2256-6321-9UA-1902 3M Interconnect Solutions
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Технічний опис 2256-6321-9UA-1902 3M Interconnect Solutions
Description: GRID ZIP 21 X 21, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 256 (21 x 21), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.
Інші пропозиції 2256-6321-9UA-1902
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 2256-6321-9UA-1902 | Виробник : 3M Interconnect Solutions |
 JE150906988 2256-6321-9UA-1902= GRID ZIP(21X21) |
товару немає в наявності |
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2256-6321-9UA-1902 | Виробник : 3M |
Description: GRID ZIP 21 X 21 Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 256 (21 x 21) Termination: Solder Housing Material: Polyethersulfone (PES) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Obsolete |
товару немає в наявності |