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100-040-000 3M

Виробник: 3M
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete

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Технічний опис 100-040-000 3M

Description: CONN IC DIP SOCKET 40POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -65°C ~ 125°C, Number of Positions or Pins (Grid): 40 (2 x 20), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 8.00µin (0.203µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: FLASH, Contact Material - Post: Brass, Part Status: Obsolete.

Інші пропозиції 100-040-000

Фото	Назва	Виробник	Інформація	Доступність	Ціна
	100040000	Виробник : Seeed Technology Co., Ltd	Description: XADOW IMU 9DOF Packaging: Bulk Function: Accelerometer, Gyroscope, Magnetometer Type: Sensor Contents: Board(s) Utilized IC / Part: MPU-9150 Platform: Xadow Part Status: Obsolete	товару немає в наявності	В кошику од. на суму грн.