28-516-10 Aries Electronics

Description: CONN IC DIP SOCKET ZIF 28POS TIN, Features: Closed Frame, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 28 (2 x 14), Type: DIP, ZIF (ZIP), Packaging: Bulk, Mounting Type: Through Hole, Part Status: Obsolete, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Tin.