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342947

342947 Boyd Laconia, LLC

Board-Level-Cooling-Square-Skived-Fin.pdf Виробник: Boyd Laconia, LLC
Description: COPPER HEATSINK 57.9X59X11MM
Packaging: Tray
Material: Copper
Length: 2.323" (59.00mm)
Shape: Rectangular, Fins
Type: Top Mount, Skived
Width: 2.280" (57.91mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.70°C/W
Fin Height: 0.433" (11.00mm)
Material Finish: AavSHIELD 3C
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Технічний опис 342947 Boyd Laconia, LLC

Description: COPPER HEATSINK 57.9X59X11MM, Packaging: Tray, Material: Copper, Length: 2.323" (59.00mm), Shape: Rectangular, Fins, Type: Top Mount, Skived, Width: 2.280" (57.91mm), Package Cooled: BGA, Attachment Method: Push Pin, Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM, Thermal Resistance @ Natural: 7.70°C/W, Fin Height: 0.433" (11.00mm), Material Finish: AavSHIELD 3C.