45214-200230 3M
Виробник: 3MDescription: CONN HEADER SMD 14POS 1.27MM
Features: Keying Slot, Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 125V
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 14
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -65°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.222" (5.65mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
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Технічний опис 45214-200230 3M
Description: CONN HEADER SMD 14POS 1.27MM, Features: Keying Slot, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 125V, Current Rating (Amps): 1A, Mounting Type: Surface Mount, Number of Positions: 14, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -65°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.222" (5.65mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm).
Інші пропозиції 45214-200230
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
|
45214-200230 | Виробник : 3M Electronic Solutions Division |
Headers & Wire Housings 14P, .050" Pitch HDR SMT, 30Au, NO LTCH |
товару немає в наявності |
