Технічний опис 2-382189-1 TE Connectivity
Description: CONN IC DIP SOCKET 32POS TIN, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Beryllium Copper, Part Status: Obsolete.
Інші пропозиції 2-382189-1
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
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2-382189-1 | Виробник : TE Connectivity AMP Connectors |
 Description: CONN IC DIP SOCKET 32POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper Part Status: Obsolete |
товар відсутній |