130-028-000 3M

Description: CONN IC DIP SOCKET 28POS GOLD, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk, Part Status: Obsolete, Contact Material - Post: Brass, Contact Finish Thickness - Post: FLASH, Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 8.00µin (0.203µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 28 (2 x 14), Operating Temperature: -65°C ~ 125°C.