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2-640361-4

2-640361-4 TE Connectivity

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Виробник: TE Connectivity
Conn DIP Socket SKT 24 POS 2.54mm Solder ST Thru-Hole Tube
на замовлення 282 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна
133+106.78 грн
Мінімальне замовлення: 133 шт
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Технічний опис 2-640361-4 TE Connectivity

Description: CONN IC DIP SOCKET 24POS GOLD, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 15.0µin (0.38µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Thermoplastic, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Tube.

Інші пропозиції 2-640361-4

Фото Назва Виробник Інформація Доступність Ціна
2-640361-4 2-640361-4 TE Connectivity AMP Connectors DDEController?Action=srchrtrv&DocNm=640361&DocType=Customer+Drawing&DocLang=English Description: CONN IC DIP SOCKET 24POS GOLD
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
товару немає в наявності
В кошику  од. на суму  грн.
2-640361-4 DDEController?Action=srchrtrv&DocNm=640361&DocType=Customer+Drawing&DocLang=English
2-640361-4
Виробник: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 24POS GOLD
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
товару немає в наявності
В кошику  од. на суму  грн.