Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35737) > Сторінка 415 з 596
Фото | Назва | Виробник | Інформація |
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PESD5V0X2UAMB315 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Type: Zener Operating Temperature: 150°C (TJ) Applications: Telecom Capacitance @ Frequency: 0.8pF @ 1MHz Current - Peak Pulse (10/1000µs): 2.5A (8/20µs) Voltage - Reverse Standoff (Typ): 5V (Max) Supplier Device Package: DFN1006B-3 Unidirectional Channels: 1 Voltage - Breakdown (Min): 7.5V Voltage - Clamping (Max) @ Ipp: 14V Power Line Protection: No Grade: Automotive Qualification: AEC-Q101 |
на замовлення 1401019 шт: термін постачання 21-31 дні (днів) |
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74HC2G02DP-Q100125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 8-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF Grade: Automotive Part Status: Active Number of Circuits: 2 Current - Quiescent (Max): 20 µA Qualification: AEC-Q100 |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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74HC2G04GV-Q100125 | NXP USA Inc. |
![]() Features: Schmitt Trigger Packaging: Bulk Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 6-TSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 13ns @ 6V, 50pF Grade: Automotive Part Status: Active Number of Circuits: 2 Current - Quiescent (Max): 1 µA Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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74HC2G86DP-Q100125 | NXP USA Inc. |
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на замовлення 62100 шт: термін постачання 21-31 дні (днів) |
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74HC2G66DP-Q100125 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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74HC2G126GD,125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 1 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 8-XSON, SOT996-2 (2x3) Part Status: Obsolete |
на замовлення 105210 шт: термін постачання 21-31 дні (днів) |
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74HC2G125GD125 | NXP USA Inc. |
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на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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MPC860PCZQ50D4-NXP | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC850DSLCZQ50BU | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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MPC855TZQ50D4-NXP | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
на замовлення 1259 шт: термін постачання 21-31 дні (днів) |
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MPC860TZQ50D4 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
на замовлення 154 шт: термін постачання 21-31 дні (днів) |
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MPC860DPZQ50D4557-NXP | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC850CZQ50BU | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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SVF521R3K2CMK4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 133MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: No Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
T2080NSE8TTB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MCIMX537CVP8C2R2 | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGA Packaging: Tape & Reel (TR) Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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74LVC573ABXX | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-XFQFN Exposed Pad Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.2V ~ 3.6V Independent Circuits: 1 Current - Output High, Low: 24mA, 24mA Delay Time - Propagation: 1.5ns Supplier Device Package: 20-DHXQFN (4.5x2.5) |
на замовлення 261900 шт: термін постачання 21-31 дні (днів) |
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74HCT7540N112 | NXP USA Inc. | Description: IC BUFFER INVERT 5.5V 20DIP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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NX7002BKMB315 | NXP USA Inc. |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NX7002BKXB147 | NXP USA Inc. |
![]() Packaging: Bulk |
на замовлення 1459345 шт: термін постачання 21-31 дні (днів) |
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NX7002BKS115 | NXP USA Inc. |
![]() Packaging: Bulk |
на замовлення 18000 шт: термін постачання 21-31 дні (днів) |
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74AVC4T245PW-Q100118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Translation Transceiver Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 2 Current - Output High, Low: 12mA, 12mA Supplier Device Package: 16-TSSOP Part Status: Active |
на замовлення 968 шт: термін постачання 21-31 дні (днів) |
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TEA1998TS/1115 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TEA1993TS/1 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TEA1993TS/1125 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TEA2208T/1J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0V ~ 440V Applications: Desktop, Notebook PCs Current - Supply: 2mA Supplier Device Package: 14-SO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TEA2208T/1J | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0V ~ 440V Applications: Desktop, Notebook PCs Current - Supply: 2mA Supplier Device Package: 14-SO |
на замовлення 2496 шт: термін постачання 21-31 дні (днів) |
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74AXP1G11GSH | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.7V ~ 2.75V Current - Output High, Low: 8mA, 8mA Number of Inputs: 3 Supplier Device Package: 6-XSON, SOT1202 (1x1) Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 600 nA |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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IP3348CX20,135 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-UFBGA, WLCSP Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: L = 15nH (Total), C = 25pF (Total) Height: 0.026" (0.65mm) Attenuation Value: 40dB @ 1GHz ~ 3GHz Filter Order: 3rd Applications: Data Lines for Mobile Devices Technology: LC (Pi) Center / Cutoff Frequency: 350MHz (Cutoff) Resistance - Channel (Ohms): 10 ESD Protection: Yes Part Status: Obsolete Number of Channels: 8 Current: 20 mA |
на замовлення 4500 шт: термін постачання 21-31 дні (днів) |
