Технічний опис 0475960232 Molex
Description: CONN SOCKET LGA 1155POS GOLD, Packaging: Tray, Features: Open Frame, Mounting Type: Surface Mount, Type: LGA, Number of Positions or Pins (Grid): 1155 (40 x 40), Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.036" (0.91mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.036" (0.91mm), Part Status: Obsolete.
Інші пропозиції 0475960232
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 0475960232 | Виробник : Molex |
 Description: CONN SOCKET LGA 1155POS GOLDPackaging: Tray Features: Open Frame Mounting Type: Surface Mount Type: LGA Number of Positions or Pins (Grid): 1155 (40 x 40) Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.036" (0.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.036" (0.91mm) Part Status: Obsolete |
товару немає в наявності |