Продукція > ARIES ELECTRONICS > 225-PLS15001-16

225-PLS15001-16 Aries Electronics

10004-pga-zif-test-and-burn-in-socket.pdf Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
Відгуки про товар
Написати відгук

Технічний опис 225-PLS15001-16 Aries Electronics

Description: CONN SOCKET PGA ZIF GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Operating Temperature: -65°C ~ 200°C, Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Nickel Bronze, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.

Інші пропозиції 225-PLS15001-16

Фото Назва Виробник Інформація Доступність
Ціна
225-PLS15001-16 Виробник : Aries Electronics aress01167_1-2262175.pdf IC & Component Sockets 225P PGA TEST SOCKET
товару немає в наявності
В кошику  од. на суму  грн.