200-6310-9UN-1900 3M
Виробник: 3M
Description: CONN SOCKET PGA ZIF 100POS GOLD
Part Status: Obsolete
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Termination: Solder
Number of Positions or Pins (Grid): 100 (10 x 10)
Operating Temperature: -55°C ~ 150°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Packaging: Bulk
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyethersulfone (PES)
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Технічний опис 200-6310-9UN-1900 3M
Description: CONN SOCKET PGA ZIF 100POS GOLD, Part Status: Obsolete, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Termination: Solder, Number of Positions or Pins (Grid): 100 (10 x 10), Operating Temperature: -55°C ~ 150°C, Type: PGA, ZIF (ZIP), Mounting Type: Through Hole, Packaging: Bulk, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyethersulfone (PES).
Інші пропозиції 200-6310-9UN-1900
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
200-6310-9UN-1900 | 3M Electronic Solutions Division |
IC & Component Sockets 10X10 SKT KIT WITHOUT CONTACTS |
товару немає в наявності |
В кошику од. на суму грн. |
| 200-6310-9UN-1900 |
|
Виробник: 3M Electronic Solutions Division
IC & Component Sockets 10X10 SKT KIT WITHOUT CONTACTS
IC & Component Sockets 10X10 SKT KIT WITHOUT CONTACTS
товару немає в наявності
В кошику
од. на суму грн.