51639 QOLTEC
Виробник: QOLTEC
Category: Heat conductive compounds
Description: Heat transfer paste; grey; 1.93W/mK; max.0.225°C/W; 100g
Type of chemical agent: heat transfer paste
Colour: grey
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 1.93W/mK
Kind of package: tube
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 0.1kg
Thermal resistance: max. 0.225°C/W
Category: Heat conductive compounds
Description: Heat transfer paste; grey; 1.93W/mK; max.0.225°C/W; 100g
Type of chemical agent: heat transfer paste
Colour: grey
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 1.93W/mK
Kind of package: tube
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 0.1kg
Thermal resistance: max. 0.225°C/W
на замовлення 60 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 725.62 грн |
| 5+ | 636.22 грн |
| 10+ | 598.66 грн |
Відгуки про товар
Написати відгук
Технічний опис 51639 QOLTEC
Category: Heat conductive compounds, Description: Heat transfer paste; grey; 1.93W/mK; max.0.225°C/W; 100g, Type of chemical agent: heat transfer paste, Colour: grey, Agent features: easy aplication; perfect insulation; thermally conductive, Thermal conductivity: 1.93W/mK, Kind of package: tube, Application: filling joints and micro-gaps between the processor and the base of the cooling system, Net weight: 0.1kg, Thermal resistance: max. 0.225°C/W, кількість в упаковці: 1 шт.
Інші пропозиції 51639 за ціною від 718.39 грн до 870.74 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
+1 |
51639 | Виробник : QOLTEC |
Category: Heat conductive compounds Description: Heat transfer paste; grey; 1.93W/mK; max.0.225°C/W; 100g Type of chemical agent: heat transfer paste Colour: grey Agent features: easy aplication; perfect insulation; thermally conductive Thermal conductivity: 1.93W/mK Kind of package: tube Application: filling joints and micro-gaps between the processor and the base of the cooling system Net weight: 0.1kg Thermal resistance: max. 0.225°C/W кількість в упаковці: 1 шт |
на замовлення 60 шт: термін постачання 14-21 дні (днів) |
|