16-6810-90T Aries Electronics

Description: CONN IC DIP SOCKET 16POS TIN, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Right Angle, Vertical, Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.