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18-350000-10-HT Aries Electronics

18005-high-temp-soic-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: DIP to DIP
Package Accepted: SOIC
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Технічний опис 18-350000-10-HT Aries Electronics

Description: SOCKET ADAPTER SOIC TO 18DIP 0.3, Packaging: Bulk, Material: FR4 Epoxy Glass, Number of Positions: 18, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm), Proto Board Type: DIP to DIP, Package Accepted: SOIC.