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IP3337CX18/LF/P135 NXP USA Inc. IP3337CX18.pdf Description: DATA LINE FILTER
Packaging: Bulk
Part Status: Active
на замовлення 4499 шт:
термін постачання 21-31 дні (днів)
875+27.47 грн
Мінімальне замовлення: 875
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BUK7628-100A,118 BUK7628-100A,118 NXP USA Inc. BUK7628-100A.pdf Description: MOSFET N-CH 100V 47A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 47A (Tc)
Rds On (Max) @ Id, Vgs: 28mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 3100 pF @ 25 V
Qualification: AEC-Q101
на замовлення 5440 шт:
термін постачання 21-31 дні (днів)
480+50.24 грн
Мінімальне замовлення: 480
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N74F38D,602 N74F38D,602 NXP USA Inc. DS_568_74F38.pdf Description: IC GATE NAND 4CH 2-INP 14SO
Packaging: Tube
Features: Open Collector
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 64mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
на замовлення 19835 шт:
термін постачання 21-31 дні (днів)
2420+9.70 грн
Мінімальне замовлення: 2420
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N74F38D-Q100118 N74F38D-Q100118 NXP USA Inc. PHGLS29162-1.pdf?t.download=true&u=5oefqw Description: NAND GATE, F/FAST SERIES, TTL
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
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BY229-600,127 BY229-600,127 NXP USA Inc. BY229_SERIES.pdf Description: DIODE STANDARD 500V 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
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BY229X-200,127 BY229X-200,127 NXP USA Inc. BY229%28F%2CX%29.pdf Description: DIODE STANDARD 150V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 150 V
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BY229X-600,127 BY229X-600,127 NXP USA Inc. BY229%28F%2CX%29.pdf Description: DIODE STANDARD 500V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
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BY229X-800,127 BY229X-800,127 NXP USA Inc. BY229%28F%2CX%29.pdf Description: DIODE STANDARD 600V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 600 V
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BUK9107-55ATE,118 NXP USA Inc. PHGLS18440-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BUK9107-55ATE -
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 50A, 10V
FET Feature: Temperature Sensing Diode
Power Dissipation (Max): 272W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SOT-426
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 108 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 5836 pF @ 25 V
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BUK7614-55A,118 BUK7614-55A,118 NXP USA Inc. BUK%2875%2C76%2914-55A.pdf Description: MOSFET N-CH 55V 73A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2464 pF @ 25 V
Qualification: AEC-Q101
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BUK7614-55A,118 BUK7614-55A,118 NXP USA Inc. BUK%2875%2C76%2914-55A.pdf Description: MOSFET N-CH 55V 73A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2464 pF @ 25 V
Qualification: AEC-Q101
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BUK7614-55,118 BUK7614-55,118 NXP USA Inc. BUK7614-55.pdf Description: MOSFET N-CH 55V 68A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 68A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 142W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2900 pF @ 25 V
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74HC165BQ115 NXP USA Inc. 74HC_HCT165.pdf Description: NOW NEXPERIA 74HC165BQ-Q100 - PA
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Active
Number of Bits per Element: 8
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SPC5606BK0MLL6R,528 NXP USA Inc. Description: POWERPC CORE ARCHITECTURE MPU
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SPC5606BK0CLL6 SPC5606BK0CLL6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
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SPC5606BK0VLL4 SPC5606BK0VLL4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
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SPC5606BK0CLQ4 SPC5606BK0CLQ4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5606BK0CLQ6 SPC5606BK0CLQ6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5606BK0VLQ4 SPC5606BK0VLQ4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5606BK0VLL6R SPC5606BK0VLL6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
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SPC5606BF1VLQ6 SPC5606BF1VLQ6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5606BK0CLU4 SPC5606BK0CLU4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5606BF1VLQ6R SPC5606BF1VLQ6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5606BK0CLU6 SPC5606BK0CLU6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
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SPC5606BK0VLU4 SPC5606BK0VLU4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5606BK0VLU6 SPC5606BK0VLU6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5606BK0VLU6R SPC5606BK0VLU6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5606BK0MLU6R SPC5606BK0MLU6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5606SF2CLU6R SPC5606SF2CLU6R NXP USA Inc. MPC5606S.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 133
DigiKey Programmable: Not Verified
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SPC5606EF2VMC SPC5606EF2VMC NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
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SPC5606EF2VMCR SPC5606EF2VMCR NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 39
DigiKey Programmable: Not Verified
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SPC5606EEF2VMC SPC5606EEF2VMC NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
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SPC5606EEF2VMCR SPC5606EEF2VMCR NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 39
DigiKey Programmable: Not Verified
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LS2084ASE7TTB,557 NXP USA Inc. Description: QORIQ LAYERSCAPE MULTI-CORE COMM
Packaging: Tray
Part Status: Active
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MC9S12XET256MAG MC9S12XET256MAG NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 144LQFP
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ADC1412D125HN/C1,5 ADC1412D125HN/C1,5 NXP USA Inc. PHGLS22903-1.pdf?t.download=true&u=5oefqw Description: IC ADC 14BIT PIPELINED 64HVQFN
Features: Simultaneous Sampling
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: LVDS - Parallel, Parallel
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 1.65V ~ 3.6V
Sampling Rate (Per Second): 125M
Input Type: Differential, Single Ended
Number of Inputs: 2
Supplier Device Package: 56-VFQFPN (8x8)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 2
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
7+3571.37 грн
Мінімальне замовлення: 7
В кошику  од. на суму  грн.
