Результат пошуку "211480" : > 60
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Мінімальне замовлення: 2
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Мінімальне замовлення: 5
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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3211480 | Phoenix Contact | DIN Rail Terminal Blocks PTTB 2.5-2BE |
на замовлення 134 шт: термін постачання 21-30 дні (днів) |
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3211480 | Phoenix Contact |
Description: CONN TERM BLK FEED THRU 12-26AWG Packaging: Bulk Color: Gray Type: Feed Through, Isolated Termination Style: Push In, Spring Number of Levels: 2 Terminal - Width: 5.2mm Voltage - IEC: 500V Wire Gauge or Range - AWG: 12-26 AWG Wire Gauge or Range - mm²: 0.14-4mm² Part Status: Active Current - IEC: 22 A Number of Positions: 4 |
на замовлення 561 шт: термін постачання 21-31 дні (днів) |
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3302-1-14-01-00-00-08-0 | Mill-Max | Circuit Board Hardware - PCB 200u SN/PB OVER NI |
на замовлення 196 шт: термін постачання 21-30 дні (днів) |
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211480-000 | TE Connectivity | Connector Terminals Solder Sleeve Shield Termination |
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21148083 | Laird Performance Materials | EMI Gaskets, Sheets, Absorbers & Shielding MF500-117 1.5X12X12 |
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21148085 | Laird Performance Materials | EMI Gaskets, Sheets, Absorbers & Shielding MF500-117 1.5X1.5X12 |
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032-1148-00 | Honeywell Sensing and Productivity Solutions |
Description: MOUNTING BLOCK FOR DISPLACEMENT Packaging: Bulk |
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3302-1-14-80-00-00-08-0 | Mill-Max | Circuit Board Hardware - PCB 200u SN OVER NI |
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3302-1-14-80-00-00-08-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC Packaging: Bulk Contact Finish: Tin Mounting Type: Through Hole, Right Angle Insulation: Non-Insulated Board Thickness: 0.031" (0.79mm) Terminal Type: PC Pin Flange Diameter: 0.070" (1.78mm) Termination: Swage Mounting Hole Diameter: 0.043" (1.09mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Terminal Style: Single End Pin Size - Above Flange: 0.040" (1.02mm) Dia Length - Below Flange: 0.051" (1.30mm) |
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605-41-322-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Features: Carrier, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-41-322-11-480000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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605-41-422-11-480000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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605-41-422-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-41-432-11-480000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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605-41-432-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-41-632-11-480000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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605-41-632-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-41-642-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-41-642-11-480000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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605-41-652-11-480000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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605-41-652-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 52 (2 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-41-952-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 52 (2 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-41-952-11-480000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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605-43-322-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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605-43-322-11-480000 | Mill-Max | IC & Component Sockets 200u SN over 100u NI 22P |
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605-43-422-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-43-422-11-480000 | Mill-Max | IC & Component Sockets 200u SN over 100u NI 22P |
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605-43-432-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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605-43-432-11-480000 | Mill-Max | IC & Component Sockets 200u SN over 100u NI 32P |
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605-43-632-11-480000 | Mill-Max | IC & Component Sockets 200u SN over 100u NI 32P |
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605-43-632-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-43-642-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-43-642-11-480000 | Mill-Max | IC & Component Sockets 200u SN over 100u NI 42P |
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605-43-652-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 52 (2 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-43-652-11-480000 | Mill-Max | IC & Component Sockets 200u SN over 100u NI 52P |
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605-43-952-11-480000 | Mill-Max | IC & Component Sockets 200u SN over 100u NI 52P |
