51631 QOLTEC
Виробник: QOLTEC
Category: Heat conductive compounds
Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 1g
Type of chemical agent: heat transfer paste
Colour: white
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 1.42W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 1g
Thermal resistance: max. 0.249°C/W
Category: Heat conductive compounds
Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 1g
Type of chemical agent: heat transfer paste
Colour: white
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 1.42W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 1g
Thermal resistance: max. 0.249°C/W
на замовлення 81 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 6+ | 74.33 грн |
| 10+ | 69.54 грн |
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Технічний опис 51631 QOLTEC
Category: Heat conductive compounds, Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 1g, Type of chemical agent: heat transfer paste, Colour: white, Agent features: easy aplication; perfect insulation; thermally conductive, Thermal conductivity: 1.42W/mK, Kind of package: syringe, Application: filling joints and micro-gaps between the processor and the base of the cooling system, Net weight: 1g, Thermal resistance: max. 0.249°C/W, кількість в упаковці: 1 шт.
Інші пропозиції 51631 за ціною від 83.44 грн до 92.63 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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51631 | Виробник : QOLTEC |
Category: Heat conductive compounds Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 1g Type of chemical agent: heat transfer paste Colour: white Agent features: easy aplication; perfect insulation; thermally conductive Thermal conductivity: 1.42W/mK Kind of package: syringe Application: filling joints and micro-gaps between the processor and the base of the cooling system Net weight: 1g Thermal resistance: max. 0.249°C/W кількість в упаковці: 1 шт |
на замовлення 81 шт: термін постачання 14-21 дні (днів) |
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