51633 QOLTEC
Виробник: QOLTEC
Category: Heat conductive compounds
Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g
Type of chemical agent: heat transfer paste
Colour: white
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 1.42W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 30g
Operating temperature: -30...280°C
Thermal resistance: max. 0.249°C/W
Category: Heat conductive compounds
Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g
Type of chemical agent: heat transfer paste
Colour: white
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 1.42W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 30g
Operating temperature: -30...280°C
Thermal resistance: max. 0.249°C/W
на замовлення 199 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 204.00 грн |
| 5+ | 179.04 грн |
| 10+ | 166.25 грн |
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Технічний опис 51633 QOLTEC
Category: Heat conductive compounds, Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g, Type of chemical agent: heat transfer paste, Colour: white, Agent features: easy aplication; perfect insulation; thermally conductive, Thermal conductivity: 1.42W/mK, Kind of package: syringe, Application: filling joints and micro-gaps between the processor and the base of the cooling system, Net weight: 30g, Operating temperature: -30...280°C, Thermal resistance: max. 0.249°C/W, кількість в упаковці: 1 шт.
Інші пропозиції 51633 за ціною від 199.50 грн до 244.80 грн
| Фото | Назва | Виробник | Інформація |
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51633 | Виробник : QOLTEC |
Category: Heat conductive compounds Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g Type of chemical agent: heat transfer paste Colour: white Agent features: easy aplication; perfect insulation; thermally conductive Thermal conductivity: 1.42W/mK Kind of package: syringe Application: filling joints and micro-gaps between the processor and the base of the cooling system Net weight: 30g Operating temperature: -30...280°C Thermal resistance: max. 0.249°C/W кількість в упаковці: 1 шт |
на замовлення 199 шт: термін постачання 14-21 дні (днів) |
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