Результат пошуку "163518" : 39
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Мінімальне замовлення: 3
В кошику
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Мінімальне замовлення: 102
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Мінімальне замовлення: 4
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Мінімальне замовлення: 5
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Мінімальне замовлення: 24
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Мінімальне замовлення: 4
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Мінімальне замовлення: 2
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Мінімальне замовлення: 51
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Мінімальне замовлення: 21
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Мінімальне замовлення: 27
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Мінімальне замовлення: 55
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Мінімальне замовлення: 29
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Мінімальне замовлення: 27
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Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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08025SA-24N-EA-D0 Код товару: 163518
Додати до обраних
Обраний товар
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товару немає в наявності
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В кошику од. на суму грн. | ||||||||||||||||||
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16-3518-00 | ARIES |
![]() tariffCode: 85369010 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: DIP rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 16Kontakt(e) euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: 518 |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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16-3518-10 | Aries Electronics |
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на замовлення 192 шт: термін постачання 21-31 дні (днів) |
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16-3518-10 | Aries Electronics |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 1304 шт: термін постачання 21-31 дні (днів) |
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16-3518-10 | ARIES |
![]() tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: DIP rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 16Kontakt(e) euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: 518 |
на замовлення 1459 шт: термін постачання 21-31 дні (днів) |
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16-3518-10E | Aries Electronics |
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на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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16-3518-10T | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 426 шт: термін постачання 21-31 дні (днів) |
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16-3518-11 | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 194 шт: термін постачання 21-31 дні (днів) |
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16-3518-11 | Aries Electronics |
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на замовлення 72 шт: термін постачання 21-31 дні (днів) |
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16-3518-112 | Aries Electronics |
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на замовлення 75 шт: термін постачання 21-31 дні (днів) |
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430163-518 | Laird Thermal Systems, Inc. |
![]() Features: Lead Wires, Sealed - Silicone RTV Packaging: Bulk Size / Dimension: Square - 29.70mm L x 29.70mm W Operating Temperature: 80°C Height: 3.81mm Delta Tmax @ Th: 68°C @ 25°C Qmax @ Th: 28.7W @ 25°C Current - Max: 6 A Voltage - Max: 8.1 V Resistance: 1.26 Ohms Number of Stages: 1 |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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90816-3518 | MOLEX |
![]() Description: Connector: wire-board; male; PIN: 18; SMT; for cable; 1.27mm Type of connector: wire-board Kind of connector: male Number of pins: 18 Electrical mounting: SMT Mechanical mounting: for cable Contacts pitch: 1.27mm Contact plating: tinned Spatial orientation: straight Operating temperature: -40...105°C |
на замовлення 5400 шт: термін постачання 21-30 дні (днів) |
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90816-3518 | Molex |
![]() Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 250VAC/DC Current Rating (Amps): 1.2A Mounting Type: Surface Mount Number of Positions: 18 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Blade Fastening Type: Latch Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 HB Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Shape: Rectangular Insulation Height: 0.333" (8.45mm) Shrouding: Shrouded - 2 Wall Insulation Material: Polyphthalamide (PPA), Glass Filled Contact Length - Mating: 0.083" (2.10mm) |
на замовлення 5400 шт: термін постачання 21-31 дні (днів) |
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PSR1635-18 | Parlex USA LLC |
