - Max: 2.7 GHz |
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| MC100ES6222TB | NXP USA Inc. |
Description: IC CLK BUFFER 2:15 3GHZ 52LQFP Packaging: Tray Package / Case: 52-LQFP Exposed Pad Number of Circuits: 1 Mounting Type: Surface Mount Output: ECL, PECL Type: Fanout Buffer (Distribution), Divider, Multiplexer Input: ECL, PECL Operating Temperature: -40°C ~ 110°C Voltage - Supply: 2.375V ~ 3.465V Ratio - Input:Output: 2:15 Differential - Input:Output: Yes/Yes Supplier Device Package: 52-LQFP (10x10) Frequency - Max: 3 GHz |
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.jpg "MC145481DT") |
MC145481DT | NXP USA Inc. |
Description: IC PCM CODEC-FILTER 3V 20-TSSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Type: PCM, Filter Data Interface: PCM Audio Interface Operating Temperature: -40°C ~ 85°C Voltage - Supply, Digital: 2.7V ~ 5.25V Resolution (Bits): 6 b Number of ADCs / DACs: 1 / 1 Sigma Delta: No Supplier Device Package: 20-TSSOP Part Status: Obsolete |
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MC145483DT | NXP USA Inc. |
Description: IC PCM COD-FILT 3V 13BIT 20TSSOP |
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%20Renders/32-VQFN%20Exposed%20Pad.jpg "MC145483FC") |
MC145483FC | NXP USA Inc. |
Description: IC PCM CODFIL 3V 13BIT LIN 32QFN |
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.jpg "MC145484DT") |
MC145484DT | NXP USA Inc. |
Description: IC PCM CODEC-FILTER 5V 20-TSSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Type: PCM, Filter Data Interface: PCM Audio Interface Operating Temperature: -40°C ~ 85°C Voltage - Supply, Digital: 4.5V ~ 5.5V Resolution (Bits): 13 b Number of ADCs / DACs: 1 / 1 Sigma Delta: No Supplier Device Package: 20-TSSOP |
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MC14LC5480DT | NXP USA Inc. |
Description: IC PCM CODEC-FILTER 5V 20-TSSOP Number of ADCs / DACs: 1 / 1 Resolution (Bits): 13 b Voltage - Supply, Digital: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 85°C Data Interface: PCM Audio Interface Type: PCM, Filter Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Tube Part Status: Obsolete Supplier Device Package: 20-TSSOP Sigma Delta: No |
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MC68302PV33C | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 144LQFP Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 8/16-Bit Supplier Device Package: 144-LQFP (20x20) Voltage - I/O: 5.0V Core Processor: M68000 Operating Temperature: 0°C ~ 70°C (TA) Speed: 33MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
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MC68360CEM25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP Additional Interfaces: SCC, SMC, SPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 240-FQFP (32x32) Voltage - I/O: 5.0V Core Processor: CPU32+ Operating Temperature: -40°C ~ 85°C (TA) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 240-BFQFP Packaging: Tray |
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MC68360EM33L | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 240FQFP Package / Case: 240-BFQFP Packaging: Tray Additional Interfaces: SCC, SMC, SPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 240-FQFP (32x32) Voltage - I/O: 5.0V Core Processor: CPU32+ Operating Temperature: 0°C ~ 70°C (TA) Speed: 33MHz Mounting Type: Surface Mount |
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 |
MC68360ZP25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Additional Interfaces: SCC, SMC, SPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 5.0V Core Processor: CPU32+ Operating Temperature: 0°C ~ 70°C (TA) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 357-BGA Packaging: Tray |
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MC68360ZP25VL | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 3.3V Core Processor: CPU32+ Operating Temperature: 0°C ~ 70°C (TA) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 357-BGA Packaging: Tray Additional Interfaces: SCC, SMC, SPI |
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MC68EN360CEM25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP |
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MC68LC302CPU20CT | NXP USA Inc. |
Description: IC MPU M683XX 20MHZ 100LQFP |
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MC68MH360EM25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 240-FQFP (32x32) Voltage - I/O: 5.0V Core Processor: CPU32+ Operating Temperature: 0°C ~ 70°C (TA) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 240-BFQFP Packaging: Tray |
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| MC68HC908QY1CDT |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
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| MC68HC908QY2CDW | |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
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| MC68HC908QY2CDT |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
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| MC68HC908QY4CP | |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16DIP
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-PDIP
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Packaging: Tube
Description: IC MCU 8BIT 4KB FLASH 16DIP
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-PDIP
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Packaging: Tube
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| MC68HC908QY4CDW |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Description: IC MCU 8BIT 4KB FLASH 16SOIC
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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| MC68HC908QY4CDT |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
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| M68DEMO908QT4 |
|
Виробник: NXP USA Inc.
