100075670 Seeed Technology Co., Ltd
Виробник: Seeed Technology Co., Ltd
Description: XIAO ESP32-S3 PLUS EPD CONN EE04
Packaging: Bulk
Mounting Type: Fixed
Function: eInk Electronic ePaper
Type: MPU
Contents: Board(s), Cable(s), Accessories
Core Processor: Xtensa®
Utilized IC / Part: ESP32-S3
Platform: XIAO
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Технічний опис 100075670 Seeed Technology Co., Ltd
Description: XIAO ESP32-S3 PLUS EPD CONN EE04, Packaging: Bulk, Mounting Type: Fixed, Function: eInk Electronic ePaper, Type: MPU, Contents: Board(s), Cable(s), Accessories, Core Processor: Xtensa®, Utilized IC / Part: ESP32-S3, Platform: XIAO.