
на замовлення 2686 шт:
термін постачання 21-30 дні (днів)
Кількість | Ціна |
---|---|
4+ | 87.55 грн |
10+ | 70.98 грн |
100+ | 51.42 грн |
500+ | 46.27 грн |
1000+ | 41.20 грн |
2500+ | 37.30 грн |
5000+ | 34.28 грн |
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Технічний опис 203560-0303 Molex
Description: CONN HEADER SMD 3POS 1MM, Packaging: Tape & Reel (TR), Features: Pick and Place, Solder Retention, Connector Type: Header, Voltage Rating: 50V, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 3, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Gold, Contact Shape: Rectangular, Insulation Height: 0.213" (5.40mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon.
Інші пропозиції 203560-0303
Фото | Назва | Виробник | Інформація |
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203560-0303 | Виробник : Molex |
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товару немає в наявності |
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2035600303 | Виробник : Molex |
![]() Packaging: Tape & Reel (TR) Features: Pick and Place, Solder Retention Connector Type: Header Voltage Rating: 50V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 3 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Gold Contact Shape: Rectangular Insulation Height: 0.213" (5.40mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon |
товару немає в наявності |