![]() Features: Conductor 1 Tinned Packaging: Spool Jacket (Insulation) Material: Polyester Pitch: 0.100" (2.54mm) Ratings: UL Style 2643 Cable Length: 500' (152.4m) Jacket (Insulation) Thickness: 0.002" (0.05mm) Conductor Material: Copper, Bare Cable Width: 1.90" (48.26mm) Part Status: Active Number of Conductors: 18 |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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BS-31-6 | 3M |
![]() Packaging: Bulk Features: Butted Seam Contact Finish: Tin Mounting Type: Free Hanging (In-Line) Wire Gauge: 18-22 AWG Insulation: Non-Insulated Terminal Type: Standard Stud/Tab Size: 6 Stud Length - Overall: 0.650" (16.50mm) Termination: Crimp Width - Outer Edges: 0.300" (7.62mm) Contact Material: Copper, ETP Part Status: Active |
на замовлення 737 шт: термін постачання 21-31 дні (днів) |
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16-3518-00 | Aries Electronics |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
16-3518-01 | Aries Electronics |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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16-3518-101 | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
16-3518-101H | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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16-3518-102 | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
16-3518-10E | Aries Electronics |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
16-3518-10H | Aries Electronics |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
16-3518-10M | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
16-3518-111 | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
16-3518-112 | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
16-3518-11H | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
0908163518 | Molex |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
90816-3518 | MOLEX |
![]() Description: Connector: wire-board; male; PIN: 18; SMT; for cable; 1.27mm Type of connector: wire-board Kind of connector: male Number of pins: 18 Electrical mounting: SMT Mechanical mounting: for cable Contacts pitch: 1.27mm Contact plating: tinned Spatial orientation: straight Operating temperature: -40...105°C кількість в упаковці: 1 шт |
на замовлення 5400 шт: термін постачання 14-21 дні (днів) |
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PSR1635-18 | Parlex USA LLC |
![]() Features: Conductor 1 Tinned Packaging: Bulk Jacket (Insulation) Material: Polyester Pitch: 0.100" (2.54mm) Ratings: UL Style 2643 Cable Length: 10' (3.05m) Jacket (Insulation) Thickness: 0.002" (0.05mm) Conductor Material: Copper, Bare Cable Width: 1.90" (48.26mm) Number of Conductors: 18 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PSR1635-18 | Parlex USA LLC |
![]() Packaging: Bulk Features: Conductor 1 Tinned Jacket (Insulation) Material: Polyester Pitch: 0.100" (2.54mm) Ratings: UL Style 2643 Cable Length: 250' (76.2m) Jacket (Insulation) Thickness: 0.002" (0.05mm) Conductor Material: Copper, Bare Cable Width: 1.90" (48.26mm) Number of Conductors: 18 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PSR1635-18 | Parlex USA LLC |
![]() Packaging: Bulk Features: Conductor 1 Tinned Jacket (Insulation) Material: Polyester Pitch: 0.100" (2.54mm) Ratings: UL Style 2643 Cable Length: 25' (7.62m) Jacket (Insulation) Thickness: 0.002" (0.05mm) Conductor Material: Copper, Bare Cable Width: 1.90" (48.26mm) Number of Conductors: 18 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PSR1635-18 | Parlex USA LLC |
![]() Packaging: Bulk Features: Conductor 1 Tinned Jacket (Insulation) Material: Polyester Pitch: 0.100" (2.54mm) Ratings: UL Style 2643 Cable Length: 50' (15.24m) Jacket (Insulation) Thickness: 0.002" (0.05mm) Conductor Material: Copper, Bare Cable Width: 1.90" (48.26mm) Number of Conductors: 18 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PSR1635-18 | Parlex USA LLC |
![]() Packaging: Bulk Features: Conductor 1 Tinned Jacket (Insulation) Material: Polyester Pitch: 0.100" (2.54mm) Ratings: UL Style 2643 Cable Length: 5' (1.52m) Jacket (Insulation) Thickness: 0.002" (0.05mm) Conductor Material: Copper, Bare Cable Width: 1.90" (48.26mm) Number of Conductors: 18 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PSR1635-18 | Parlex USA LLC |
![]() Packaging: Bulk Features: Conductor 1 Tinned Jacket (Insulation) Material: Polyester Pitch: 0.100" (2.54mm) Ratings: UL Style 2643 Cable Length: 100' (30.5m) Jacket (Insulation) Thickness: 0.002" (0.05mm) Conductor Material: Copper, Bare Cable Width: 1.90" (48.26mm) Number of Conductors: 18 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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ETIMAT 6 2P D25 | ETI POLAM |
