2910058 Loctite
Виробник: Loctite
Henkel Epoxy, Heat Cure, for Circuit Board Underfill Application, 30ml Syringe, LOCTITE Eccobond UF 3832 Series
Henkel Epoxy, Heat Cure, for Circuit Board Underfill Application, 30ml Syringe, LOCTITE Eccobond UF 3832 Series
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Технічний опис 2910058 Loctite
Henkel Epoxy, Heat Cure, for Circuit Board Underfill Application, 30ml Syringe, LOCTITE Eccobond UF 3832 Series.