Description: MC68HC908QT4 EVAL BRD
Description: MC68HC908QT4 EVAL BRD
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| DSP56301PW80 |
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Виробник: NXP USA Inc.
Description: IC DSP 24BIT 80MHZ 208-LQFP
Description: IC DSP 24BIT 80MHZ 208-LQFP
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| M5307C3 |
Виробник: NXP USA Inc.
Description: MCF5307 EVAL BRD
Description: MCF5307 EVAL BRD
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| MBC13916T1 |
|
Виробник: NXP USA Inc.
Description: IC AMP 100MHZ-2.5GHZ SOT343R
Part Status: Obsolete
Supplier Device Package: SOT-343R
Test Frequency: 900MHz
P1dB: 2.5dBm
Current - Supply: 4.7mA
Gain: 19dB
Voltage - Supply: 2.7V ~ 5V
Frequency: 100MHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: SC-82A, SOT-343
Packaging: Tape & Reel (TR)
Description: IC AMP 100MHZ-2.5GHZ SOT343R
Part Status: Obsolete
Supplier Device Package: SOT-343R
Test Frequency: 900MHz
P1dB: 2.5dBm
Current - Supply: 4.7mA
Gain: 19dB
Voltage - Supply: 2.7V ~ 5V
Frequency: 100MHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: SC-82A, SOT-343
Packaging: Tape & Reel (TR)
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| MC33199DR2 |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 1/0 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Driver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/0
Protocol: ISO 9141
Supplier Device Package: 14-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 1/0 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Driver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/0
Protocol: ISO 9141
Supplier Device Package: 14-SOIC
Part Status: Obsolete
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| MC68332ACPV16 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
RAM Size: 2K x 8
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Description: IC MCU 32BIT ROMLESS 144LQFP
RAM Size: 2K x 8
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
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| MC68332ACPV20 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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| MC68332GCPV20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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| MC68336ACFT20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: CPU32
Description: IC MCU 32BIT ROMLESS 160QFP
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: CPU32
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| MC68336GCFT20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Description: IC MCU 32BIT ROMLESS 160QFP
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
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| MC68376BACFT20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
Description: IC MCU 32BIT ROMLESS 160QFP
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
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| MC68376BGCFT20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 7.5K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
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| MC68HC705JJ7CDW |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 6KB OTP 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 6KB OTP 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
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| MC68HC705JP7CDW |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 6KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 6KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 22
DigiKey Programmable: Not Verified
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| MC68HC908GR8CFA |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 7.5KB FLASH 32LQFP
Description: IC MCU 8BIT 7.5KB FLASH 32LQFP
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| MC68HC908JB8JP | |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20DIP
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 20-DIP
Peripherals: LVD, POR, PWM
Connectivity: USB
Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 3MHz
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Tube
Description: IC MCU 8BIT 8KB FLASH 20DIP
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 20-DIP
Peripherals: LVD, POR, PWM
Connectivity: USB
Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 3MHz
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Tube
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| MC68LK332ACPV16 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 16.78MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 16.78MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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| MC68LK332GCPV16 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 16.78MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 16.78MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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| MC908AZ60AMFU |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x8b
Core Processor: HC08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8.4MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x8b
Core Processor: HC08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8.4MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