Category: Circuit Breakers Description: Circuit breaker; 230/400VAC; Inom: 25A; Poles: 2; Charact: D; 6kA Operating temperature: -25...55°C Manufacturer series: ETIMAT 6 Type of protection: circuit breaker Number of poles: 2 Trade name: MCB Mounting: for DIN rail mounting Mechanical durability: 20000 cycles Rated voltage: 230/400V AC Current rating: 25A IP rating: IP20 Characteristics: D Cross section of connecting wires: 1...25mm2 Conform to the norm: IEC EN 60898; IEC EN 60947-2 Short circuit breaking capacity: 6kA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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ETIMAT 6 2P D25 | ETI POLAM |
Category: Circuit Breakers Description: Circuit breaker; 230/400VAC; Inom: 25A; Poles: 2; Charact: D; 6kA Operating temperature: -25...55°C Manufacturer series: ETIMAT 6 Type of protection: circuit breaker Number of poles: 2 Trade name: MCB Mounting: for DIN rail mounting Mechanical durability: 20000 cycles Rated voltage: 230/400V AC Current rating: 25A IP rating: IP20 Characteristics: D Cross section of connecting wires: 1...25mm2 Conform to the norm: IEC EN 60898; IEC EN 60947-2 Short circuit breaking capacity: 6kA кількість в упаковці: 1 шт |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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HEDS-9140-B00 | Broadcom Limited |
![]() Packaging: Bulk Output Type: Quadrature with Index (Incremental) Mounting Type: Chassis Mount Orientation: Vertical Termination Style: Terminal Pins Voltage - Supply: 5V Encoder Type: Optical Detent: No Pulses per Revolution: 1000 Actuator Type: Codewheel Not Included Built in Switch: No Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCIMX353DJQ5CR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCZ33903DD3EKR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SSOP-EP |
товару немає в наявності |
В кошику од. на суму грн. |
08025SA-24N-EA-D0 Код товару: 163518
Додати до обраних
Обраний товар
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товару немає в наявності
В кошику
од. на суму грн.
16-3518-00 |
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Виробник: ARIES
Description: ARIES - 16-3518-00 - IC- & Baustein-Sockel, 16 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85369010
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: DIP
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 16Kontakt(e)
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: 518
Description: ARIES - 16-3518-00 - IC- & Baustein-Sockel, 16 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85369010
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: DIP
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 16Kontakt(e)
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: 518
на замовлення 6 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 390.74 грн |
16-3518-10 |
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Виробник: Aries Electronics
Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole
Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole
на замовлення 192 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
102+ | 120.26 грн |
16-3518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 1304 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
4+ | 103.62 грн |
24+ | 79.75 грн |
48+ | 75.94 грн |
72+ | 69.26 грн |
120+ | 66.81 грн |
264+ | 63.19 грн |
504+ | 59.38 грн |
1008+ | 56.54 грн |
16-3518-10 |
![]() |
Виробник: ARIES
Description: ARIES - 16-3518-10 - IC- & Baustein-Sockel, 16 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: DIP
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 16Kontakt(e)
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: 518
Description: ARIES - 16-3518-10 - IC- & Baustein-Sockel, 16 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: DIP
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 16Kontakt(e)
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: 518
на замовлення 1459 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
5+ | 196.18 грн |
10+ | 161.99 грн |
100+ | 120.48 грн |
500+ | 92.22 грн |
1000+ | 78.15 грн |
16-3518-10E |
![]() |
Виробник: Aries Electronics
Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole
Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole
на замовлення 24 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
24+ | 507.39 грн |
16-3518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 426 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
4+ | 98.91 грн |
24+ | 76.03 грн |
48+ | 72.41 грн |
72+ | 66.03 грн |
120+ | 63.70 грн |
264+ | 60.24 грн |
16-3518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 194 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 206.45 грн |
24+ | 158.46 грн |
48+ | 150.86 грн |
72+ | 137.58 грн |
120+ | 132.71 грн |
16-3518-11 |
![]() |
Виробник: Aries Electronics
Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole
Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole
на замовлення 72 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
51+ | 241.57 грн |
16-3518-112 |
![]() |
Виробник: Aries Electronics
16-3518-112
16-3518-112
на замовлення 75 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
21+ | 581.23 грн |
50+ | 477.86 грн |
430163-518 |
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Виробник: Laird Thermal Systems, Inc.
