1109800-20 Aries Electronics
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Programmable
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
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Технічний опис 1109800-20 Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD, Termination: Solder, Number of Positions or Pins (Grid): 20 (2 x 10), Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Programmable, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled.
Інші пропозиції 1109800-20
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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1109800-20 | Виробник : Aries Electronics |
IC & Component Sockets 20P CORRECT/O/CHIP |
товару немає в наявності |