Виробник: Molex
Description: MICROFIT 3.0 SR VERT TH VOIDS TI
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 7
Number of Rows: 1
Style: Board to Cable/Wire
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Kinked Pin, Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.125" (3.18mm)
Insulation Height: 0.390" (9.91mm)
Shrouding: Shrouded - 1 Wall
Insulation Material: Liquid Crystal Polymer (LCP)

Виробник: Molex
Conn Wire to Board HDR 7 POS 3mm Solder ST Thru-Hole Tray