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| MCF5307FT66B |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208FQFP
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V3
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 4K x 8
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 16
Supplier Device Package: 208-FQFP (28x28)
Description: IC MCU 32BIT ROMLESS 208FQFP
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V3
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 4K x 8
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 16
Supplier Device Package: 208-FQFP (28x28)
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| MCF5307FT90B |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208FQFP
DigiKey Programmable: Not Verified
Number of I/O: 16
Supplier Device Package: 208-FQFP (28x28)
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Core Processor: Coldfire V3
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 4K x 8
Speed: 90MHz
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 208FQFP
DigiKey Programmable: Not Verified
Number of I/O: 16
Supplier Device Package: 208-FQFP (28x28)
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Core Processor: Coldfire V3
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 4K x 8
Speed: 90MHz
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
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| MMC2107CFCPU33 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Description: IC MCU 32BIT 128KB FLASH 100LQFP
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| MMCEVB2107 |
|
Виробник: NXP USA Inc.
Description: MMC2107 EVAL BRD
Description: MMC2107 EVAL BRD
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| MPC555CME |
|
Виробник: NXP USA Inc.
Description: MPC555 EVAL BRD
Description: MPC555 EVAL BRD
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| MPC561CZP40 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Not For New Designs
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 388PBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Not For New Designs
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
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| MPC563CZP40 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
Description: IC MCU 32BIT 512KB FLASH 388PBGA
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
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| MPC564CZP40 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
Number of I/O: 56
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Description: IC MCU 32BIT 512KB FLASH 388PBGA
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
Number of I/O: 56
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
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| MPC942CFA |
|
Виробник: NXP USA Inc.
Description: IC DRVR CLK PLL 2.5/3.3V 32-TQFP
DigiKey Programmable: Not Verified
Number of Circuits: 1
PLL: No
Supplier Device Package: 32-TQFP (7x7)
Differential - Input:Output: No/No
Ratio - Input:Output: 1:18
Main Purpose: Intel CPU Servers
Voltage - Supply: 2.375V ~ 3.465V
Operating Temperature: 0°C ~ 70°C
Input: LVCMOS, LVTTL
Frequency - Max: 250MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC DRVR CLK PLL 2.5/3.3V 32-TQFP
DigiKey Programmable: Not Verified
Number of Circuits: 1
PLL: No
Supplier Device Package: 32-TQFP (7x7)
Differential - Input:Output: No/No
Ratio - Input:Output: 1:18
Main Purpose: Intel CPU Servers
Voltage - Supply: 2.375V ~ 3.465V
Operating Temperature: 0°C ~ 70°C
Input: LVCMOS, LVTTL
Frequency - Max: 250MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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| MC68HC705B16NCFN |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 15KB OTP 52PLCC
Data Converters: A/D 8x8b
Core Processor: HC05
EEPROM Size: 256 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 352 x 8
Program Memory Size: 15KB (15K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Description: IC MCU 8BIT 15KB OTP 52PLCC
Data Converters: A/D 8x8b
Core Processor: HC05
EEPROM Size: 256 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 352 x 8
Program Memory Size: 15KB (15K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
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| M68MULTILINK08 |
|
Виробник: NXP USA Inc.
Description: PROGRAMMER FOR 68HC908
Packaging: Bulk
For Use With/Related Products: 68HC908 FLASH MCUs
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Utilized IC / Part: 68HC908 FLASH MCUs
Description: PROGRAMMER FOR 68HC908
Packaging: Bulk
For Use With/Related Products: 68HC908 FLASH MCUs
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Utilized IC / Part: 68HC908 FLASH MCUs
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| MMA1260D |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 1.5G ANALOG 16SOIC
Sensitivity (mV/g): 1200
Supplier Device Package: 16-SOIC
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Acceleration Range: ±1.5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Description: ACCELEROMETER 1.5G ANALOG 16SOIC
Sensitivity (mV/g): 1200
Supplier Device Package: 16-SOIC
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Acceleration Range: ±1.5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
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| MPX2202AP | |
|
Виробник: NXP USA Inc.