KITPF5024FRDMEVM KITPF5024FRDMEVM NXP USA Inc. KITPF5024FRDMEVM.pdf Description: KITPF5024FRDMEVM
Packaging: Bulk
Contents: Board(s)
Utilized IC / Part: PF5024
Supplied Contents: Board(s)
Embedded: No
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+14384.17 грн
В кошику  од. на суму  грн.
MCIMX537CVV8C2 MCIMX537CVV8C2 NXP USA Inc. Description: I.MX53 32-BIT MPU ARM CORTEX-A8
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MCIMX537CVV8C2R2 MCIMX537CVV8C2R2 NXP USA Inc. Description: I.MX53 32-BIT MPU ARM CORTEX-A8
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74LVC1G11GW-Q100,125 74LVC1G11GW-Q100,125 NXP USA Inc. 74LVC1G11_Q100.pdf Description: NOW NEXPERIA 74LVC1G11GW - AND G
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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74LVC1G11GW-Q100125 NXP USA Inc. 74LVC1G11_Q100.pdf Description: NOW NEXPERIA 74LVC1G11GW-Q100 -
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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PCF85363ATT1/AZ PCF85363ATT1/AZ NXP USA Inc. PCF85363A.pdf Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PCF85363ATT1/AZ PCF85363ATT1/AZ NXP USA Inc. PCF85363A.pdf Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
на замовлення 2390 шт:
термін постачання 21-31 дні (днів)
4+106.22 грн
10+74.18 грн
25+67.26 грн
100+55.97 грн
250+52.56 грн
500+50.50 грн
1000+48.01 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PMV62XN215 PMV62XN215 NXP USA Inc. Description: SMALL SIGNAL FET
Packaging: Bulk
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
6662+3.94 грн
Мінімальне замовлення: 6662
В кошику  од. на суму  грн.
S912ZVC96F0MLF S912ZVC96F0MLF NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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S912ZVC96F0MLFR S912ZVC96F0MLFR NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 28
DigiKey Programmable: Not Verified
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FRDM-K22F-AGMP03 FRDM-K22F-AGMP03 NXP USA Inc. UM11588.pdf Description: EVAL BOARD FXLS896XAF
Packaging: Bulk
Interface: I2C, Serial, SPI
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: FXLS8962AF, FXAS21002C, MAG3110, MPL3115A2
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Sensing Range: ±2g, 4g, 8g, 16g, 20 to 110 kPa
Part Status: Active
Contents: Board(s), Cable(s)
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+11522.19 грн
В кошику  од. на суму  грн.
MCF54455VR266 MCF54455VR266 NXP USA Inc. MCF54455.pdf Description: RISC MICROPROCESSOR, 32-BIT, 266
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74HC4059D,112 74HC4059D,112 NXP USA Inc. 74HC%28T%294059.pdf Description: IC DIVIDER BY N 16-BIT 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Divide-by-N
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 24-SO
Part Status: Obsolete
Voltage - Supply: 2 V ~ 6 V
Count Rate: 43 MHz
Number of Bits per Element: 16
на замовлення 387 шт:
термін постачання 21-31 дні (днів)
387+80.19 грн
Мінімальне замовлення: 387
В кошику  од. на суму  грн.
74HC4059D,118 74HC4059D,118 NXP USA Inc. 74HC%28T%294059.pdf Description: IC DIVIDER BY N 16-BIT 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Divide-by-N
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 24-SO
Part Status: Obsolete
Voltage - Supply: 2 V ~ 6 V
Count Rate: 43 MHz
Number of Bits per Element: 16
на замовлення 338 шт:
термін постачання 21-31 дні (днів)
338+80.19 грн
Мінімальне замовлення: 338
В кошику  од. на суму  грн.
