214-99-640-01-670800 Mill-Max Manufacturing Corp.
Виробник: Mill-Max Manufacturing Corp.Description: CONN IC DIP SOCKET 40POS TINLEAD
Features: Closed Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 147 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 319.12 грн |
| 10+ | 260.78 грн |
| 30+ | 241.32 грн |
| 50+ | 218.44 грн |
| 100+ | 208.01 грн |
Відгуки про товар
Написати відгук
Технічний опис 214-99-640-01-670800 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS TINLEAD, Features: Closed Frame, Packaging: Tube, Mounting Type: Surface Mount, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 40 (2 x 20), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Інші пропозиції 214-99-640-01-670800
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 214-99-640-01-670800 | Виробник : Mill-Max |
IC & Component Sockets 40P SMD IC SOCKET |
товару немає в наявності |