Description: SENSOR 29.01PSIA 0.19" .04V
Part Status: Obsolete
Maximum Pressure: 58.02PSI (400kPa)
Port Style: Barbed
Applications: Board Mount
Port Size: Male - 0.19" (4.93mm) Tube
Voltage - Supply: 10V ~ 16V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 125°C
Pressure Type: Absolute
Operating Pressure: 29.01PSI (200kPa)
Output: 0 mV ~ 40 mV (10V)
Mounting Type: Through Hole
Output Type: Wheatstone Bridge
Package / Case: 4-SIP Module
Features: Temperature Compensated
Packaging: Tray
Description: SENSOR 29.01PSIA 0.19" .04V
Part Status: Obsolete
Maximum Pressure: 58.02PSI (400kPa)
Port Style: Barbed
Applications: Board Mount
Port Size: Male - 0.19" (4.93mm) Tube
Voltage - Supply: 10V ~ 16V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 125°C
Pressure Type: Absolute
Operating Pressure: 29.01PSI (200kPa)
Output: 0 mV ~ 40 mV (10V)
Mounting Type: Through Hole
Output Type: Wheatstone Bridge
Package / Case: 4-SIP Module
Features: Temperature Compensated
Packaging: Tray
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| MPXV5010DP |
|
Виробник: NXP USA Inc.
Description: SENSOR 1.45PSID 0.13" 4.7V 8SOP
Packaging: Tray
Features: Temperature Compensated
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Accuracy: ±5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 5.8PSI (40kPa)
Part Status: Active
Description: SENSOR 1.45PSID 0.13" 4.7V 8SOP
Packaging: Tray
Features: Temperature Compensated
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Accuracy: ±5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 5.8PSI (40kPa)
Part Status: Active
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| MC68332ACPV25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Description: IC MCU 32BIT ROMLESS 144LQFP
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
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| DSP56301PW100 |
|
Виробник: NXP USA Inc.
Description: IC DSP 24BIT FIXED-POINT 208LQFP
Description: IC DSP 24BIT FIXED-POINT 208LQFP
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| DSP56301VF100 |
|
Виробник: NXP USA Inc.
Description: IC DSP 24BIT FIXED-POINT 252-BGA
Description: IC DSP 24BIT FIXED-POINT 252-BGA
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| DSP56303EVM |
|
Виробник: NXP USA Inc.
Description: DSP56303 EVAL BRD
Description: DSP56303 EVAL BRD
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| DSP56309EVM |
|
Виробник: NXP USA Inc.
Description: DSP56309 EVAL BRD
Description: DSP56309 EVAL BRD
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| DSP56311EVM |
Виробник: NXP USA Inc.
Description: DSP56311 EVAL BRD
Description: DSP56311 EVAL BRD
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| MC100ES6111FA |
|
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: ECL, HSTL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 2.7 GHz
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: ECL, HSTL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 2.7 GHz
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| MC100ES6222TB |
|
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 2:15 3GHZ 52LQFP
Packaging: Tray
Package / Case: 52-LQFP Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Divider, Multiplexer
Input: ECL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:15
Differential - Input:Output: Yes/Yes
Supplier Device Package: 52-LQFP (10x10)
Frequency - Max: 3 GHz
Description: IC CLK BUFFER 2:15 3GHZ 52LQFP
Packaging: Tray
Package / Case: 52-LQFP Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Divider, Multiplexer
Input: ECL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:15
Differential - Input:Output: Yes/Yes
Supplier Device Package: 52-LQFP (10x10)
Frequency - Max: 3 GHz
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| MC145481DT |
|
Виробник: NXP USA Inc.