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605-43-952-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 52 (2 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-91-322-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Features: Carrier, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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605-91-322-11-480000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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605-91-422-11-480000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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605-91-422-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Features: Carrier, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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605-91-432-11-480000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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605-91-432-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Features: Carrier, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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605-91-632-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-91-632-11-480000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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605-91-642-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-91-642-11-480000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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605-91-652-11-480000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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605-91-652-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 52 (2 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-91-952-11-480000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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605-91-952-11-480000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER LOWPRO Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 52 (2 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-93-322-11-480000 | Mill-Max | IC & Component Sockets 200u SN/PB over 100u" NI 22P |
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605-93-322-11-480000 | Mill-Max Manufacturing Corp. |
Description: SOCKET CARRIER LOWPRO .300 22POS Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-93-422-11-480000 | Mill-Max Manufacturing Corp. |
Description: SOCKET CARRIER LOWPRO .400 22POS Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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605-93-422-11-480000 | Mill-Max | IC & Component Sockets 200u SN/PB over 100u" NI 22P |
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605-93-432-11-480000 | Mill-Max | IC & Component Sockets 200u SN/PB over 100u" NI 32P |
товар відсутній |
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605-93-432-11-480000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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605-93-632-11-480000 | Mill-Max Manufacturing Corp. |
Description: SOCKET CARRIER LOWPRO .600 32POS Features: Carrier, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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605-93-632-11-480000 | Mill-Max | IC & Component Sockets 200u SN/PB over 100u" NI 32P |
товар відсутній |
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605-93-642-11-480000 | Mill-Max | IC & Component Sockets 200u SN/PB over 100u" NI 42P |
товар відсутній |
3211480 |
Виробник: Phoenix Contact
DIN Rail Terminal Blocks PTTB 2.5-2BE
DIN Rail Terminal Blocks PTTB 2.5-2BE
на замовлення 134 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 309.18 грн |
10+ | 288.09 грн |
25+ | 240.86 грн |
50+ | 224.98 грн |
100+ | 222.22 грн |
250+ | 201.52 грн |
500+ | 195.31 грн |
3211480 |
Виробник: Phoenix Contact
Description: CONN TERM BLK FEED THRU 12-26AWG
Packaging: Bulk
Color: Gray
Type: Feed Through, Isolated
Termination Style: Push In, Spring
Number of Levels: 2
Terminal - Width: 5.2mm
Voltage - IEC: 500V
Wire Gauge or Range - AWG: 12-26 AWG
Wire Gauge or Range - mm²: 0.14-4mm²
Part Status: Active
Current - IEC: 22 A
Number of Positions: 4
Description: CONN TERM BLK FEED THRU 12-26AWG
Packaging: Bulk
Color: Gray
Type: Feed Through, Isolated
Termination Style: Push In, Spring
Number of Levels: 2
Terminal - Width: 5.2mm
Voltage - IEC: 500V
Wire Gauge or Range - AWG: 12-26 AWG
Wire Gauge or Range - mm²: 0.14-4mm²
Part Status: Active
Current - IEC: 22 A
Number of Positions: 4
на замовлення 561 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 243.37 грн |
10+ | 227.6 грн |
50+ | 212.73 грн |
100+ | 183.67 грн |
250+ | 169.7 грн |
500+ | 161.71 грн |
3302-1-14-01-00-00-08-0 |
Виробник: Mill-Max
Circuit Board Hardware - PCB 200u SN/PB OVER NI
Circuit Board Hardware - PCB 200u SN/PB OVER NI
на замовлення 196 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5+ | 69.65 грн |
10+ | 58.33 грн |
100+ | 45.48 грн |
500+ | 40.92 грн |
1000+ | 33.06 грн |
2000+ | 28.92 грн |
10000+ | 26.92 грн |
211480-000 |
Виробник: TE Connectivity
Connector Terminals Solder Sleeve Shield Termination
Connector Terminals Solder Sleeve Shield Termination
товар відсутній
21148083 |
Виробник: Laird Performance Materials
EMI Gaskets, Sheets, Absorbers & Shielding MF500-117 1.5X12X12
EMI Gaskets, Sheets, Absorbers & Shielding MF500-117 1.5X12X12
товар відсутній
21148085 |
Виробник: Laird Performance Materials
EMI Gaskets, Sheets, Absorbers & Shielding MF500-117 1.5X1.5X12
EMI Gaskets, Sheets, Absorbers & Shielding MF500-117 1.5X1.5X12
товар відсутній
032-1148-00 |
Виробник: Honeywell Sensing and Productivity Solutions
Description: MOUNTING BLOCK FOR DISPLACEMENT
Packaging: Bulk
Description: MOUNTING BLOCK FOR DISPLACEMENT
Packaging: Bulk
товар відсутній
3302-1-14-80-00-00-08-0 |
Виробник: Mill-Max
Circuit Board Hardware - PCB 200u SN OVER NI
Circuit Board Hardware - PCB 200u SN OVER NI
товар відсутній
3302-1-14-80-00-00-08-0 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole, Right Angle
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: PC Pin
Flange Diameter: 0.070" (1.78mm)