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IP3088CX20,135 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-WFBGA, WLCSP Size / Dimension: 0.156" L x 0.050" W (3.96mm x 1.28mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: L = 40nH (Total), C = 42pF (Total) Height: 0.028" (0.70mm) Attenuation Value: 40dB @ 800MHz ~ 1.5GHz Filter Order: 5th Applications: GSM, LAN, PCS, WAN Technology: LC (Pi) Center / Cutoff Frequency: 175MHz (Cutoff) Resistance - Channel (Ohms): 18 ESD Protection: Yes Part Status: Active Number of Channels: 8 Current: 30 mA |
на замовлення 10902 шт: термін постачання 21-31 дні (днів) |
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LPC1225FBD48/301EL | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
на замовлення 1061 шт: термін постачання 21-31 дні (днів) |
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LPC1225FBD48/301151 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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LPC1225FBD48/321151 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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BLF7G10L-250,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: SOT-502A Frequency: 920MHz ~ 960MHz Power - Output: 60W Gain: 19.5dB Technology: LDMOS Supplier Device Package: LDMOST Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 1.8 A |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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MC33FS4500LAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
BSC9131NXN7KHKB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 520-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 520-FCBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator Part Status: Obsolete Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
T1023NXE7PQA | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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SPC5606BF1MLQ6R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 121 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC9S08QA4CFQER | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-DFN-EP (4x4) Number of I/O: 4 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MRF24301HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS NI780 Packaging: Bulk Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 2.4GHz ~ 2.5GHz Power - Output: 300W Gain: 13.5dB Technology: LDMOS Supplier Device Package: NI-780H-2L |
на замовлення 123 шт: термін постачання 21-31 дні (днів) |
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A7102CHUK/T0BC2VAZ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Interface: I2C Operating Temperature: -40°C ~ 90°C (TA) Voltage - Supply: 2.5V ~ 3.6V Applications: Authentication Core Processor: MX51 Supplier Device Package: 12-WLCSP (2.06x2.02) Part Status: Obsolete DigiKey Programmable: Not Verified |
на замовлення 1721 шт: термін постачання 21-31 дні (днів) |
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A7102CHTK2/T0BC2CJ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Operating Temperature: -40°C ~ 90°C (TA) Voltage - Supply: 2.5V ~ 3.6V Applications: Authentication Core Processor: MX51 Supplier Device Package: 8-HVSON (4x4) Part Status: Last Time Buy DigiKey Programmable: Not Verified |
на замовлення 4822 шт: термін постачання 21-31 дні (днів) |
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MIMXRT685SFAWBR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 114-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 300MHz RAM Size: 4.5M x 8 Operating Temperature: -20°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 114-WLCSP (4.24x4.24) Part Status: Active Number of I/O: 65 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MIMXRT685SFAWBR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 114-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 300MHz RAM Size: 4.5M x 8 Operating Temperature: -20°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 114-WLCSP (4.24x4.24) Part Status: Active Number of I/O: 65 DigiKey Programmable: Not Verified |
на замовлення 5781 шт: термін постачання 21-31 дні (днів) |
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BAT74S135 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 5 ns Technology: Schottky Diode Configuration: 2 Independent Current - Average Rectified (Io) (per Diode): 200mA (DC) Supplier Device Package: 6-TSSOP Operating Temperature - Junction: 125°C (Max) Voltage - DC Reverse (Vr) (Max): 30 V Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA Current - Reverse Leakage @ Vr: 2 µA @ 25 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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BAT74V115 | NXP USA Inc. |
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на замовлення 11400 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||
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MCIMX233CJM4B | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S9S12GA128F0MLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: 12V1 Data Converters: A/D 12x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TJA1441AT/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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74LVC1G17GX/S500125 | NXP USA Inc. |
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на замовлення 330000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | |||||||||||||||||
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PSMN3R3-80ES,127 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 3.3mOhm @ 25A, 10V Power Dissipation (Max): 338W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: I2PAK Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 80 V Gate Charge (Qg) (Max) @ Vgs: 139 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 9961 pF @ 40 V |
на замовлення 1415 шт: термін постачання 21-31 дні (днів) |
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MKV31F512VLH12R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 46 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCIMX6Y0DVM05AB557 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active |
на замовлення 152 шт: термін постачання 21-31 дні (днів) |
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MCIMX6Y7DVM09AA | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC9S08PB16MTJ | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 18 DigiKey Programmable: Not Verified |
на замовлення 140 шт: термін постачання 21-31 дні (днів) |
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TDA8296HN/C1,557 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Demodulator Voltage - Supply: 1.1V ~ 3.6V Supplier Device Package: 40-HVQFN (6x6) Part Status: Obsolete Current - Supply: 65 mA |
на замовлення 16251 шт: термін постачання 21-31 дні (днів) |
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TDA18252HN/C1,557 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V ~ 3.6V Applications: Consumer Video Supplier Device Package: 48-HVQFN (7x7) Part Status: Obsolete Control Interface: I2C |