PMEG4005ESF315 PMEG4005ESF315 NXP USA Inc. PMEG4005ESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 500mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 500 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
на замовлення 270000 шт:
термін постачання 21-31 дні (днів)
7969+3.27 грн
Мінімальне замовлення: 7969
В кошику  од. на суму  грн.
LS2088ASN7QQB NXP USA Inc. Description: LS2088A ST 1600 R1.1
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LS2088AXN711B NXP USA Inc. Description: IC MPU QORIQ 2.1GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8), 2.5GbE (16)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
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LS2088AXE711B NXP USA Inc. Description: LS2088A XT WE 2100 R1.1
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PMV50XP215 PMV50XP215 NXP USA Inc. PMV50XP.pdf Description: P-CHANNEL MOSFET
на замовлення 1464000 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
MMRF2010NR1 MMRF2010NR1 NXP USA Inc. MMRF2010N.pdf Description: RF MOSFET LDMOS 50V TO270-14
Packaging: Cut Tape (CT)
Package / Case: TO-270-14 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.09GHz
Power - Output: 250W
Gain: 32.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-14
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 80 mA
на замовлення 158 шт:
термін постачання 21-31 дні (днів)
1+33765.15 грн
10+28228.18 грн
25+27158.37 грн
В кошику  од. на суму  грн.
MMRF2010GNR1 MMRF2010GNR1 NXP USA Inc. MMRF2010N.pdf Description: RF MOSFET LDMOS 50V TO270-14
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 250W
Gain: 32.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-14 GULL
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 80 mA
товару немає в наявності
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MMRF2010GNR1 MMRF2010GNR1 NXP USA Inc. MMRF2010N.pdf Description: RF MOSFET LDMOS 50V TO270-14
Packaging: Cut Tape (CT)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 250W
Gain: 32.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-14 GULL
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 80 mA
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LPC2468FET208K LPC2468FET208K NXP USA Inc. LPC2468.pdf Description: IC MCU 16/32BIT 512KB 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 363 шт:
термін постачання 21-31 дні (днів)
1+1446.53 грн
10+1348.22 грн
25+1301.28 грн
126+1154.47 грн
В кошику  од. на суму  грн.
PCA9615DPZ PCA9615DPZ NXP USA Inc. PCA9615.pdf Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 1MHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 6 pF
на замовлення 14134 шт:
термін постачання 21-31 дні (днів)
2+261.67 грн
10+188.78 грн
25+173.08 грн
100+146.22 грн
250+138.49 грн
500+133.84 грн
1000+127.87 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
IP3337CX18/LF/P135 IP3337CX18.pdf
Виробник: NXP USA Inc.
Description: DATA LINE FILTER
Packaging: Bulk
Part Status: Active
на замовлення 4499 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
875+27.47 грн
Мінімальне замовлення: 875
В кошику  од. на суму  грн.
BUK7628-100A,118 BUK7628-100A.pdf
BUK7628-100A,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 100V 47A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 47A (Tc)
Rds On (Max) @ Id, Vgs: 28mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 3100 pF @ 25 V
Qualification: AEC-Q101
на замовлення 5440 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
480+50.24 грн
Мінімальне замовлення: 480
В кошику  од. на суму  грн.
N74F38D,602 DS_568_74F38.pdf
N74F38D,602
Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14SO
Packaging: Tube
Features: Open Collector
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 64mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
на замовлення 19835 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2420+9.70 грн
Мінімальне замовлення: 2420
В кошику  од. на суму  грн.
N74F38D-Q100118 PHGLS29162-1.pdf?t.download=true&u=5oefqw
N74F38D-Q100118
Виробник: NXP USA Inc.
Description: NAND GATE, F/FAST SERIES, TTL
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
BY229-600,127 BY229_SERIES.pdf
BY229-600,127
Виробник: NXP USA Inc.
Description: DIODE STANDARD 500V 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
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BY229X-200,127 BY229%28F%2CX%29.pdf
BY229X-200,127
Виробник: NXP USA Inc.
Description: DIODE STANDARD 150V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 150 V
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BY229X-600,127 BY229%28F%2CX%29.pdf
BY229X-600,127
Виробник: NXP USA Inc.
Description: DIODE STANDARD 500V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
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BY229X-800,127 BY229%28F%2CX%29.pdf
BY229X-800,127
Виробник: NXP USA Inc.
