4-1571552-4

4-1571552-4 TE Connectivity


1708pgurl_4-1571552-4rqpn4-1571552-4.pdf Виробник: TE Connectivity
Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole Box/Tube
товару немає в наявності

В кошику  од. на суму  грн.
Відгуки про товар
Написати відгук

Технічний опис 4-1571552-4 TE Connectivity

Description: CONN IC DIP SOCKET 16POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 20.0µin (0.51µm), Contact Material - Post: Copper.

Інші пропозиції 4-1571552-4

Фото Назва Виробник Інформація Доступність
Ціна
4-1571552-4 4-1571552-4 Виробник : TE Connectivity AMP Connectors DDEController?Action=srchrtrv&DocNm=1571552&DocType=Customer+Drawing&DocLang=English Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Copper
товару немає в наявності
В кошику  од. на суму  грн.