на замовлення 35100 шт: термін постачання 21-31 дні (днів) |
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TDA19998HL/C1,557 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Function: Switch Voltage - Supply: 1.65V ~ 1.95, 3.13V ~ 3.47V Applications: Video Display Standards: CEA-861-D, DVI 1.0, HDCP 1.4, HDMI 1.4a Supplier Device Package: 100-LQFP (14x14) Part Status: Obsolete Control Interface: I2C |
на замовлення 16183 шт: термін постачання 21-31 дні (днів) |
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TDA18257HN/C1557 | NXP USA Inc. |
Description: SI TUNER LOWCOST FOR DTMB IN CHI Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 63700 шт: термін постачання 21-31 дні (днів) |
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MPC850DEVR50BU | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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PESD5V0X2UAMB315 |
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Виробник: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: 150°C (TJ)
Applications: Telecom
Capacitance @ Frequency: 0.8pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006B-3
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 14V
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
Description: TVS DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: 150°C (TJ)
Applications: Telecom
Capacitance @ Frequency: 0.8pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006B-3
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 14V
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
на замовлення 1401019 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
4046+ | 5.07 грн |
74HC2G02DP-Q100125 |
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Виробник: NXP USA Inc.
Description: IC GATE NOR 2CH 2-INP 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 8-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Grade: Automotive
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 20 µA
Qualification: AEC-Q100
Description: IC GATE NOR 2CH 2-INP 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 8-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Grade: Automotive
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 20 µA
Qualification: AEC-Q100
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1972+ | 10.86 грн |
74HC2G04GV-Q100125 |
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Виробник: NXP USA Inc.
Description: IC INVERT SCHMITT 2CH 2INP 6TSOP
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 13ns @ 6V, 50pF
Grade: Automotive
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Qualification: AEC-Q100
Description: IC INVERT SCHMITT 2CH 2INP 6TSOP
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 13ns @ 6V, 50pF
Grade: Automotive
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
74HC2G86DP-Q100125 |
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Виробник: NXP USA Inc.
Description: IC GATE XOR 2CH 2-INP 8TSSOP
Description: IC GATE XOR 2CH 2-INP 8TSSOP
на замовлення 62100 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2263+ | 9.73 грн |
74HC2G126GD,125 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Part Status: Obsolete
Description: IC BUFFER NON-INVERT 6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Part Status: Obsolete
на замовлення 105210 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2049+ | 11.15 грн |
74HC2G125GD125 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 8XSON
Description: IC BUFFER NON-INVERT 6V 8XSON
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1697+ | 14.01 грн |
MPC860PCZQ50D4-NXP |
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Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Active
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
MPC850DSLCZQ50BU |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
на замовлення 13 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
8+ | 3142.42 грн |
MPC855TZQ50D4-NXP |
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Виробник: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 1259 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 10373.79 грн |
MPC860TZQ50D4 |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 154 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 10366.38 грн |
MPC860DPZQ50D4557-NXP |
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Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
товару немає в наявності
В кошику
од. на суму грн.
MPC850CZQ50BU |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
7+ | 3413.06 грн |
SVF521R3K2CMK4 |
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Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
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T2080NSE8TTB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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MCIMX537CVP8C2R2 |
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Active
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74LVC573ABXX |
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Виробник: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20HXQFN
Packaging: Bulk
Package / Case: 20-XFQFN Exposed Pad
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 1.5ns
Supplier Device Package: 20-DHXQFN (4.5x2.5)
Description: IC D-TYPE TRANSP SGL 8:8 20HXQFN
Packaging: Bulk
Package / Case: 20-XFQFN Exposed Pad
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 1.5ns
Supplier Device Package: 20-DHXQFN (4.5x2.5)
на замовлення 261900 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1567+ | 13.91 грн |
74HCT7540N112 |
Виробник: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20DIP
Description: IC BUFFER INVERT 5.5V 20DIP
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NX7002BKXB147 |
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на замовлення 1459345 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
5495+ | 3.66 грн |
NX7002BKS115 |
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на замовлення 18000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
8242+ | 2.92 грн |
74AVC4T245PW-Q100118 |
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Виробник: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 2
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 16-TSSOP
Part Status: Active
Description: IC TRANSLATION TXRX 3.6V 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 2
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 16-TSSOP
Part Status: Active
на замовлення 968 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
968+ | 28.61 грн |
TEA1998TS/1115 |
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Виробник: NXP USA Inc.