Description: DIODE STANDARD 600V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 600 V
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BUK9107-55ATE,118 PHGLS18440-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BUK9107-55ATE -
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 50A, 10V
FET Feature: Temperature Sensing Diode
Power Dissipation (Max): 272W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SOT-426
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 108 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 5836 pF @ 25 V
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BUK7614-55A,118 BUK%2875%2C76%2914-55A.pdf
BUK7614-55A,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 73A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2464 pF @ 25 V
Qualification: AEC-Q101
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BUK7614-55A,118 BUK%2875%2C76%2914-55A.pdf
BUK7614-55A,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 73A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2464 pF @ 25 V
Qualification: AEC-Q101
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BUK7614-55,118 BUK7614-55.pdf
BUK7614-55,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 68A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 68A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 142W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2900 pF @ 25 V
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74HC165BQ115 74HC_HCT165.pdf
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74HC165BQ-Q100 - PA
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Active
Number of Bits per Element: 8
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SPC5606BK0MLL6R,528
Виробник: NXP USA Inc.
Description: POWERPC CORE ARCHITECTURE MPU
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SPC5606BK0CLL6 MPC5606B.pdf
SPC5606BK0CLL6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
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SPC5606BK0VLL4 MPC5606B.pdf
SPC5606BK0VLL4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
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SPC5606BK0CLQ4 MPC5606B.pdf
SPC5606BK0CLQ4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5606BK0CLQ6 MPC5606B.pdf
SPC5606BK0CLQ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5606BK0VLQ4 MPC5606B.pdf
SPC5606BK0VLQ4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5606BK0VLL6R MPC5606B.pdf
SPC5606BK0VLL6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
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SPC5606BF1VLQ6 MPC560XBFAMFS.pdf
SPC5606BF1VLQ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5606BK0CLU4 MPC5606B.pdf
SPC5606BK0CLU4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5606BF1VLQ6R MPC560XBFAMFS.pdf
SPC5606BF1VLQ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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SPC5606BK0CLU6 MPC5606B.pdf
SPC5606BK0CLU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
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SPC5606BK0VLU4 MPC5606B.pdf
SPC5606BK0VLU4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5606BK0VLU6 MPC5606B.pdf
SPC5606BK0VLU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5606BK0VLU6R MPC5606B.pdf
SPC5606BK0VLU6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5606BK0MLU6R MPC5606B.pdf
SPC5606BK0MLU6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5606SF2CLU6R MPC5606S.pdf
SPC5606SF2CLU6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 133
DigiKey Programmable: Not Verified
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SPC5606EF2VMC
SPC5606EF2VMC
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
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SPC5606EF2VMCR
SPC5606EF2VMCR
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 39
DigiKey Programmable: Not Verified
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SPC5606EEF2VMC
SPC5606EEF2VMC
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
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SPC5606EEF2VMCR
SPC5606EEF2VMCR
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 39
DigiKey Programmable: Not Verified
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LS2084ASE7TTB,557
Виробник: NXP USA Inc.
Description: QORIQ LAYERSCAPE MULTI-CORE COMM
Packaging: Tray
Part Status: Active
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MC9S12XET256MAG MC9S12XEP100RMV1.pdf
MC9S12XET256MAG
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
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ADC1412D125HN/C1,5 PHGLS22903-1.pdf?t.download=true&u=5oefqw
ADC1412D125HN/C1,5
Виробник: NXP USA Inc.
Description: IC ADC 14BIT PIPELINED 64HVQFN
Features: Simultaneous Sampling
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: LVDS - Parallel, Parallel
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 1.65V ~ 3.6V
Sampling Rate (Per Second): 125M
Input Type: Differential, Single Ended
Number of Inputs: 2
Supplier Device Package: 56-VFQFPN (8x8)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 2
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
7+3571.37 грн
Мінімальне замовлення: 7
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KITPF5024FRDMEVM KITPF5024FRDMEVM.pdf
KITPF5024FRDMEVM
Виробник: NXP USA Inc.
Description: KITPF5024FRDMEVM
Packaging: Bulk
Contents: Board(s)
Utilized IC / Part: PF5024
Supplied Contents: Board(s)
Embedded: No
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+14384.17 грн
В кошику  од. на суму  грн.
MCIMX537CVV8C2
MCIMX537CVV8C2
Виробник: NXP USA Inc.
Description: I.MX53 32-BIT MPU ARM CORTEX-A8
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MCIMX537CVV8C2R2
MCIMX537CVV8C2R2
Виробник: NXP USA Inc.