Description: CP14-71-06-L2-RT-W4.5
Features: Lead Wires, Sealed - Silicone RTV
Packaging: Bulk
Size / Dimension: Square - 29.70mm L x 29.70mm W
Operating Temperature: 80°C
Height: 3.81mm
Delta Tmax @ Th: 68°C @ 25°C
Qmax @ Th: 28.7W @ 25°C
Current - Max: 6 A
Voltage - Max: 8.1 V
Resistance: 1.26 Ohms
Number of Stages: 1
Description: CP14-71-06-L2-RT-W4.5
Features: Lead Wires, Sealed - Silicone RTV
Packaging: Bulk
Size / Dimension: Square - 29.70mm L x 29.70mm W
Operating Temperature: 80°C
Height: 3.81mm
Delta Tmax @ Th: 68°C @ 25°C
Qmax @ Th: 28.7W @ 25°C
Current - Max: 6 A
Voltage - Max: 8.1 V
Resistance: 1.26 Ohms
Number of Stages: 1
на замовлення 18 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2061.34 грн |
5+ | 1864.80 грн |
90816-3518 |
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Виробник: MOLEX
Category: IDC picoflex connectors 1,27mm
Description: Connector: wire-board; male; PIN: 18; SMT; for cable; 1.27mm
Type of connector: wire-board
Kind of connector: male
Number of pins: 18
Electrical mounting: SMT
Mechanical mounting: for cable
Contacts pitch: 1.27mm
Contact plating: tinned
Spatial orientation: straight
Operating temperature: -40...105°C
Category: IDC picoflex connectors 1,27mm
Description: Connector: wire-board; male; PIN: 18; SMT; for cable; 1.27mm
Type of connector: wire-board
Kind of connector: male
Number of pins: 18
Electrical mounting: SMT
Mechanical mounting: for cable
Contacts pitch: 1.27mm
Contact plating: tinned
Spatial orientation: straight
Operating temperature: -40...105°C
на замовлення 5400 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна |
---|---|
27+ | 232.00 грн |
150+ | 189.73 грн |
300+ | 186.71 грн |
550+ | 183.68 грн |
1800+ | 167.05 грн |
5000+ | 151.18 грн |
90816-3518 |
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Виробник: Molex
Description: 18CKT PICOFLEX SMT LATCHED HDR
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 250VAC/DC
Current Rating (Amps): 1.2A
Mounting Type: Surface Mount
Number of Positions: 18
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Blade
Fastening Type: Latch Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 HB
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Rectangular
Insulation Height: 0.333" (8.45mm)
Shrouding: Shrouded - 2 Wall
Insulation Material: Polyphthalamide (PPA), Glass Filled
Contact Length - Mating: 0.083" (2.10mm)
Description: 18CKT PICOFLEX SMT LATCHED HDR
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 250VAC/DC
Current Rating (Amps): 1.2A
Mounting Type: Surface Mount
Number of Positions: 18
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Blade
Fastening Type: Latch Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 HB
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Rectangular
Insulation Height: 0.333" (8.45mm)
Shrouding: Shrouded - 2 Wall
Insulation Material: Polyphthalamide (PPA), Glass Filled
Contact Length - Mating: 0.083" (2.10mm)
на замовлення 5400 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
55+ | 207.05 грн |
165+ | 194.72 грн |
330+ | 191.40 грн |
550+ | 177.13 грн |
1815+ | 160.91 грн |
5005+ | 145.94 грн |
PSR1635-18 |
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Виробник: Parlex USA LLC
Description: CABLE FLAT FLEX 18COND 0.100"
Features: Conductor 1 Tinned
Packaging: Spool
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 500' (152.4m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Part Status: Active
Number of Conductors: 18
Description: CABLE FLAT FLEX 18COND 0.100"
Features: Conductor 1 Tinned
Packaging: Spool
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 500' (152.4m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Part Status: Active
Number of Conductors: 18
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 49838.65 грн |
2+ | 44186.82 грн |
3+ | 42107.35 грн |
BS-31-6 |
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Виробник: 3M
Description: CONN SPADE TERM 18-22AWG #6
Packaging: Bulk
Features: Butted Seam
Contact Finish: Tin
Mounting Type: Free Hanging (In-Line)
Wire Gauge: 18-22 AWG
Insulation: Non-Insulated
Terminal Type: Standard
Stud/Tab Size: 6 Stud
Length - Overall: 0.650" (16.50mm)
Termination: Crimp
Width - Outer Edges: 0.300" (7.62mm)
Contact Material: Copper, ETP
Part Status: Active
Description: CONN SPADE TERM 18-22AWG #6
Packaging: Bulk
Features: Butted Seam
Contact Finish: Tin
Mounting Type: Free Hanging (In-Line)
Wire Gauge: 18-22 AWG
Insulation: Non-Insulated
Terminal Type: Standard
Stud/Tab Size: 6 Stud
Length - Overall: 0.650" (16.50mm)
Termination: Crimp
Width - Outer Edges: 0.300" (7.62mm)