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Description: GREENCHIP SYNCHRONOUS RECTIFIER
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TEA1993TS/1 |
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Виробник: NXP USA Inc.
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Description: GREENCHIP SYNCHRONOUS RECTIFIER
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TEA1993TS/1125 |
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Виробник: NXP USA Inc.
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Description: GREENCHIP SYNCHRONOUS RECTIFIER
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TEA2208T/1J |
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Виробник: NXP USA Inc.
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
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TEA2208T/1J |
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Виробник: NXP USA Inc.
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
на замовлення 2496 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 466.81 грн |
10+ | 345.78 грн |
25+ | 319.77 грн |
100+ | 273.20 грн |
250+ | 260.39 грн |
500+ | 252.66 грн |
1000+ | 242.27 грн |
74AXP1G11GSH |
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Виробник: NXP USA Inc.
Description: IC GATE AND 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
Description: IC GATE AND 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3249+ | 6.68 грн |
IP3348CX20,135 |
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Виробник: NXP USA Inc.
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Bulk
Package / Case: 20-UFBGA, WLCSP
Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Current: 20 mA
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Bulk
Package / Case: 20-UFBGA, WLCSP
Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Current: 20 mA
на замовлення 4500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2049+ | 11.40 грн |
IP3088CX20,135 |
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Виробник: NXP USA Inc.
Description: FILTER LC(PI) 40NH/42PF ESD SMD
Packaging: Bulk
Package / Case: 20-WFBGA, WLCSP
Size / Dimension: 0.156" L x 0.050" W (3.96mm x 1.28mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 40nH (Total), C = 42pF (Total)
Height: 0.028" (0.70mm)
Attenuation Value: 40dB @ 800MHz ~ 1.5GHz
Filter Order: 5th
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Center / Cutoff Frequency: 175MHz (Cutoff)
Resistance - Channel (Ohms): 18
ESD Protection: Yes
Part Status: Active
Number of Channels: 8
Current: 30 mA
Description: FILTER LC(PI) 40NH/42PF ESD SMD
Packaging: Bulk
Package / Case: 20-WFBGA, WLCSP
Size / Dimension: 0.156" L x 0.050" W (3.96mm x 1.28mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 40nH (Total), C = 42pF (Total)
Height: 0.028" (0.70mm)
Attenuation Value: 40dB @ 800MHz ~ 1.5GHz
Filter Order: 5th
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Center / Cutoff Frequency: 175MHz (Cutoff)
Resistance - Channel (Ohms): 18
ESD Protection: Yes
Part Status: Active
Number of Channels: 8
Current: 30 mA
на замовлення 10902 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
807+ | 28.12 грн |
LPC1225FBD48/301EL |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 1061 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 432.67 грн |
10+ | 271.62 грн |
25+ | 262.65 грн |
80+ | 237.98 грн |
250+ | 229.14 грн |
500+ | 224.38 грн |
1000+ | 210.67 грн |
LPC1225FBD48/301151 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Description: IC MCU 32BIT 64KB FLASH 48LQFP
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LPC1225FBD48/321151 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 80KB FLASH 48LQFP
Description: IC MCU 32BIT 80KB FLASH 48LQFP
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BLF7G10L-250,112 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 30V LDMOST
Packaging: Tube
Package / Case: SOT-502A
Frequency: 920MHz ~ 960MHz
Power - Output: 60W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
Description: RF MOSFET LDMOS 30V LDMOST
Packaging: Tube
Package / Case: SOT-502A
Frequency: 920MHz ~ 960MHz
Power - Output: 60W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
на замовлення 60 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 8199.85 грн |
MC33FS4500LAER2 |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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BSC9131NXN7KHKB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
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T1023NXE7PQA |
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Виробник: NXP USA Inc.
Description: QORIQ 2XCPU 64-BIT PWR ARCH 1.
Description: QORIQ 2XCPU 64-BIT PWR ARCH 1.
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SPC5606BF1MLQ6R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
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MC9S08QA4CFQER |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
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MRF24301HR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS NI780
Packaging: Bulk
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Description: RF MOSFET LDMOS NI780
Packaging: Bulk
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
на замовлення 123 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
4+ | 7296.26 грн |
A7102CHUK/T0BC2VAZ |
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Виробник: NXP USA Inc.
