Модульні елементи > Конструктори, набори для збирання електронних пристроїв

Виробник: Samtec Inc.
Description: CONN BRD STACK 2.00 26POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 20.0µin (0.51µm)
Number of Rows: 2
Number of Positions: 26
Length - Overall Pin: 0.535" (13.589mm)
Length - Post (Mating): 0.213" (5.410mm)
Length - Stack Height: 0.197" (5.004mm)
Length - Tail: 0.125" (3.175mm)

Виробник: Nexperia USA Inc.
Description: IC MF CFG 1-CIR 3-IN 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Schmitt Trigger Input: Yes
Supplier Device Package: 6-TSSOP
Part Status: Active
Number of Circuits: 1

Виробник: Nexperia USA Inc.
Description: IC MF CFG 1-CIR 3-IN 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Schmitt Trigger Input: Yes
Supplier Device Package: 6-TSSOP
Part Status: Active
Number of Circuits: 1

Виробник: Littelfuse Inc.
Description: FUSE GLASS 2.5A 250VAC 5X20MM
Packaging: Bulk
Package / Case: 5mm x 20mm
Size / Dimension: 0.205" Dia x 0.787" L (5.20mm x 20.00mm)
Fuse Type: Cartridge, Glass
Mounting Type: Requires Holder
Operating Temperature: -25°C ~ 70°C
Response Time: Medium Blow
Approval Agency: cUL, METI, UL
Breaking Capacity @ Rated Voltage: 100A
Current Rating (Amps): 2.5 A
Voltage Rating - AC: 250 V
Melting I²t: 10.0

Виробник: Nexperia USA Inc.
Description: IC GATE NAND 2CH 2-INP 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 8-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 2
Current - Quiescent (Max): 1 µA

Виробник: 3M
Description: CONN HEADER VERT 25POS 2.54MM
Packaging: Bulk
Connector Type: Header, Breakaway
Current Rating (Amps): 2.5A
Mounting Type: Through Hole
Number of Positions: 25
Number of Rows: 1
Style: Board to Board
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Shape: Square
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.528" (13.42mm)
Insulation Material: Polybutylene Terephthalate (PBT), Polyester, Glass Filled
Contact Length - Mating: 0.318" (8.08mm)