51633 QOLTEC
Виробник: QOLTEC
Category: Heat conductive compounds
Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g
Colour: white
Operating temperature: -30...280°C
Agent features: easy aplication; perfect insulation; thermally conductive
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Type of chemical agent: heat transfer paste
Kind of package: syringe
Thermal resistance: max. 0.249°C/W
Thermal conductivity: 1.42W/mK
Net weight: 30g
Category: Heat conductive compounds
Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g
Colour: white
Operating temperature: -30...280°C
Agent features: easy aplication; perfect insulation; thermally conductive
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Type of chemical agent: heat transfer paste
Kind of package: syringe
Thermal resistance: max. 0.249°C/W
Thermal conductivity: 1.42W/mK
Net weight: 30g
на замовлення 112 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 211.07 грн |
| 5+ | 185.33 грн |
| 10+ | 173.03 грн |
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Технічний опис 51633 QOLTEC
Category: Heat conductive compounds, Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g, Colour: white, Operating temperature: -30...280°C, Agent features: easy aplication; perfect insulation; thermally conductive, Application: filling joints and micro-gaps between the processor and the base of the cooling system, Type of chemical agent: heat transfer paste, Kind of package: syringe, Thermal resistance: max. 0.249°C/W, Thermal conductivity: 1.42W/mK, Net weight: 30g, кількість в упаковці: 1 шт.
Інші пропозиції 51633 за ціною від 207.64 грн до 253.28 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||||
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+1 |
51633 | Виробник : QOLTEC |
Category: Heat conductive compounds Description: Heat transfer paste; white; 1.42W/mK; max.0.249°C/W; 30g Colour: white Operating temperature: -30...280°C Agent features: easy aplication; perfect insulation; thermally conductive Application: filling joints and micro-gaps between the processor and the base of the cooling system Type of chemical agent: heat transfer paste Kind of package: syringe Thermal resistance: max. 0.249°C/W Thermal conductivity: 1.42W/mK Net weight: 30g кількість в упаковці: 1 шт |
на замовлення 112 шт: термін постачання 7-14 дні (днів) |
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