Contact Material: Copper, ETP
Part Status: Active
на замовлення 737 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
29+ | 10.99 грн |
34+ | 9.07 грн |
36+ | 8.50 грн |
50+ | 7.60 грн |
100+ | 7.25 грн |
250+ | 6.79 грн |
500+ | 6.36 грн |
16-3518-00 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
16-3518-01 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
16-3518-101 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
16-3518-101H |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
16-3518-102 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
16-3518-10E |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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16-3518-10H |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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16-3518-10M |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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16-3518-111 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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16-3518-112 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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16-3518-11H |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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90816-3518 |
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Виробник: MOLEX
Category: IDC picoflex connectors 1,27mm
Description: Connector: wire-board; male; PIN: 18; SMT; for cable; 1.27mm
Type of connector: wire-board
Kind of connector: male
Number of pins: 18
Electrical mounting: SMT
Mechanical mounting: for cable
Contacts pitch: 1.27mm
Contact plating: tinned
Spatial orientation: straight
Operating temperature: -40...105°C
кількість в упаковці: 1 шт
Category: IDC picoflex connectors 1,27mm
Description: Connector: wire-board; male; PIN: 18; SMT; for cable; 1.27mm
Type of connector: wire-board
Kind of connector: male
Number of pins: 18
Electrical mounting: SMT
Mechanical mounting: for cable
Contacts pitch: 1.27mm
Contact plating: tinned
Spatial orientation: straight
Operating temperature: -40...105°C
кількість в упаковці: 1 шт
на замовлення 5400 шт:
термін постачання 14-21 дні (днів)Кількість | Ціна |
---|---|
27+ | 278.40 грн |
150+ | 236.43 грн |
300+ | 224.05 грн |
550+ | 220.42 грн |
1800+ | 200.46 грн |
5000+ | 181.42 грн |
PSR1635-18 |
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Виробник: Parlex USA LLC
Description: CABLE FLAT FLEX 18COND 0.100"
Features: Conductor 1 Tinned
Packaging: Bulk
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 10' (3.05m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
Description: CABLE FLAT FLEX 18COND 0.100"
Features: Conductor 1 Tinned
Packaging: Bulk
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 10' (3.05m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
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PSR1635-18 |
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Виробник: Parlex USA LLC
Description: CABLE FLAT FLEX 18COND 0.100"
Packaging: Bulk
Features: Conductor 1 Tinned
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 250' (76.2m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
Description: CABLE FLAT FLEX 18COND 0.100"
Packaging: Bulk
Features: Conductor 1 Tinned
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 250' (76.2m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
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PSR1635-18 |
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Виробник: Parlex USA LLC
Description: CABLE FLAT FLEX 18COND 0.100"
Packaging: Bulk
Features: Conductor 1 Tinned
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 25' (7.62m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
Description: CABLE FLAT FLEX 18COND 0.100"
Packaging: Bulk
Features: Conductor 1 Tinned
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 25' (7.62m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
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PSR1635-18 |
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Виробник: Parlex USA LLC
Description: CABLE FLAT FLEX 18COND 0.100"
Packaging: Bulk
Features: Conductor 1 Tinned
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 50' (15.24m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
Description: CABLE FLAT FLEX 18COND 0.100"
Packaging: Bulk
Features: Conductor 1 Tinned
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 50' (15.24m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
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PSR1635-18 |
