3-1571550-0 TE Connectivity AMP Connectors
Виробник: TE Connectivity AMP ConnectorsDescription: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 174 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 749.65 грн |
| 15+ | 578.97 грн |
| 30+ | 547.17 грн |
| 60+ | 485.35 грн |
| 105+ | 463.79 грн |
Відгуки про товар
Написати відгук
Технічний опис 3-1571550-0 TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 32POS GOLD, Packaging: Tube, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 25.0µin (0.63µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції 3-1571550-0
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
3-1571550-0 | Виробник : TE Connectivity |
Conn DIP Socket SKT 32 POS 2.54mm Solder ST Thru-Hole Box/Tube |
товару немає в наявності |