| Кількість | Ціна |
|---|---|
| 3+ | 158.04 грн |
| 10+ | 135.71 грн |
| 25+ | 113.12 грн |
| 42+ | 110.33 грн |
| 84+ | 105.44 грн |
| 252+ | 95.66 грн |
| 504+ | 87.98 грн |
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Технічний опис 116-87-310-41-007101 Preci-dip
Description: CONN IC DIP SOCKET 10POS GOLD, Features: Elevated, Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 10 (2 x 5), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass.
Інші пропозиції 116-87-310-41-007101
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
 |
116-87-310-41-007101 | Preci-Dip |
 Description: CONN IC DIP SOCKET 10POS GOLDFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 2016 шт В кошику од. на суму грн. |
| 116-87-310-41-007101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 2016 шт
В кошику
од. на суму грн.