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Виробник: Parlex USA LLC
Description: CABLE FLAT FLEX 18COND 0.100"
Packaging: Bulk
Features: Conductor 1 Tinned
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 5' (1.52m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
Description: CABLE FLAT FLEX 18COND 0.100"
Packaging: Bulk
Features: Conductor 1 Tinned
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 5' (1.52m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
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PSR1635-18 |
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Виробник: Parlex USA LLC
Description: CABLE FLAT FLEX 18COND 0.100"
Packaging: Bulk
Features: Conductor 1 Tinned
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 100' (30.5m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
Description: CABLE FLAT FLEX 18COND 0.100"
Packaging: Bulk
Features: Conductor 1 Tinned
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 100' (30.5m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
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ETIMAT 6 2P D25 |
Виробник: ETI POLAM
Category: Circuit Breakers
Description: Circuit breaker; 230/400VAC; Inom: 25A; Poles: 2; Charact: D; 6kA
Operating temperature: -25...55°C
Manufacturer series: ETIMAT 6
Type of protection: circuit breaker
Number of poles: 2
Trade name: MCB
Mounting: for DIN rail mounting
Mechanical durability: 20000 cycles
Rated voltage: 230/400V AC
Current rating: 25A
IP rating: IP20
Characteristics: D
Cross section of connecting wires: 1...25mm2
Conform to the norm: IEC EN 60898; IEC EN 60947-2
Short circuit breaking capacity: 6kA
Category: Circuit Breakers
Description: Circuit breaker; 230/400VAC; Inom: 25A; Poles: 2; Charact: D; 6kA
Operating temperature: -25...55°C
Manufacturer series: ETIMAT 6
Type of protection: circuit breaker
Number of poles: 2
Trade name: MCB
Mounting: for DIN rail mounting
Mechanical durability: 20000 cycles
Rated voltage: 230/400V AC
Current rating: 25A
IP rating: IP20
Characteristics: D
Cross section of connecting wires: 1...25mm2
Conform to the norm: IEC EN 60898; IEC EN 60947-2
Short circuit breaking capacity: 6kA
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ETIMAT 6 2P D25 |
Виробник: ETI POLAM
Category: Circuit Breakers
Description: Circuit breaker; 230/400VAC; Inom: 25A; Poles: 2; Charact: D; 6kA
Operating temperature: -25...55°C
Manufacturer series: ETIMAT 6
Type of protection: circuit breaker
Number of poles: 2
Trade name: MCB
Mounting: for DIN rail mounting
Mechanical durability: 20000 cycles
Rated voltage: 230/400V AC
Current rating: 25A
IP rating: IP20
Characteristics: D
Cross section of connecting wires: 1...25mm2
Conform to the norm: IEC EN 60898; IEC EN 60947-2
Short circuit breaking capacity: 6kA
кількість в упаковці: 1 шт
Category: Circuit Breakers
Description: Circuit breaker; 230/400VAC; Inom: 25A; Poles: 2; Charact: D; 6kA
Operating temperature: -25...55°C
Manufacturer series: ETIMAT 6
Type of protection: circuit breaker
Number of poles: 2
Trade name: MCB
Mounting: for DIN rail mounting
Mechanical durability: 20000 cycles
Rated voltage: 230/400V AC
Current rating: 25A
IP rating: IP20
Characteristics: D
Cross section of connecting wires: 1...25mm2
Conform to the norm: IEC EN 60898; IEC EN 60947-2
Short circuit breaking capacity: 6kA
кількість в упаковці: 1 шт
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HEDS-9140-B00 |
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Виробник: Broadcom Limited
Description: ROTARY ENCODER OPTICAL 1000PPR
Packaging: Bulk
Output Type: Quadrature with Index (Incremental)
Mounting Type: Chassis Mount
Orientation: Vertical
Termination Style: Terminal Pins
Voltage - Supply: 5V
Encoder Type: Optical
Detent: No
Pulses per Revolution: 1000
Actuator Type: Codewheel Not Included
Built in Switch: No
Part Status: Active
DigiKey Programmable: Not Verified
Description: ROTARY ENCODER OPTICAL 1000PPR
Packaging: Bulk
Output Type: Quadrature with Index (Incremental)
Mounting Type: Chassis Mount
Orientation: Vertical
Termination Style: Terminal Pins
Voltage - Supply: 5V
Encoder Type: Optical
Detent: No
Pulses per Revolution: 1000
Actuator Type: Codewheel Not Included
Built in Switch: No
Part Status: Active
DigiKey Programmable: Not Verified
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MCIMX353DJQ5CR2 |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
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MCZ33903DD3EKR2 |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
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