Технічний опис 14-35W000-10 Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3, Board Material: FR4 Epoxy Glass, Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Pitch - Mating: 0.050" (1.27mm), Termination: Solder, Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing, Convert From (Adapter End): SOIC-W, Mounting Type: Through Hole, Number of Pins: 14, Packaging: Bulk.
Інші пропозиції 14-35W000-10
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
14-35W000-10 | Aries Electronics |
 Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3Board Material: FR4 Epoxy Glass Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Pitch - Mating: 0.050" (1.27mm) Termination: Solder Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert From (Adapter End): SOIC-W Mounting Type: Through Hole Number of Pins: 14 Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 144 шт В кошику од. на суму грн. |
| 14-35W000-10 |
|
Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): SOIC-W
Mounting Type: Through Hole
Number of Pins: 14
Packaging: Bulk
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): SOIC-W
Mounting Type: Through Hole
Number of Pins: 14
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 144 шт
В кошику
од. на суму грн.