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200-6311-9UN-1900

200-6311-9UN-1900 3M Electronic Solutions Division

13be68ba59ff4982c06445727b2376fc096f1057-2951101.pdf
Виробник: 3M Electronic Solutions Division
IC & Component Sockets 11X11 SKT KIT WITHOUT CONTACTS
на замовлення 20 шт:
термін постачання 21-30 дні (днів)
Кількість Ціна
1+4419.03 грн
5+4227.31 грн
10+3564.10 грн
20+3452.99 грн
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Технічний опис 200-6311-9UN-1900 3M Electronic Solutions Division

Description: CONN SOCKET PGA ZIF 121POS GOLD, Part Status: Obsolete, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyethersulfone (PES), Termination: Solder, Number of Positions or Pins (Grid): 121 (11 x 11), Operating Temperature: -55°C ~ 150°C, Type: PGA, ZIF (ZIP), Mounting Type: Through Hole, Packaging: Bulk.

Інші пропозиції 200-6311-9UN-1900

Фото Назва Виробник Інформація Доступність
Ціна
200-6311-9UN-1900 200-6311-9UN-1900 3M 3mtm-textool-tm-pga-test-and-burn-in-kit-socket-ts0675.pdf Description: CONN SOCKET PGA ZIF 121POS GOLD
Part Status: Obsolete
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyethersulfone (PES)
Termination: Solder
Number of Positions or Pins (Grid): 121 (11 x 11)
Operating Temperature: -55°C ~ 150°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
200-6311-9UN-1900 3mtm-textool-tm-pga-test-and-burn-in-kit-socket-ts0675.pdf
200-6311-9UN-1900
Виробник: 3M
Description: CONN SOCKET PGA ZIF 121POS GOLD
Part Status: Obsolete
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyethersulfone (PES)
Termination: Solder
Number of Positions or Pins (Grid): 121 (11 x 11)
Operating Temperature: -55°C ~ 150°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.