Виробник: Molex
Description: MICROFIT 3.0 RA SMT NAIL DR 15AU
Features: Solder Retention
Packaging: Bulk
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)

Виробник: Molex
Conn Power HDR 8 POS 3mm Solder RA SMD 8 Terminal 1 Port