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1SG211HN3F43I3XG

1SG211HN3F43I3XG Intel

10_GX_SX_Device_Overview.pdf
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
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Технічний опис 1SG211HN3F43I3XG Intel

Description: IC FPGA 688 I/O 1760FBGA, Operating Temperature: -40°C ~ 100°C (TJ), Mounting Type: Surface Mount, Package / Case: 1760-BBGA, FCBGA, Packaging: Tray, DigiKey Programmable: Not Verified, Number of I/O: 688, Number of LABs/CLBs: 263750, Supplier Device Package: 1760-FBGA (42.5x42.5), Number of Logic Elements/Cells: 2110000, Voltage - Supply: 0.82V ~ 0.88V.