Виробник: Rosenberger
Washers split lock washer

Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 98
DigiKey Programmable: Not Verified

Виробник: Apex Tool Group
Description: DESOLDERING SOLDER IRON 120W 24V
Power (Watts): 120W
Features: Threadless Nozzles
Packaging: Bulk
For Use With/Related Products: WR Series
Voltage - Input: 24V
Type: Iron, Desoldering
Tip Type: XDS
Workstand: Not Included
Tip Temperature: 200°F ~ 850°F (93°C ~ 454°C)

Виробник: Weller
Desoldering Braid / Solder Removal DSX 120 DESOLDERING IRON

Виробник: Hirose Electric Co Ltd
Description: CONN FFC BOTTOM 26POS 0.5MM R/A
Packaging: Tape & Reel (TR)
Contact Finish: Gold
Mounting Type: Surface Mount, Right Angle
Number of Positions: 26
Pitch: 0.020" (0.50mm)
Operating Temperature: -40°C ~ 105°C
Termination: Solder
Height Above Board: 0.079" (2.00mm)
Locking Feature: Flip Lock
Material Flammability Rating: UL94 V-0
Actuator Material: Liquid Crystal Polymer (LCP), Halogen Free
Contact Material: Phosphor Bronze
FFC, FCB Thickness: 0.30mm
Housing Material: Liquid Crystal Polymer (LCP), Halogen Free
Cable End Type: Tabbed
Flat Flex Type: FFC, FPC
Connector/Contact Type: Contacts, Bottom
Part Status: Active

Виробник: Hirose Connector
FFC & FPC Connectors

Виробник: NXP Semiconductors
ARM Microcontrollers - MCU KINETIS 256KFLEX USB LCD

Виробник: Panduit Corp
Description: KEYED COPPER PATCH CORD, CAT 5E,
Packaging: Bulk