2124-6313-9UA-1902 3M

Description: TEST BURN-IN PGA, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyethersulfone (PES), Termination: Solder, Number of Positions or Pins (Grid): 124 (13 x 13), Operating Temperature: -55°C ~ 150°C, Type: PGA, ZIF (ZIP), Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.