24-3551-10 Aries Electronics
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Termination: Solder
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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Технічний опис 24-3551-10 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN, Termination: Solder, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Number of Positions or Pins (Grid): 24 (2 x 12), Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції 24-3551-10
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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24-3551-10 | Виробник : Aries Electronics |
IC & Component Sockets DIP TEST SCKT TIN 24 PINS |
товару немає в наявності |