Технічний опис 2200-6321-9UA-1902 3M Interconnect Solutions
Description: TEXTOOLTEST & BURN-IN PGA KIT SO, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 200 (21 x 21), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції 2200-6321-9UA-1902
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 2200-6321-9UA-1902 | Виробник : 3M Interconnect Solutions | 2200-6321-9UA-1902 |
товару немає в наявності |
||
| 2200-6321-9UA-1902 | Виробник : 3M |
Description: TEXTOOLTEST & BURN-IN PGA KIT SO Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 200 (21 x 21) Termination: Solder Housing Material: Polyethersulfone (PES) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
товару немає в наявності |