Termination: Swage
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.040" (1.02mm) Dia
Length - Below Flange: 0.051" (1.30mm)
Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole, Right Angle
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: PC Pin
Flange Diameter: 0.070" (1.78mm)
Termination: Swage
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.040" (1.02mm) Dia
Length - Below Flange: 0.051" (1.30mm)
товар відсутній
605-41-322-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-41-322-11-480000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
605-41-422-11-480000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
605-41-422-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-41-432-11-480000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
605-41-432-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-41-632-11-480000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
605-41-632-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-41-642-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-41-642-11-480000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
605-41-652-11-480000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
605-41-652-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-41-952-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-41-952-11-480000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
605-43-322-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
605-43-322-11-480000 |
Виробник: Mill-Max
IC & Component Sockets 200u SN over 100u NI 22P
IC & Component Sockets 200u SN over 100u NI 22P
товар відсутній
605-43-422-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-43-422-11-480000 |
Виробник: Mill-Max
IC & Component Sockets 200u SN over 100u NI 22P
IC & Component Sockets 200u SN over 100u NI 22P
товар відсутній
605-43-432-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
605-43-432-11-480000 |
Виробник: Mill-Max
IC & Component Sockets 200u SN over 100u NI 32P
IC & Component Sockets 200u SN over 100u NI 32P
товар відсутній
605-43-632-11-480000 |
Виробник: Mill-Max
IC & Component Sockets 200u SN over 100u NI 32P
IC & Component Sockets 200u SN over 100u NI 32P
товар відсутній
605-43-632-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-43-642-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-43-642-11-480000 |
Виробник: Mill-Max
IC & Component Sockets 200u SN over 100u NI 42P
IC & Component Sockets 200u SN over 100u NI 42P
товар відсутній
605-43-652-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-43-652-11-480000 |
Виробник: Mill-Max
IC & Component Sockets 200u SN over 100u NI 52P
IC & Component Sockets 200u SN over 100u NI 52P
товар відсутній
605-43-952-11-480000 |
Виробник: Mill-Max
IC & Component Sockets 200u SN over 100u NI 52P
IC & Component Sockets 200u SN over 100u NI 52P
товар відсутній
605-43-952-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-91-322-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER LOWPRO
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
605-91-322-11-480000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
605-91-422-11-480000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
605-91-422-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER LOWPRO
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
605-91-432-11-480000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
605-91-432-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER LOWPRO
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
605-91-632-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-91-632-11-480000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
605-91-642-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-91-642-11-480000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
605-91-652-11-480000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
605-91-652-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-91-952-11-480000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
605-91-952-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER LOWPRO
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-93-322-11-480000 |
Виробник: Mill-Max
IC & Component Sockets 200u SN/PB over 100u" NI 22P
IC & Component Sockets 200u SN/PB over 100u" NI 22P
товар відсутній
605-93-322-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SOCKET CARRIER LOWPRO .300 22POS
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SOCKET CARRIER LOWPRO .300 22POS
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-93-422-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SOCKET CARRIER LOWPRO .400 22POS
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SOCKET CARRIER LOWPRO .400 22POS
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-93-422-11-480000 |
Виробник: Mill-Max
IC & Component Sockets 200u SN/PB over 100u" NI 22P
IC & Component Sockets 200u SN/PB over 100u" NI 22P
товар відсутній
605-93-432-11-480000 |
Виробник: Mill-Max
IC & Component Sockets 200u SN/PB over 100u" NI 32P
IC & Component Sockets 200u SN/PB over 100u" NI 32P
товар відсутній
605-93-432-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-93-632-11-480000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SOCKET CARRIER LOWPRO .600 32POS
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SOCKET CARRIER LOWPRO .600 32POS
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
605-93-632-11-480000 |
Виробник: Mill-Max
IC & Component Sockets 200u SN/PB over 100u" NI 32P
IC & Component Sockets 200u SN/PB over 100u" NI 32P
товар відсутній
605-93-642-11-480000 |
Виробник: Mill-Max
IC & Component Sockets 200u SN/PB over 100u" NI 42P
IC & Component Sockets 200u SN/PB over 100u" NI 42P
товар відсутній
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