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342950

342950 Boyd Laconia, LLC

Board-Level-Cooling-Square-Skived-Fin.pdf Виробник: Boyd Laconia, LLC
Description: COPPER HEATSINK 90X90X10MM
Packaging: Tray
Material: Copper
Length: 3.543" (90.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.543" (90.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: AavSHIELD 3C
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Технічний опис 342950 Boyd Laconia, LLC

Description: COPPER HEATSINK 90X90X10MM, Packaging: Tray, Material: Copper, Length: 3.543" (90.00mm), Shape: Square, Fins, Type: Top Mount, Skived, Width: 3.543" (90.00mm), Package Cooled: BGA, Attachment Method: Push Pin, Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM, Thermal Resistance @ Natural: 4.50°C/W, Fin Height: 0.394" (10.00mm), Material Finish: AavSHIELD 3C.