Description: SECURITY IC EXT TEMP WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: SECURITY IC EXT TEMP WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 1721 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 261.19 грн |
10+ | 189.52 грн |
25+ | 173.88 грн |
100+ | 147.07 грн |
250+ | 139.38 грн |
500+ | 134.74 грн |
1000+ | 128.78 грн |
A7102CHTK2/T0BC2CJ |
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Виробник: NXP USA Inc.
Description: SECURITY IC EXT TEMP HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: SECURITY IC EXT TEMP HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
на замовлення 4822 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 267.54 грн |
10+ | 194.03 грн |
25+ | 178.13 грн |
100+ | 150.81 грн |
250+ | 143.00 грн |
500+ | 138.29 грн |
1000+ | 132.22 грн |
2500+ | 128.20 грн |
MIMXRT685SFAWBR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
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MIMXRT685SFAWBR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Cut Tape (CT)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Cut Tape (CT)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
на замовлення 5781 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1471.88 грн |
10+ | 1130.14 грн |
25+ | 1058.33 грн |
100+ | 919.15 грн |
250+ | 883.86 грн |
500+ | 862.59 грн |
BAT74S135 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BAT74S - RECTIFIER
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 2 Independent
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: 6-TSSOP
Operating Temperature - Junction: 125°C (Max)
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Description: NOW NEXPERIA BAT74S - RECTIFIER
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 2 Independent
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: 6-TSSOP
Operating Temperature - Junction: 125°C (Max)
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
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BAT74V115 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BAT74V - RECTIFIER
Description: NOW NEXPERIA BAT74V - RECTIFIER
на замовлення 11400 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
MCIMX233CJM4B |
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Виробник: NXP USA Inc.
Description: MICROPROCESSOR, CMOS, PBGA169
Description: MICROPROCESSOR, CMOS, PBGA169
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S9S12GA128F0MLF |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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TJA1441AT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2500+ | 48.17 грн |
5000+ | 45.31 грн |
74LVC1G17GX/S500125 |
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Виробник: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Description: BUFFER, LVC/LCX/Z SERIES
на замовлення 330000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
PSMN3R3-80ES,127 |
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Виробник: NXP USA Inc.
Description: ELEMENT, NCHANNEL, SILICON, MOSF
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 3.3mOhm @ 25A, 10V
Power Dissipation (Max): 338W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 139 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9961 pF @ 40 V
Description: ELEMENT, NCHANNEL, SILICON, MOSF
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 3.3mOhm @ 25A, 10V
Power Dissipation (Max): 338W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 139 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9961 pF @ 40 V
на замовлення 1415 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
205+ | 111.72 грн |
MKV31F512VLH12R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
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MCIMX6Y0DVM05AB557 |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
на замовлення 152 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
32+ | 719.86 грн |
MCIMX6Y7DVM09AA |
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Виробник: NXP USA Inc.
Description: PROCESSORS - APPLICATION SPECIAL
Description: PROCESSORS - APPLICATION SPECIAL
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MC9S08PB16MTJ |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 140 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 124.64 грн |
10+ | 88.83 грн |
75+ | 73.85 грн |
TDA8296HN/C1,557 |
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Виробник: NXP USA Inc.
Description: RF DEMODULATOR IC 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.1V ~ 3.6V
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Obsolete
Current - Supply: 65 mA
Description: RF DEMODULATOR IC 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.1V ~ 3.6V
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Obsolete
Current - Supply: 65 mA
на замовлення 16251 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
239+ | 95.37 грн |
TDA18252HN/C1,557 |
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Виробник: NXP USA Inc.
Description: IC VIDEO SILICON TUNER 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Control Interface: I2C
Description: IC VIDEO SILICON TUNER 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Control Interface: I2C
на замовлення 35100 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
204+ | 112.48 грн |
TDA19998HL/C1,557 |
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Виробник: NXP USA Inc.
Description: IC VIDEO HDMI 1.4 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 1.65V ~ 1.95, 3.13V ~ 3.47V
Applications: Video Display
Standards: CEA-861-D, DVI 1.0, HDCP 1.4, HDMI 1.4a
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Control Interface: I2C
Description: IC VIDEO HDMI 1.4 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 1.65V ~ 1.95, 3.13V ~ 3.47V
Applications: Video Display
Standards: CEA-861-D, DVI 1.0, HDCP 1.4, HDMI 1.4a
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Control Interface: I2C
на замовлення 16183 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
102+ | 216.76 грн |
TDA18257HN/C1557 |
Виробник: NXP USA Inc.
Description: SI TUNER LOWCOST FOR DTMB IN CHI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: SI TUNER LOWCOST FOR DTMB IN CHI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 63700 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
357+ | 60.80 грн |
MPC850DEVR50BU |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
6+ | 3924.34 грн |