Description: IC PCM CODEC-FILTER 3V 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Type: PCM, Filter
Data Interface: PCM Audio Interface
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Digital: 2.7V ~ 5.25V
Resolution (Bits): 6 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Description: IC PCM CODEC-FILTER 3V 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Type: PCM, Filter
Data Interface: PCM Audio Interface
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Digital: 2.7V ~ 5.25V
Resolution (Bits): 6 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
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| MC145483DT |
|
Виробник: NXP USA Inc.
Description: IC PCM COD-FILT 3V 13BIT 20TSSOP
Description: IC PCM COD-FILT 3V 13BIT 20TSSOP
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| MC145483FC |
|
Виробник: NXP USA Inc.
Description: IC PCM CODFIL 3V 13BIT LIN 32QFN
Description: IC PCM CODFIL 3V 13BIT LIN 32QFN
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| MC145484DT |
|
Виробник: NXP USA Inc.
Description: IC PCM CODEC-FILTER 5V 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Type: PCM, Filter
Data Interface: PCM Audio Interface
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Digital: 4.5V ~ 5.5V
Resolution (Bits): 13 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 20-TSSOP
Description: IC PCM CODEC-FILTER 5V 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Type: PCM, Filter
Data Interface: PCM Audio Interface
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Digital: 4.5V ~ 5.5V
Resolution (Bits): 13 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 20-TSSOP
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| MC14LC5480DT |
|
Виробник: NXP USA Inc.
Description: IC PCM CODEC-FILTER 5V 20-TSSOP
Number of ADCs / DACs: 1 / 1
Resolution (Bits): 13 b
Voltage - Supply, Digital: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 85°C
Data Interface: PCM Audio Interface
Type: PCM, Filter
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Part Status: Obsolete
Supplier Device Package: 20-TSSOP
Sigma Delta: No
Description: IC PCM CODEC-FILTER 5V 20-TSSOP
Number of ADCs / DACs: 1 / 1
Resolution (Bits): 13 b
Voltage - Supply, Digital: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 85°C
Data Interface: PCM Audio Interface
Type: PCM, Filter
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Part Status: Obsolete
Supplier Device Package: 20-TSSOP
Sigma Delta: No
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| MC68302PV33C |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MPU M683XX 33MHZ 144LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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| MC68360CEM25L |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 240-FQFP (32x32)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 240-BFQFP
Packaging: Tray
Description: IC MPU M683XX 25MHZ 240FQFP
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 240-FQFP (32x32)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 240-BFQFP
Packaging: Tray
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| MC68360EM33L |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 240FQFP
Package / Case: 240-BFQFP
Packaging: Tray
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 240-FQFP (32x32)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Description: IC MPU M683XX 33MHZ 240FQFP
Package / Case: 240-BFQFP
Packaging: Tray
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 240-FQFP (32x32)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
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| MC68360ZP25L |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BGA
Packaging: Tray
Description: IC MPU M683XX 25MHZ 357BGA
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BGA
Packaging: Tray
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| MC68360ZP25VL |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BGA
Packaging: Tray
Additional Interfaces: SCC, SMC, SPI
Description: IC MPU M683XX 25MHZ 357BGA
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BGA
Packaging: Tray
Additional Interfaces: SCC, SMC, SPI
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| MC68EN360CEM25L |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Description: IC MPU M683XX 25MHZ 240FQFP
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| MC68LC302CPU20CT |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 100LQFP
Description: IC MPU M683XX 20MHZ 100LQFP
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| MC68MH360EM25L |
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 240-FQFP (32x32)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 240-BFQFP
Packaging: Tray
Description: IC MPU M683XX 25MHZ 240FQFP
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 240-FQFP (32x32)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 240-BFQFP
Packaging: Tray
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