Description: I.MX53 32-BIT MPU ARM CORTEX-A8
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74LVC1G11GW-Q100,125 74LVC1G11_Q100.pdf
74LVC1G11GW-Q100,125
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G11GW - AND G
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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74LVC1G11GW-Q100125 74LVC1G11_Q100.pdf
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G11GW-Q100 -
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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PCF85363ATT1/AZ PCF85363A.pdf
PCF85363ATT1/AZ
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PCF85363ATT1/AZ PCF85363A.pdf
PCF85363ATT1/AZ
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
на замовлення 2390 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+106.22 грн
10+74.18 грн
25+67.26 грн
100+55.97 грн
250+52.56 грн
500+50.50 грн
1000+48.01 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PMV62XN215
PMV62XN215
Виробник: NXP USA Inc.
Description: SMALL SIGNAL FET
Packaging: Bulk
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6662+3.94 грн
Мінімальне замовлення: 6662
В кошику  од. на суму  грн.
S912ZVC96F0MLF S12ZVCFS.pdf
S912ZVC96F0MLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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S912ZVC96F0MLFR S12ZVCFS.pdf
S912ZVC96F0MLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 28
DigiKey Programmable: Not Verified
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FRDM-K22F-AGMP03 UM11588.pdf
FRDM-K22F-AGMP03
Виробник: NXP USA Inc.
Description: EVAL BOARD FXLS896XAF
Packaging: Bulk
Interface: I2C, Serial, SPI
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: FXLS8962AF, FXAS21002C, MAG3110, MPL3115A2
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Sensing Range: ±2g, 4g, 8g, 16g, 20 to 110 kPa
Part Status: Active
Contents: Board(s), Cable(s)
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+11522.19 грн
В кошику  од. на суму  грн.
MCF54455VR266 MCF54455.pdf
MCF54455VR266
Виробник: NXP USA Inc.
Description: RISC MICROPROCESSOR, 32-BIT, 266
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74HC4059D,112 74HC%28T%294059.pdf
74HC4059D,112
Виробник: NXP USA Inc.
Description: IC DIVIDER BY N 16-BIT 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Divide-by-N
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 24-SO
Part Status: Obsolete
Voltage - Supply: 2 V ~ 6 V
Count Rate: 43 MHz
Number of Bits per Element: 16
на замовлення 387 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
387+80.19 грн
Мінімальне замовлення: 387
В кошику  од. на суму  грн.
74HC4059D,118 74HC%28T%294059.pdf
74HC4059D,118
Виробник: NXP USA Inc.
Description: IC DIVIDER BY N 16-BIT 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Divide-by-N
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 24-SO
Part Status: Obsolete
Voltage - Supply: 2 V ~ 6 V
Count Rate: 43 MHz
Number of Bits per Element: 16
на замовлення 338 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
338+80.19 грн
Мінімальне замовлення: 338
В кошику  од. на суму  грн.
PMEG4005ESF315 PMEG4005ESF.pdf
PMEG4005ESF315
Виробник: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 500mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 500 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
на замовлення 270000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
7969+3.27 грн
Мінімальне замовлення: 7969
В кошику  од. на суму  грн.
LS2088ASN7QQB
Виробник: NXP USA Inc.
Description: LS2088A ST 1600 R1.1
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LS2088AXN711B
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 2.1GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8), 2.5GbE (16)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
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LS2088AXE711B
Виробник: NXP USA Inc.
Description: LS2088A XT WE 2100 R1.1
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PMV50XP215 PMV50XP.pdf
PMV50XP215
Виробник: NXP USA Inc.
Description: P-CHANNEL MOSFET
на замовлення 1464000 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
MMRF2010NR1 MMRF2010N.pdf
MMRF2010NR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-14
Packaging: Cut Tape (CT)
Package / Case: TO-270-14 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.09GHz
Power - Output: 250W
Gain: 32.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-14
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 80 mA
на замовлення 158 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+33765.15 грн
10+28228.18 грн
25+27158.37 грн
В кошику  од. на суму  грн.
MMRF2010GNR1 MMRF2010N.pdf
MMRF2010GNR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-14
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 250W
Gain: 32.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-14 GULL
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 80 mA
товару немає в наявності
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MMRF2010GNR1 MMRF2010N.pdf
MMRF2010GNR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-14
Packaging: Cut Tape (CT)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 250W
Gain: 32.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-14 GULL
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 80 mA
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LPC2468FET208K LPC2468.pdf
LPC2468FET208K
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 512KB 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 363 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1446.53 грн
10+1348.22 грн
25+1301.28 грн
126+1154.47 грн
В кошику  од. на суму  грн.
PCA9615DPZ PCA9615.pdf
PCA9615DPZ
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 1MHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 6 pF
на замовлення 14134 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+261.67 грн
10+188.78 грн
25+173.08 грн
100+146.22 грн
250+138.49 грн
500+133.84 грн
1000+127.87 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
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